惯性聚合 高效追踪和阅读你感兴趣的博客、新闻、科技资讯
阅读原文 在惯性聚合中打开

推荐订阅源

V
Visual Studio Blog
OSCHINA 社区最新新闻
OSCHINA 社区最新新闻
N
Netflix TechBlog - Medium
博客园 - 叶小钗
大猫的无限游戏
大猫的无限游戏
S
SegmentFault 最新的问题
V
V2EX
IT之家
IT之家
J
Java Code Geeks
Hacker News - Newest:
Hacker News - Newest: "LLM"
cs.AI updates on arXiv.org
cs.AI updates on arXiv.org
GbyAI
GbyAI
D
Docker
S
Secure Thoughts
Recent Announcements
Recent Announcements
Webroot Blog
Webroot Blog
Application and Cybersecurity Blog
Application and Cybersecurity Blog
云风的 BLOG
云风的 BLOG
博客园_首页
cs.CV updates on arXiv.org
cs.CV updates on arXiv.org
Cyber Security Advisories - MS-ISAC
Cyber Security Advisories - MS-ISAC
Security Archives - TechRepublic
Security Archives - TechRepublic
酷 壳 – CoolShell
酷 壳 – CoolShell
让小产品的独立变现更简单 - ezindie.com
让小产品的独立变现更简单 - ezindie.com
N
News | PayPal Newsroom
S
Security @ Cisco Blogs
I
InfoQ
Last Week in AI
Last Week in AI
SecWiki News
SecWiki News
钛媒体:引领未来商业与生活新知
钛媒体:引领未来商业与生活新知
W
WeLiveSecurity
T
Troy Hunt's Blog
Recent Commits to openclaw:main
Recent Commits to openclaw:main
H
Hackread – Cybersecurity News, Data Breaches, AI and More
Attack and Defense Labs
Attack and Defense Labs
美团技术团队
T
The Blog of Author Tim Ferriss
Google DeepMind News
Google DeepMind News
Martin Fowler
Martin Fowler
B
Blog
CTFtime.org: upcoming CTF events
CTFtime.org: upcoming CTF events
Scott Helme
Scott Helme
T
Tor Project blog
Know Your Adversary
Know Your Adversary
有赞技术团队
有赞技术团队
Hugging Face - Blog
Hugging Face - Blog
Recorded Future
Recorded Future
C
Cyber Attacks, Cyber Crime and Cyber Security
AI
AI
G
Google Developers Blog

