惯性聚合 高效追踪和阅读你感兴趣的博客、新闻、科技资讯
阅读原文 在惯性聚合中打开

推荐订阅源

宝玉的分享
宝玉的分享
Engineering at Meta
Engineering at Meta
让小产品的独立变现更简单 - ezindie.com
让小产品的独立变现更简单 - ezindie.com
博客园 - 聂微东
钛媒体:引领未来商业与生活新知
钛媒体:引领未来商业与生活新知
Last Week in AI
Last Week in AI
酷 壳 – CoolShell
酷 壳 – CoolShell
博客园 - 三生石上(FineUI控件)
T
Tailwind CSS Blog
Apple Machine Learning Research
Apple Machine Learning Research
Hugging Face - Blog
Hugging Face - Blog
爱范儿
爱范儿
博客园 - 司徒正美
人人都是产品经理
人人都是产品经理
Jina AI
Jina AI
博客园 - 叶小钗
雷峰网
雷峰网
罗磊的独立博客
OSCHINA 社区最新新闻
OSCHINA 社区最新新闻
博客园 - Franky
WordPress大学
WordPress大学
奇客Solidot–传递最新科技情报
奇客Solidot–传递最新科技情报
阮一峰的网络日志
阮一峰的网络日志
量子位

TrendForce

[News] ASE Reportedly Raises Advanced Packaging Quotes by More Than 20% in Latest AI-Driven Price Hike [News] Musk’s TeraFab Lands First Major Hire as 18-Year Intel Veteran With 18A Experience Joins as Director [Insights] Memory Spot Price Update: DRAM Spot Prices See Gains in Low-Density DDR4 and DDR3 Amid Sideways Market [News] Intel Reportedly Breaks Ground on Santa Clara Expansion for Next-Gen EUV Mask Capacity [News] World’s First Mass-Production Line for 6-/8-Inch Homoepitaxial Gallium Oxide Wafers Comes Online [News] Samsung Electro-Mechanics Lands KRW 450B 1-Year MLCC Contract as AI Spurs Long-Term Agreements [News] Raw Material Inflation Deepens: FULLTECH Hikes Glass Fiber Cloth Prices Up to 30%; VPEC Adjusts Epi Wafer Prices [News] Samsung Reportedly Restarts 1.4nm Push, Targets 2029 Mass Production to Close Gap with TSMC, Intel [News] ByteDance Reportedly Eyes Next-Gen In-House CPU for 2H27 Mass Production; May Partner With Qualcomm [News] Samsung, SK hynix 800 Trillion Won Expansion Strains Chipmaking Tool Supply, Potentially Pressures TSMC, Intel [News] Goertek-Backed 12-Inch AR Optical Wafer Fab Commenced Production [News] China Signs First Domestic Ultra Wide Bandgap Semiconductor Full-Chain Project [News] Samsung, SK hynix, Micron Face U.S. Class-Action Lawsuit Over Alleged DRAM Supply Manipulation [News] Korea’s High-Purity CO₂ Inventory Reportedly Falls Below One Month; Samsung, SK hynix Under Pressure [News] TSMC’s 2Q Margins Reportedly Near 70% amid Strong 3/5nm Demand, 3Q Revenue Seen Growing Over 10% [Sponsored Content] Where Do You Stand as AI Reshapes Industries? [News] Mapping the Micro LED Optical Interconnect Ecosystem [News] Asian Memory Makers Turn to U.S. Capital Markets: SK hynix and Kioxia Advance ADR Plans [News] Lenovo Reportedly Sees Higher Memory Prices Becoming the New Normal Into 2030 [News] TSMC on Terafab: No Shortcuts in Foundry; Confirms Next-Gen LPU Project amid Samsung Rivalry [News] TSMC N3 Tightens on AI Demand; Arizona 2nd Fab 3nm Volume Production in 2H27, Kumamoto in 2028 [News] TSMC Sees 2Q Sales Up 10% QoQ to $40.2B; Margins Rise to 65.5%–67.5%, Capex at Top End of $52–56B [News] TSMC 1Q26 Net Income Soars 58% YoY to NT$572.5B Record, EPS NT$22.08; Gross Margin Beats Forecast at 66.2% [News] Tesla AI5 Reportedly Uses SK hynix Memory, Samsung LPDDR5X; Samsung SF2T Process Applied Ahead of AI6 [News] TSMC 1Q Profit Seen Up ~50% to Record; Meta–Broadcom AI Chips Reportedly Target 2nm, CoWoS-L in 1H27 [News] San’an Announced Three Advances in Optical Communications Business [News] Intel Reportedly to Brief Staff on TeraFab Involvement in Coming Weeks, While Key Foundry Details Remain Limited [News] ASML Raises 2026 Sales Outlook to €36B–€40B on Memory, Logic Demand; South Korea Share Hits 45% [News] Chinese Startup Dishan Reportedly Develops 2nm AI Chip in Prototype Verification; Foundry Access Uncertain [News] Musk Confirms AI5 Tape-Out, but Wrong TSMC Tag Triggers Social Media Mix-Up
[News] Passive Component Prices Rise as YAGEO Reportedly ...
TrendForce · 2026-07-01 · via TrendForce


