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By Asma Adhimi
SEMICON Taiwan 2026 is set to return to Taipei in September with record-scale ambitions, reflecting the semiconductor industry’s continued expansion amid booming demand for AI and high-performance computing (HPC). Organizers expect the event to draw more than 100,000 professionals from 65 countries and feature over 1,300 exhibitors across 4,300 booths, both new highs for the show.
For eeNews Europe readers, the event offers a useful snapshot of where the global semiconductor ecosystem is heading, particularly in advanced packaging, smart manufacturing, chiplets, and emerging quantum technologies. The exhibition also highlights how AI is reshaping investment priorities and technology roadmaps across the industry.
SEMICON Taiwan 2026 will take place September 2-4 at the Nangang Exhibition Center in Taipei, with forums beginning on August 31 as part of International Semiconductor Week. The event will focus on the technologies and collaborations needed to support the next phase of semiconductor growth.
According to SEMI, strong market momentum from 2025 has carried into this year. The industry association reported that global semiconductor manufacturing equipment sales reached US$135.1 billion in 2025, a 15% increase year over year, while semiconductor materials sales rose 6.8% to US$73.2 billion.
“SEMI data shows that in 2025 global semiconductor manufacturing equipment sales reached US$135.1 billion, up 15% year-over-year, while global semiconductor materials sales increased to $73.2 billion, up 6.8% year-over-year,” said Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI. “The semiconductor industry has carried this momentum into 2026 driven by AI, high-performance computing, advanced process technologies, and advanced packaging, with Taiwan continuing to be among the regions with the strongest growth outlook. Under the theme Transform Tomorrow, SEMICON Taiwan 2026 will bring together the global ecosystem, from wafer manufacturing, equipment, and materials to IC design, system applications, and startups to address complex industry challenges and shape the next generation of technology.”
A major addition to the 2026 event is the introduction of dedicated areas for quantum technologies and smart manufacturing. The new Quantum Technology Zone will showcase approaches including superconducting systems, ion traps and quantum annealing, highlighting the sector’s transition toward practical applications.
The Smart Fab Zone will examine how semiconductor manufacturing is evolving beyond automation toward intelligent production systems. Technologies on display will include collaborative robots, humanoid robots, automated material handling systems and digital twins.
Meanwhile, a new Chiplet Pavilion within the Packaging Technology Area will focus on chiplet-based architectures for AI servers, data centres, autonomous vehicles, HPC systems and future 6G infrastructure. Exhibits will cover advanced packaging, lithography, bonding technologies and precision semiconductor equipment.
Beyond technology, SEMICON Taiwan 2026 will place significant emphasis on innovation ecosystems and workforce development. The AI Technology Zone will highlight advances in AI chip design, ASIC development and edge AI applications, with a particular focus on balancing performance and energy efficiency.
The Silicon Startups Zone is also expanding through collaboration with teams from the IC Taiwan Grand Challenge, creating opportunities for startups to connect with investors and industry partners. In parallel, the SEMI 20 Under 40 Awards will return for a second year, while a new industry-academia category aims to strengthen talent development across the semiconductor sector.
More than 22 forums are planned, covering topics ranging from advanced packaging and memory technologies to sustainability, cybersecurity, talent development and geopolitics.
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