TrendForce

[News] ASE Reportedly Raises Advanced Packaging Quotes by More Than 20% in Latest AI-Driven Price Hike [News] Musk’s TeraFab Lands First Major Hire as 18-Year Intel Veteran With 18A Experience Joins as Director [Insights] Memory Spot Price Update: DRAM Spot Prices See Gains in Low-Density DDR4 and DDR3 Amid Sideways Market [News] Passive Component Prices Rise as YAGEO Reportedly Begins Broadest Capacitor Hike in Years on July 1 [News] Intel Reportedly Breaks Ground on Santa Clara Expansion for Next-Gen EUV Mask Capacity [News] World’s First Mass-Production Line for 6-/8-Inch Homoepitaxial Gallium Oxide Wafers Comes Online [News] Samsung Electro-Mechanics Lands KRW 450B 1-Year MLCC Contract as AI Spurs Long-Term Agreements [News] Raw Material Inflation Deepens: FULLTECH Hikes Glass Fiber Cloth Prices Up to 30%; VPEC Adjusts Epi Wafer Prices [News] Samsung Reportedly Restarts 1.4nm Push, Targets 2029 Mass Production to Close Gap with TSMC, Intel [News] ByteDance Reportedly Eyes Next-Gen In-House CPU for 2H27 Mass Production; May Partner With Qualcomm [News] Samsung, SK hynix 800 Trillion Won Expansion Strains Chipmaking Tool Supply, Potentially Pressures TSMC, Intel [News] Goertek-Backed 12-Inch AR Optical Wafer Fab Commenced Production [News] China Signs First Domestic Ultra Wide Bandgap Semiconductor Full-Chain Project [News] Samsung, SK hynix, Micron Face U.S. Class-Action Lawsuit Over Alleged DRAM Supply Manipulation [News] Korea’s High-Purity CO₂ Inventory Reportedly Falls Below One Month; Samsung, SK hynix Under Pressure [News] TSMC’s 2Q Margins Reportedly Near 70% amid Strong 3/5nm Demand, 3Q Revenue Seen Growing Over 10% [Sponsored Content] Where Do You Stand as AI Reshapes Industries? [News] Mapping the Micro LED Optical Interconnect Ecosystem [News] Asian Memory Makers Turn to U.S. Capital Markets: SK hynix and Kioxia Advance ADR Plans [News] Lenovo Reportedly Sees Higher Memory Prices Becoming the New Normal Into 2030 [News] TSMC on Terafab: No Shortcuts in Foundry; Confirms Next-Gen LPU Project amid Samsung Rivalry [News] TSMC N3 Tightens on AI Demand; Arizona 2nd Fab 3nm Volume Production in 2H27, Kumamoto in 2028 [News] TSMC Sees 2Q Sales Up 10% QoQ to $40.2B; Margins Rise to 65.5%–67.5%, Capex at Top End of $52–56B [News] TSMC 1Q26 Net Income Soars 58% YoY to NT$572.5B Record, EPS NT$22.08; Gross Margin Beats Forecast at 66.2% [News] Tesla AI5 Reportedly Uses SK hynix Memory, Samsung LPDDR5X; Samsung SF2T Process Applied Ahead of AI6 [News] TSMC 1Q Profit Seen Up ~50% to Record; Meta–Broadcom AI Chips Reportedly Target 2nm, CoWoS-L in 1H27 [News] San’an Announced Three Advances in Optical Communications Business [News] Intel Reportedly to Brief Staff on TeraFab Involvement in Coming Weeks, While Key Foundry Details Remain Limited [News] Chinese Startup Dishan Reportedly Develops 2nm AI Chip in Prototype Verification; Foundry Access Uncertain [News] Musk Confirms AI5 Tape-Out, but Wrong TSMC Tag Triggers Social Media Mix-Up [News] China Reportedly Sees Record 2025 Chip Tool Imports from Singapore, Malaysia; U.S. Hit Lowest Since 2017 [Insights] Memory Spot Price Update: DRAM Spot Sellers Hold Firm Ahead of Mid-April Pricing, DDR4 Edges Lower 0.48% [News] HBM4 Strategies Diverge: Samsung Reportedly Chases 80% 1c DRAM Yield While SK hynix Trims Shipments by 30% [News] Korea Challenges Intel on Glass Substrate Standards as Absolics, Samsung Accelerate Commercialization [Insights] NVIDIA’s US$2B Marvell Deal: What’s the Strategic Significance for CPO and AI Interconnects? [News] Samsung Reportedly Lifts HBM4 Logic Die Prices by 40–50% Amid AI Boom; 4nm at Full Capacity [News] Huawei Takes Early Lead in Horizontal Foldable Race vs Samsung and Apple, Eyes April Pura X Max Launch [News] China Reportedly Closes AI Performance Gap with U.S., Stanford Report Says; Anthropic Leads by Just 2.7% [News] Samsung 2nm Yields Reportedly at ~55%, Below Mass Production Threshold; Qualcomm May Opt for TSMC [Insights] Memory Spot Price Update: DDR4 Spot Prices Climb as Samsung Holds EOL Line [News] TSMC May Fast-Track 1.4nm at Central Taiwan Science Park as 2nm Yields Reportedly Beat Expectations [News] Micron Reportedly Weighs Acquiring PSMC 12-Inch Tongluo Fab, With Multiple Partners Also Interested [News] ASUS to Raise Prices on Selected PC Lines from Jan. 5 Amid Memory Cost Surge, Following Dell [News] 2025 Tech Layoffs: Meta, Amazon, Microsoft and Others Cut Tens of Thousands of Roles [News] Sony, Microsoft Reportedly Weigh Delaying Next-Gen Game Consoles Beyond 2028 Amid Memory Price Surge [News] Samsung Reportedly Plans 50% HBM Capacity Surge in 2026, Spotlight on HBM4 [News] China Diversification Reportedly Lifts Mature-Node Foundries UMC, VIS, PSMC Despite Tariff Delay [News] Samsung, SK hynix Escape Worst-Case as China VEU Ends: Annual Review Risks Loom [News] TSMC Advanced-Node Materials Reportedly Found at Lo’s Residence Amid Controversial Intel Hire [News] NVIDIA’s $20B Groq Deal Spotlights SRAM Shift—MediaTek NPU Already On Board [News] Chinese Scientists Achieved New Breakthrough in Next-Gen Optical Computing Chips [News] Five-Year-Old Chinese EDA Firm Univista Sets Sights on IPO, Led by Ex-Synopsys and Cadence Team [News] Samsung Reportedly Pushes In-House CPU and GPU for Exynos 2800 to Cut Qualcomm, AMD Reliance [News] SK hynix Reportedly Plans First U.S. 2.5D Packaging Line, Eyes Turnkey HBM to Challenge TSMC [News] TSMC Reportedly to Raise Sub-3nm Prices 3-10% in 2026, Plans Hikes Through 2029 [News] Samsung Emerges as Potential Second Foundry for NVIDIA Alongside TSMC After Groq Licensing Deal [News] 7.0 Quake Hits: TSMC Nears Full Production, Sector Losses Reportedly Tens of Billions NTD [News] SLC-Based AI SSDs Gain Traction as SK hynix and Kioxia Accelerate Development With NVIDIA [News] NVIDIA Reportedly Denies USD 20B Groq Acquisition Rumors
[News] ASML Raises 2026 Sales Outlook to €36B–€40B on Memory, Logic Demand; South Korea Share Hits 45%
TrendForce · 2026-04-15 · via TrendForce


