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TrendForce

[News] ASE Reportedly Raises Advanced Packaging Quotes by More Than 20% in Latest AI-Driven Price Hike [News] Musk’s TeraFab Lands First Major Hire as 18-Year Intel Veteran With 18A Experience Joins as Director [Insights] Memory Spot Price Update: DRAM Spot Prices See Gains in Low-Density DDR4 and DDR3 Amid Sideways Market [News] Passive Component Prices Rise as YAGEO Reportedly Begins Broadest Capacitor Hike in Years on July 1 [News] Intel Reportedly Breaks Ground on Santa Clara Expansion for Next-Gen EUV Mask Capacity [News] World’s First Mass-Production Line for 6-/8-Inch Homoepitaxial Gallium Oxide Wafers Comes Online [News] Samsung Electro-Mechanics Lands KRW 450B 1-Year MLCC Contract as AI Spurs Long-Term Agreements [News] Raw Material Inflation Deepens: FULLTECH Hikes Glass Fiber Cloth Prices Up to 30%; VPEC Adjusts Epi Wafer Prices [News] Samsung Reportedly Restarts 1.4nm Push, Targets 2029 Mass Production to Close Gap with TSMC, Intel [News] ByteDance Reportedly Eyes Next-Gen In-House CPU for 2H27 Mass Production; May Partner With Qualcomm [News] Samsung, SK hynix 800 Trillion Won Expansion Strains Chipmaking Tool Supply, Potentially Pressures TSMC, Intel [News] Goertek-Backed 12-Inch AR Optical Wafer Fab Commenced Production [News] China Signs First Domestic Ultra Wide Bandgap Semiconductor Full-Chain Project [News] Samsung, SK hynix, Micron Face U.S. Class-Action Lawsuit Over Alleged DRAM Supply Manipulation [News] Korea’s High-Purity CO₂ Inventory Reportedly Falls Below One Month; Samsung, SK hynix Under Pressure [News] TSMC’s 2Q Margins Reportedly Near 70% amid Strong 3/5nm Demand, 3Q Revenue Seen Growing Over 10% [Sponsored Content] Where Do You Stand as AI Reshapes Industries? [News] Mapping the Micro LED Optical Interconnect Ecosystem [News] Asian Memory Makers Turn to U.S. Capital Markets: SK hynix and Kioxia Advance ADR Plans [News] Lenovo Reportedly Sees Higher Memory Prices Becoming the New Normal Into 2030 [News] TSMC N3 Tightens on AI Demand; Arizona 2nd Fab 3nm Volume Production in 2H27, Kumamoto in 2028 [News] TSMC Sees 2Q Sales Up 10% QoQ to $40.2B; Margins Rise to 65.5%–67.5%, Capex at Top End of $52–56B [News] TSMC 1Q26 Net Income Soars 58% YoY to NT$572.5B Record, EPS NT$22.08; Gross Margin Beats Forecast at 66.2% [News] Tesla AI5 Reportedly Uses SK hynix Memory, Samsung LPDDR5X; Samsung SF2T Process Applied Ahead of AI6 [News] TSMC 1Q Profit Seen Up ~50% to Record; Meta–Broadcom AI Chips Reportedly Target 2nm, CoWoS-L in 1H27 [News] San’an Announced Three Advances in Optical Communications Business [News] Intel Reportedly to Brief Staff on TeraFab Involvement in Coming Weeks, While Key Foundry Details Remain Limited [News] ASML Raises 2026 Sales Outlook to €36B–€40B on Memory, Logic Demand; South Korea Share Hits 45% [News] Chinese Startup Dishan Reportedly Develops 2nm AI Chip in Prototype Verification; Foundry Access Uncertain [News] Musk Confirms AI5 Tape-Out, but Wrong TSMC Tag Triggers Social Media Mix-Up
[News] TSMC on Terafab: No Shortcuts in Foundry; Confirms...
TrendForce · 2026-04-16 · via TrendForce


With Tesla teaming up with Intel on the “Terafab” initiative and accelerating its push into chip manufacturing, attention in the market is turning to how TSMC will respond. At today’s earnings call, chairman C.C. Wei acknowledged that both Intel and Tesla remain TSMC customers, while also calling Intel a “formidable competitor” that should not be underestimated.

As reported by Bloomberg, Elon Musk’s Tesla team is actively reaching out to semiconductor industry suppliers for its “Terafab” project. The report cites sources saying Tesla has contacted major equipment makers including Applied Materials, Tokyo Electron, and Lam Research as it lays the groundwork for its planned wafer fab buildout. Separately, TechNews reports that the outreach has also expanded to Taiwan-based equipment suppliers and fab construction service providers.

Meanwhile, the Terafab initiative has also drawn in its chip manufacturing partner Samsung Electronics, though Samsung is said to have suggested that additional capacity from its under-construction Taylor, Texas fab could be allocated to Tesla instead, Bloomberg notes. The report adds that Musk is targeting the start of silicon chip production around 2029, with plans to ramp up output thereafter.

Still, TSMC’s C.C. Wei struck a cautious tone on execution timelines, stressing that there are no shortcuts in the foundry business. He noted that building a new fab typically takes 2–3 years, followed by another 1–2 years for ramp-up. Against that backdrop, he reiterated confidence in TSMC’s positioning, saying the company will continue to pursue every possible business opportunity.

NVIDIA–Samsung LPU Tie-Up Draws Attention

Notably, C.C.Wei also commented on Samsung’s cooperation with NVIDIA, its largest AI accelerator customer, on the production of LPUs, when an analyst asked whether the emergence of a new LPU design could reshape the competitive landscape for TSMC.

C.C. Wei declined to comment on specific customer products, but said TSMC is already working with its customer on next-generation LPU designs. He reiterated confidence in the company’s technology position and added that TSMC will continue to pursue “every piece of business possible.”

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(Photo credit: SpaceX)

Please note that this article cites information from Bloomberg, TechNews, and TSMC.