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TrendForce

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[News] Mapping the Micro LED Optical Interconnect Ecosystem [News] Asian Memory Makers Turn to U.S. Capital Markets: SK hynix and Kioxia Advance ADR Plans [News] Lenovo Reportedly Sees Higher Memory Prices Becoming the New Normal Into 2030 [News] TSMC on Terafab: No Shortcuts in Foundry; Confirms Next-Gen LPU Project amid Samsung Rivalry [News] TSMC N3 Tightens on AI Demand; Arizona 2nd Fab 3nm Volume Production in 2H27, Kumamoto in 2028 [News] TSMC Sees 2Q Sales Up 10% QoQ to $40.2B; Margins Rise to 65.5%–67.5%, Capex at Top End of $52–56B [News] TSMC 1Q26 Net Income Soars 58% YoY to NT$572.5B Record, EPS NT$22.08; Gross Margin Beats Forecast at 66.2% [News] Tesla AI5 Reportedly Uses SK hynix Memory, Samsung LPDDR5X; Samsung SF2T Process Applied Ahead of AI6 [News] TSMC 1Q Profit Seen Up ~50% to Record; Meta–Broadcom AI Chips Reportedly Target 2nm, CoWoS-L in 1H27 [News] San’an Announced Three Advances in Optical Communications Business [News] Intel Reportedly to Brief Staff on TeraFab Involvement in Coming Weeks, While Key Foundry Details Remain Limited [News] ASML Raises 2026 Sales Outlook to €36B–€40B on Memory, Logic Demand; South Korea Share Hits 45% [News] Chinese Startup Dishan Reportedly Develops 2nm AI Chip in Prototype Verification; Foundry Access Uncertain [News] Musk Confirms AI5 Tape-Out, but Wrong TSMC Tag Triggers Social Media Mix-Up [News] China Reportedly Sees Record 2025 Chip Tool Imports from Singapore, Malaysia; U.S. Hit Lowest Since 2017 [Insights] Memory Spot Price Update: DRAM Spot Sellers Hold Firm Ahead of Mid-April Pricing, DDR4 Edges Lower 0.48% [News] HBM4 Strategies Diverge: Samsung Reportedly Chases 80% 1c DRAM Yield While SK hynix Trims Shipments by 30% [News] Korea Challenges Intel on Glass Substrate Standards as Absolics, Samsung Accelerate Commercialization [Insights] NVIDIA’s US$2B Marvell Deal: What’s the Strategic Significance for CPO and AI Interconnects? 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[News] Samsung Electro-Mechanics Lands KRW 450B 1-Year MLCC Contract as AI Spurs Long-Term Agreements
TrendForce · 2026-07-01 · via TrendForce


The trend toward long-term supply agreements is expanding beyond memory, with tightening MLCC supply prompting major tech companies to secure component availability. According to ZDNet, Samsung Electro-Mechanics has signed a one-year supply contract with a major customer for multilayer ceramic capacitors (MLCCs) used in AI servers.

As noted by Global Economic News, Samsung Electro-Mechanics announced on June 30 a KRW 450 billion (USD 330 million) supply agreement with a global big tech customer for AI server MLCCs. The contract will run for one year, from January 1 through December 31, 2027.

ZDNet highlights that such long-term agreements are rare in the MLCC industry, where short-term orders are the norm, signaling structurally stronger demand for high-performance MLCCs. While Samsung Electro-Mechanics did not disclose the customer’s identity, industry sources believe the agreement is with one of North America’s leading cloud service providers (CSPs), the report adds.

Following the agreement, Samsung Electro-Mechanics is also in talks with its global customer and other major technology companies to expand supply beyond 2027, ZDNet reports.

Samsung Electro-Mechanics is a leading supplier in the high-end MLCC market. According to Global Economic News, Samsung Electro-Mechanics currently holds 25% of the global MLCC market. In the technologically demanding AI server MLCC segment, however, the company has secured more than a 40% market share.

MLCC Demand Accelerates With AI Servers

The growing adoption of AI servers is further boosting demand for high-performance MLCCs. According to ZDNet, AI servers typically require more than 10 times as many MLCCs as conventional servers. A single GPU generally contains over 20,000 MLCCs, while a server rack can use as many as 600,000, the report notes.

According to TrendForce, the AI arms race among global CSPs is accelerating the adoption of in-house ASIC accelerators, which increasingly rely on small-form-factor, high-capacitance, high-temperature-resistant MLCCs. TrendForce expects multiple demand drivers to converge between late 3Q and early 4Q, potentially turning a latent supply risk into a tangible shortage.

Yonhap News notes that as the MLCC market becomes increasingly supplier-driven, the pricing power of major manufacturers—including Samsung Electro-Mechanics, Japan’s Murata, TDK, and Taiyo Yuden—is strengthening. The report adds that prices for some MLCC products have already increased, while long-term supply agreements (LTAs) are gaining traction.

Long-Term Silicon Capacitor Supply Agreements

The rapid growth of AI semiconductors is also lifting demand for related components, making long-term supply agreements an increasingly common way to secure stable supply. As reported by ZDNet, Samsung Electro-Mechanics also signed a KRW 1.5 trillion long-term silicon capacitor supply agreement with a major global company on May 20. The two-year contract runs from January 1, 2027, through December 31, 2028.

Read more

(Photo credit: Samsung Electro-Mechanics)

Please note that this article cites information from ZDNetGlobal Economic News, and Yonhap News.