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TrendForce

[News] TSMC on Terafab: No Shortcuts in Foundry; Confirms Next-Gen LPU Project amid Samsung Rivalry [News] TSMC N3 Tightens on AI Demand; Arizona 2nd Fab 3nm Volume Production in 2H27, Kumamoto in 2028 [News] TSMC Sees 2Q Sales Up 10% QoQ to $40.2B; Margins Rise to 65.5%–67.5%, Capex at Top End of $52–56B [News] TSMC 1Q26 Net Income Soars 58% YoY to NT$572.5B Record, EPS NT$22.08; Gross Margin Beats Forecast at 66.2% [News] Tesla AI5 Reportedly Uses SK hynix Memory, Samsung LPDDR5X; Samsung SF2T Process Applied Ahead of AI6 [News] TSMC 1Q Profit Seen Up ~50% to Record; Meta–Broadcom AI Chips Reportedly Target 2nm, CoWoS-L in 1H27 [News] San’an Announced Three Advances in Optical Communications Business [News] Intel Reportedly to Brief Staff on TeraFab Involvement in Coming Weeks, While Key Foundry Details Remain Limited [News] Musk Confirms AI5 Tape-Out, but Wrong TSMC Tag Triggers Social Media Mix-Up [News] China Reportedly Sees Record 2025 Chip Tool Imports from Singapore, Malaysia; U.S. Hit Lowest Since 2017 [News] ASML Raises 2026 Sales Outlook to €36B–€40B on Memory, Logic Demand; South Korea Share Hits 45% [Insights] Memory Spot Price Update: DRAM Spot Sellers Hold Firm Ahead of Mid-April Pricing, DDR4 Edges Lower 0.48% [News] Chinese Startup Dishan Reportedly Develops 2nm AI Chip in Prototype Verification; Foundry Access Uncertain [News] HBM4 Strategies Diverge: Samsung Reportedly Chases 80% 1c DRAM Yield While SK hynix Trims Shipments by 30% [News] Korea Challenges Intel on Glass Substrate Standards as Absolics, Samsung Accelerate Commercialization [Insights] NVIDIA’s US$2B Marvell Deal: What’s the Strategic Significance for CPO and AI Interconnects? [News] Huawei Takes Early Lead in Horizontal Foldable Race vs Samsung and Apple, Eyes April Pura X Max Launch [News] China Reportedly Closes AI Performance Gap with U.S., Stanford Report Says; Anthropic Leads by Just 2.7% [News] Samsung 2nm Yields Reportedly at ~55%, Below Mass Production Threshold; Qualcomm May Opt for TSMC [News] Samsung Reportedly Lifts HBM4 Logic Die Prices by 40–50% Amid AI Boom; 4nm at Full Capacity [Insights] Memory Spot Price Update: DDR4 Spot Prices Climb as Samsung Holds EOL Line [News] TSMC May Fast-Track 1.4nm at Central Taiwan Science Park as 2nm Yields Reportedly Beat Expectations [News] Micron Reportedly Weighs Acquiring PSMC 12-Inch Tongluo Fab, With Multiple Partners Also Interested [News] ASUS to Raise Prices on Selected PC Lines from Jan. 5 Amid Memory Cost Surge, Following Dell [News] 2025 Tech Layoffs: Meta, Amazon, Microsoft and Others Cut Tens of Thousands of Roles [News] Sony, Microsoft Reportedly Weigh Delaying Next-Gen Game Consoles Beyond 2028 Amid Memory Price Surge [News] Samsung Reportedly Plans 50% HBM Capacity Surge in 2026, Spotlight on HBM4 [News] China Diversification Reportedly Lifts Mature-Node Foundries UMC, VIS, PSMC Despite Tariff Delay [News] Samsung, SK hynix Escape Worst-Case as China VEU Ends: Annual Review Risks Loom [News] TSMC Advanced-Node Materials Reportedly Found at Lo’s Residence Amid Controversial Intel Hire [News] NVIDIA’s $20B Groq Deal Spotlights SRAM Shift—MediaTek NPU Already On Board [News] Chinese Scientists Achieved New Breakthrough in Next-Gen Optical Computing Chips [News] Five-Year-Old Chinese EDA Firm Univista Sets Sights on IPO, Led by Ex-Synopsys and Cadence Team [News] Samsung Reportedly Pushes In-House CPU and GPU for Exynos 2800 to Cut Qualcomm, AMD Reliance [News] SK hynix Reportedly Plans First U.S. 2.5D Packaging Line, Eyes Turnkey HBM to Challenge TSMC [News] Samsung Emerges as Potential Second Foundry for NVIDIA Alongside TSMC After Groq Licensing Deal [News] 7.0 Quake Hits: TSMC Nears Full Production, Sector Losses Reportedly Tens of Billions NTD [News] SLC-Based AI SSDs Gain Traction as SK hynix and Kioxia Accelerate Development With NVIDIA [News] NVIDIA Reportedly Denies USD 20B Groq Acquisition Rumors
[News] TSMC Reportedly to Raise Sub-3nm Prices 3-10% in 2026, Plans Hikes Through 2029
2025-12-29 · via TrendForce


While mature-node foundries, led by SMIC, have sparked a new wave of price hikes, TSMC is reportedly joining the trend. According to the Economic Daily News, the company has notified clients that it will raise prices for advanced nodes consecutively from 2026 through 2029, with the new 2026 rates taking effect on January 1.

The report highlights that TSMC is riding the AI boom, which is tightening capacity in its sub-3nm nodes. Notably, the Economic Daily News suggests that the 2026 price hikes are expected in the single-digit percentage range. Analysts and research firms cited by the report anticipate TSMC’s advanced node prices will rise 3%–10% in 2026, varying by node, but all projected to surpass 2025 levels.

Riding this momentum, the report notes that the price hikes could bolster TSMC’s traditionally slow first-quarter performance, potentially keeping results flat or even slightly above the previous quarter, challenging its strongest-ever Q1. Analysts cited by the report attribute this resilience to new platform launches from major clients like NVIDIA and AMD, as well as non-Apple customers such as Broadcom expanding AI applications.

According to Commercial Times, TSMC’s 2nm clients have a product roadmap stretching from the second half of 2025 through the second half of 2027, led by flagship offerings such as Apple’s M6 and M7, AMD’s Epyc Venice and MI450, Intel’s Nova Lake and Razor Lake and Google’s TPU v9, all lining up for production.

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(Photo credit: TSMC)

Please note that this article cites information from the Economic Daily News and Commercial Times.