Amid an AI-driven capex upcycle among memory and logic customers, ASML has raised its 2026 revenue outlook. The Dutch chipmaking tool giant now expects sales to reach €36 billion to €40 billion (US$42–47 billion), up from its previous forecast of €34 billion to €39 billion, with a gross margin between 51% and 53%, according to its press release.

As noted by Bloomberg, to meet surging demand, ASML’s key customers—including TSMC and Samsung Electronics—are ramping up production investments. TSMC in January signaled capital expenditure of up to US$56 billion for this year, while SK hynix has mapped out plans to spend roughly US$8 billion on ASML’s advanced tools under an agreement extending through 2027, the report adds.

In an Investing.com transcript, Christophe Fouquet, CEO of ASML, said both memory—particularly DRAM—and advanced logic customers are continuing to ramp adoption of EUV as well as immersion lithography tools. He added that much of this demand is backed by long-term commitments from their customers’ end clients, in line with recent moves by Samsung Electronics and SK hynix to secure multi-year supply agreements with major cloud service providers.

South Korea Demand Surges as China Weakens

According to CNBC, ASML reported stronger-than-expected first-quarter results, with net sales reaching €8.8 billion (US$10.4 billion), ahead of the €8.5 billion consensus forecast from LSEG. Net profit came in at €2.8 billion, also beating expectations of €2.5 billion. The results landed toward the upper end of the company’s previously guided range of €8.2 billion to €8.9 billion in quarterly revenue, the report suggests.

Notably, ASML saw a sharp increase in South Korea demand, with the region contributing 45% of its Q1 sales, up from 22% in 4Q25. According to SeDaily, Samsung is ramping up lithography capacity through a large-scale equipment order, securing around 20 EUV systems from ASML for sub-10nm advanced process nodes. Including DUV tools, total lithography orders reach roughly 70 units, mainly destined for its Pyeongtaek P5 Line 1 fab, the report adds.

Another South Korean memory giant, SK hynix, will secure EUV lithography equipment from ASML worth approximately 12 trillion won over a two-year period, The Elec reports, adding that the order is understood to cover about 24 EUV systems, based on industry estimates of roughly 500 billion won per unit.

On the other hand, China accounted for just 19% of ASML’s 1Q26 sales, down sharply from 36% in 4Q25.

As noted by Bloomberg, ASML is facing intensifying geopolitical pressure in China—its largest market last year—after U.S. lawmakers earlier this month proposed tighter export controls on all immersion deep ultraviolet (DUV) lithography tools, along with restrictions that would bar engineers from servicing equipment at certain Chinese facilities.

According to TradingView, China accounted for around 33% of ASML’s 2025 sales, but forecast that the contribution would fall to roughly 20% in 2026 amid escalating geopolitical restrictions.

Read more

(Photo credit: ASML)

Please note that this article cites information from BloombergInvesting.comCNBCSeDaily,The Elec, TradingView, and ASML.