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TrendForce

[News] ASE Reportedly Raises Advanced Packaging Quotes by More Than 20% in Latest AI-Driven Price Hike [News] Musk’s TeraFab Lands First Major Hire as 18-Year Intel Veteran With 18A Experience Joins as Director [Insights] Memory Spot Price Update: DRAM Spot Prices See Gains in Low-Density DDR4 and DDR3 Amid Sideways Market [News] Passive Component Prices Rise as YAGEO Reportedly Begins Broadest Capacitor Hike in Years on July 1 [News] Intel Reportedly Breaks Ground on Santa Clara Expansion for Next-Gen EUV Mask Capacity [News] World’s First Mass-Production Line for 6-/8-Inch Homoepitaxial Gallium Oxide Wafers Comes Online [News] Samsung Electro-Mechanics Lands KRW 450B 1-Year MLCC Contract as AI Spurs Long-Term Agreements [News] Raw Material Inflation Deepens: FULLTECH Hikes Glass Fiber Cloth Prices Up to 30%; VPEC Adjusts Epi Wafer Prices [News] Samsung Reportedly Restarts 1.4nm Push, Targets 2029 Mass Production to Close Gap with TSMC, Intel [News] ByteDance Reportedly Eyes Next-Gen In-House CPU for 2H27 Mass Production; May Partner With Qualcomm [News] Samsung, SK hynix 800 Trillion Won Expansion Strains Chipmaking Tool Supply, Potentially Pressures TSMC, Intel [News] Goertek-Backed 12-Inch AR Optical Wafer Fab Commenced Production [News] China Signs First Domestic Ultra Wide Bandgap Semiconductor Full-Chain Project [News] Samsung, SK hynix, Micron Face U.S. Class-Action Lawsuit Over Alleged DRAM Supply Manipulation [News] Korea’s High-Purity CO₂ Inventory Reportedly Falls Below One Month; Samsung, SK hynix Under Pressure [News] TSMC’s 2Q Margins Reportedly Near 70% amid Strong 3/5nm Demand, 3Q Revenue Seen Growing Over 10% [Sponsored Content] Where Do You Stand as AI Reshapes Industries? [News] Mapping the Micro LED Optical Interconnect Ecosystem [News] Asian Memory Makers Turn to U.S. Capital Markets: SK hynix and Kioxia Advance ADR Plans [News] Lenovo Reportedly Sees Higher Memory Prices Becoming the New Normal Into 2030 [News] TSMC N3 Tightens on AI Demand; Arizona 2nd Fab 3nm Volume Production in 2H27, Kumamoto in 2028 [News] TSMC Sees 2Q Sales Up 10% QoQ to $40.2B; Margins Rise to 65.5%–67.5%, Capex at Top End of $52–56B [News] TSMC 1Q26 Net Income Soars 58% YoY to NT$572.5B Record, EPS NT$22.08; Gross Margin Beats Forecast at 66.2% [News] Tesla AI5 Reportedly Uses SK hynix Memory, Samsung LPDDR5X; Samsung SF2T Process Applied Ahead of AI6 [News] TSMC 1Q Profit Seen Up ~50% to Record; Meta–Broadcom AI Chips Reportedly Target 2nm, CoWoS-L in 1H27 [News] San’an Announced Three Advances in Optical Communications Business [News] Intel Reportedly to Brief Staff on TeraFab Involvement in Coming Weeks, While Key Foundry Details Remain Limited [News] ASML Raises 2026 Sales Outlook to €36B–€40B on Memory, Logic Demand; South Korea Share Hits 45% [News] Chinese Startup Dishan Reportedly Develops 2nm AI Chip in Prototype Verification; Foundry Access Uncertain [News] Musk Confirms AI5 Tape-Out, but Wrong TSMC Tag Triggers Social Media Mix-Up [News] China Reportedly Sees Record 2025 Chip Tool Imports from Singapore, Malaysia; U.S. Hit Lowest Since 2017 [Insights] Memory Spot Price Update: DRAM Spot Sellers Hold Firm Ahead of Mid-April Pricing, DDR4 Edges Lower 0.48% [News] HBM4 Strategies Diverge: Samsung Reportedly Chases 80% 1c DRAM Yield While SK hynix Trims Shipments by 30% [News] Korea Challenges Intel on Glass Substrate Standards as Absolics, Samsung Accelerate Commercialization [Insights] NVIDIA’s US$2B Marvell Deal: What’s the Strategic Significance for CPO and AI Interconnects? [News] Samsung Reportedly Lifts HBM4 Logic Die Prices by 40–50% Amid AI Boom; 4nm at Full Capacity [News] Huawei Takes Early Lead in Horizontal Foldable Race vs Samsung and Apple, Eyes April Pura X Max Launch [News] China Reportedly Closes AI Performance Gap with U.S., Stanford Report Says; Anthropic Leads by Just 2.7% [News] Samsung 2nm Yields Reportedly at ~55%, Below Mass Production Threshold; Qualcomm May Opt for TSMC [Insights] Memory Spot Price Update: DDR4 Spot Prices Climb as Samsung Holds EOL Line [News] TSMC May Fast-Track 1.4nm at Central Taiwan Science Park as 2nm Yields Reportedly Beat Expectations [News] Micron Reportedly Weighs Acquiring PSMC 12-Inch Tongluo Fab, With Multiple Partners Also Interested [News] ASUS to Raise Prices on Selected PC Lines from Jan. 5 Amid Memory Cost Surge, Following Dell [News] 2025 Tech Layoffs: Meta, Amazon, Microsoft and Others Cut Tens of Thousands of Roles [News] Sony, Microsoft Reportedly Weigh Delaying Next-Gen Game Consoles Beyond 2028 Amid Memory Price Surge [News] Samsung Reportedly Plans 50% HBM Capacity Surge in 2026, Spotlight on HBM4 [News] China Diversification Reportedly Lifts Mature-Node Foundries UMC, VIS, PSMC Despite Tariff Delay [News] Samsung, SK hynix Escape Worst-Case as China VEU Ends: Annual Review Risks Loom [News] TSMC Advanced-Node Materials Reportedly Found at Lo’s Residence Amid Controversial Intel Hire [News] NVIDIA’s $20B Groq Deal Spotlights SRAM Shift—MediaTek NPU Already On Board [News] Chinese Scientists Achieved New Breakthrough in Next-Gen Optical Computing Chips [News] Five-Year-Old Chinese EDA Firm Univista Sets Sights on IPO, Led by Ex-Synopsys and Cadence Team [News] Samsung Reportedly Pushes In-House CPU and GPU for Exynos 2800 to Cut Qualcomm, AMD Reliance [News] SK hynix Reportedly Plans First U.S. 2.5D Packaging Line, Eyes Turnkey HBM to Challenge TSMC [News] TSMC Reportedly to Raise Sub-3nm Prices 3-10% in 2026, Plans Hikes Through 2029 [News] Samsung Emerges as Potential Second Foundry for NVIDIA Alongside TSMC After Groq Licensing Deal [News] 7.0 Quake Hits: TSMC Nears Full Production, Sector Losses Reportedly Tens of Billions NTD [News] SLC-Based AI SSDs Gain Traction as SK hynix and Kioxia Accelerate Development With NVIDIA [News] NVIDIA Reportedly Denies USD 20B Groq Acquisition Rumors
[News] TSMC on Terafab: No Shortcuts in Foundry; Confirms Next-Gen LPU Project amid Samsung Rivalry
TrendForce · 2026-04-16 · via TrendForce


