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TrendForce

[News] ASE Reportedly Raises Advanced Packaging Quotes by More Than 20% in Latest AI-Driven Price Hike [News] Musk’s TeraFab Lands First Major Hire as 18-Year Intel Veteran With 18A Experience Joins as Director [Insights] Memory Spot Price Update: DRAM Spot Prices See Gains in Low-Density DDR4 and DDR3 Amid Sideways Market [News] Passive Component Prices Rise as YAGEO Reportedly Begins Broadest Capacitor Hike in Years on July 1 [News] Intel Reportedly Breaks Ground on Santa Clara Expansion for Next-Gen EUV Mask Capacity [News] World’s First Mass-Production Line for 6-/8-Inch Homoepitaxial Gallium Oxide Wafers Comes Online [News] Samsung Electro-Mechanics Lands KRW 450B 1-Year MLCC Contract as AI Spurs Long-Term Agreements [News] Raw Material Inflation Deepens: FULLTECH Hikes Glass Fiber Cloth Prices Up to 30%; VPEC Adjusts Epi Wafer Prices [News] Samsung Reportedly Restarts 1.4nm Push, Targets 2029 Mass Production to Close Gap with TSMC, Intel [News] ByteDance Reportedly Eyes Next-Gen In-House CPU for 2H27 Mass Production; May Partner With Qualcomm [News] Samsung, SK hynix 800 Trillion Won Expansion Strains Chipmaking Tool Supply, Potentially Pressures TSMC, Intel [News] Goertek-Backed 12-Inch AR Optical Wafer Fab Commenced Production [News] China Signs First Domestic Ultra Wide Bandgap Semiconductor Full-Chain Project [News] Samsung, SK hynix, Micron Face U.S. Class-Action Lawsuit Over Alleged DRAM Supply Manipulation [News] Korea’s High-Purity CO₂ Inventory Reportedly Falls Below One Month; Samsung, SK hynix Under Pressure [News] TSMC’s 2Q Margins Reportedly Near 70% amid Strong 3/5nm Demand, 3Q Revenue Seen Growing Over 10% [Sponsored Content] Where Do You Stand as AI Reshapes Industries? [News] Mapping the Micro LED Optical Interconnect Ecosystem [News] Asian Memory Makers Turn to U.S. Capital Markets: SK hynix and Kioxia Advance ADR Plans [News] Lenovo Reportedly Sees Higher Memory Prices Becoming the New Normal Into 2030 [News] TSMC on Terafab: No Shortcuts in Foundry; Confirms Next-Gen LPU Project amid Samsung Rivalry [News] TSMC N3 Tightens on AI Demand; Arizona 2nd Fab 3nm Volume Production in 2H27, Kumamoto in 2028 [News] TSMC Sees 2Q Sales Up 10% QoQ to $40.2B; Margins Rise to 65.5%–67.5%, Capex at Top End of $52–56B [News] TSMC 1Q26 Net Income Soars 58% YoY to NT$572.5B Record, EPS NT$22.08; Gross Margin Beats Forecast at 66.2% [News] Tesla AI5 Reportedly Uses SK hynix Memory, Samsung LPDDR5X; Samsung SF2T Process Applied Ahead of AI6 [News] TSMC 1Q Profit Seen Up ~50% to Record; Meta–Broadcom AI Chips Reportedly Target 2nm, CoWoS-L in 1H27 [News] San’an Announced Three Advances in Optical Communications Business [News] Intel Reportedly to Brief Staff on TeraFab Involvement in Coming Weeks, While Key Foundry Details Remain Limited [News] ASML Raises 2026 Sales Outlook to €36B–€40B on Memory, Logic Demand; South Korea Share Hits 45% [News] Chinese Startup Dishan Reportedly Develops 2nm AI Chip in Prototype Verification; Foundry Access Uncertain [News] Musk Confirms AI5 Tape-Out, but Wrong TSMC Tag Triggers Social Media Mix-Up [News] China Reportedly Sees Record 2025 Chip Tool Imports from Singapore, Malaysia; U.S. Hit Lowest Since 2017 [Insights] Memory Spot Price Update: DRAM Spot Sellers Hold Firm Ahead of Mid-April Pricing, DDR4 Edges Lower 0.48% [News] HBM4 Strategies Diverge: Samsung Reportedly Chases 80% 1c DRAM Yield While SK hynix Trims Shipments by 30% [News] Korea Challenges Intel on Glass Substrate Standards as Absolics, Samsung Accelerate Commercialization [Insights] NVIDIA’s US$2B Marvell Deal: What’s the Strategic Significance for CPO and AI Interconnects? 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[News] Samsung 2nm Yields Reportedly at ~55%, Below Mass Production Threshold; Qualcomm May Opt for TSMC
TrendForce · 2026-04-14 · via TrendForce

Samsung’s 2nm yield challenges are resurfacing. According to Busan Ilbo, sources indicate that Samsung Foundry’s 2nm yields remain in the mid-50% range, falling short of the roughly 60% threshold typically required for stable mass production. After backend processing, effective yields are expected to decline to around 40%. While Samsung has technically entered the 2nm node, industry observers say current yield levels remain insufficient to attract major global tech customers. In contrast, rival TSMC is reportedly achieving a more stable yield range of 60–70% at 2nm, the report adds.

As noted in the report, industry observers view the process as still in a “halfway stage.” With nearly half of wafer input lost to defects, it falls short on both cost competitiveness and delivery stability. Given that a single advanced-node wafer can cost tens of millions of won, even a 1% change in yield can translate into annual operating profit differences ranging from hundreds of billions to trillions of won, posing a significant obstacle to improving the profitability of Samsung’s foundry business.

Customer Traction Remains Limited

On the customer side, Busan Ilbo indicates that Samsung has secured some internal volume and a limited number of external clients, but has yet to win major customers such as Apple, NVIDIA, and AMD. Notably, according to Global Economic, citing sources, while there had been expectations that Qualcomm might engage Samsung, the company has instead selected TSMC’s 2nm (N2P) process for full production of its next-generation flagship Snapdragon 8 Elite 6th Gen.

Still, this does not signal a complete break with Samsung. Global Economic notes that Qualcomm may continue engaging with Samsung to diversify supply, reduce reliance on TSMC, and retain pricing leverage, with Samsung currently supplying 2nm-based Snapdragon prototypes for performance validation. Industry observers also suggest a dual-sourcing strategy remains possible, with Samsung Foundry potentially used for mid- to lower-tier chips rather than flagship models.

Meanwhile, Samsung has secured an order from Tesla for its next-generation autonomous driving chips, AI5 and AI6. Busan Ilbo notes that yield levels at ramp will be a key factor in determining both profitability and supply reliability.

Apart from Tesla, Samsung Foundry has also reportedly secured a new domestic customer. According to The Korean Herald, DeepX has unveiled a physical AI full-stack strategy integrating its proprietary chip technology, hardware platform, and software ecosystem. The company disclosed plans to build next-generation AI infrastructure by mass-producing its DX-M2 chip—based on Samsung Foundry’s 2nm process—in 2027.