Price increases are spreading across the passive component industry. According to Economic Daily News, sources say YAGEO has notified customers of price increases across its entire capacitor solutions portfolio, effective July 1. The hike covers MLCCs, aluminum electrolytic capacitors, tantalum capacitors, polymer aluminum capacitors, film capacitors, and supercapacitors, marking the company’s broadest price increase in recent years.

Institutional investors cited by the report say capacitors account for about half of YAGEO’s revenue and expect the latest price hike to boost both revenue and profitability while also benefiting other Taiwanese passive component suppliers.

Commercial Times also notes that YAGEO is raising MLCC prices for direct customers for the first time, extending the increase beyond distributors to both contract and spot pricing. Given that direct customers account for more than half of the company’s revenue, the report says the move is expected to provide a meaningful boost to sales.

As for the scale of the increases, Shanghai Securities News, citing industry sources, reports that YAGEO has raised its official prices for capacitor products by around 50%, with even steeper increases in the spot market. The report also notes that spot-market prices have continued to climb since May, with prices for high-end capacitor products rising by as much as nearly tenfold within a month. Delivery delays have also become increasingly common, affecting not only YAGEO but major MLCC brands across the industry.

Cost Pressures Drive Broad Price Hikes

As noted by Economic Daily News, the price hike reflects rising manufacturing costs driven by geopolitical risks, elevated energy prices, and higher raw material costs. The report says YAGEO had previously absorbed these pressures through process optimization and supply chain integration, but ongoing tensions in the Middle East and volatile freight rates have prompted the company to adjust prices.

The increase is also broad in scope. The report adds that it spans YAGEO’s entire capacitor portfolio, covering products used in AI servers, consumer electronics, automotive, industrial, renewable energy, aerospace, power, and energy storage applications.

AI Reshapes the MLCC Market

Meanwhile, institutional investors cited by Economic Daily News note that continued growth in AI servers, high-performance computing (HPC), and electric vehicles is driving both the volume and specifications of high-end passive components. The report says demand for higher-capacitance, higher-voltage, and higher-reliability products is increasing overall capacity consumption.

Commercial Times also notes that as thermal design power (TDP) and power requirements for AI server racks continue to rise, particularly with the fourth-quarter ramp of NVIDIA’s Vera Rubin platform, passive components are playing an increasingly critical role in 800V HVDC power architectures. As a result, passive components have climbed from near the bottom of the bill of materials (BOM) cost ranking to second only to GPUs and memory.

Against this backdrop, Commercial Times further notes that YAGEO is expected to be the largest beneficiary of MLCC order transfers as Murata and Samsung Electro-Mechanics shift capacity toward higher-value AI MLCCs. High-capacitance MLCCs require 500–1,300 layers, compared with 50–100 layers for low-capacitance products, making them more capacity-intensive and reducing yields. With Japanese and South Korean manufacturers already operating at full utilization, the report says supply of conventional MLCCs is becoming increasingly constrained.

Read more

(Photo credit: YAGEO)

Please note that this article cites information from Economic Daily NewsCommercial Times, and Shanghai Securities News.