With Tesla teaming up with Intel on the “Terafab” initiative and accelerating its push into chip manufacturing, attention in the market is turning to how TSMC will respond. At today’s earnings call, chairman C.C. Wei acknowledged that both Intel and Tesla remain TSMC customers, while also calling Intel a “formidable competitor” that should not be underestimated.

As reported by Bloomberg, Elon Musk’s Tesla team is actively reaching out to semiconductor industry suppliers for its “Terafab” project. The report cites sources saying Tesla has contacted major equipment makers including Applied Materials, Tokyo Electron, and Lam Research as it lays the groundwork for its planned wafer fab buildout. Separately, TechNews reports that the outreach has also expanded to Taiwan-based equipment suppliers and fab construction service providers.

Meanwhile, the Terafab initiative has also drawn in its chip manufacturing partner Samsung Electronics, though Samsung is said to have suggested that additional capacity from its under-construction Taylor, Texas fab could be allocated to Tesla instead, Bloomberg notes. The report adds that Musk is targeting the start of silicon chip production around 2029, with plans to ramp up output thereafter.

Still, TSMC’s C.C. Wei struck a cautious tone on execution timelines, stressing that there are no shortcuts in the foundry business. He noted that building a new fab typically takes 2–3 years, followed by another 1–2 years for ramp-up. Against that backdrop, he reiterated confidence in TSMC’s positioning, saying the company will continue to pursue every possible business opportunity.

NVIDIA–Samsung LPU Tie-Up Draws Attention

Notably, C.C.Wei also commented on Samsung’s cooperation with NVIDIA, its largest AI accelerator customer, on the production of LPUs, when an analyst asked whether the emergence of a new LPU design could reshape the competitive landscape for TSMC.

C.C. Wei declined to comment on specific customer products, but said TSMC is already working with its customer on next-generation LPU designs. He reiterated confidence in the company’s technology position and added that TSMC will continue to pursue “every piece of business possible.”

Read more

(Photo credit: SpaceX)

Please note that this article cites information from Bloomberg, TechNews, and TSMC.