惯性聚合 高效追踪和阅读你感兴趣的博客、新闻、科技资讯
阅读原文 在惯性聚合中打开

推荐订阅源

Google DeepMind News
Google DeepMind News
B
Blog
博客园 - 三生石上(FineUI控件)
奇客Solidot–传递最新科技情报
奇客Solidot–传递最新科技情报
T
The Blog of Author Tim Ferriss
H
Hackread – Cybersecurity News, Data Breaches, AI and More
博客园_首页
Vercel News
Vercel News
量子位
A
About on SuperTechFans
博客园 - 聂微东
WordPress大学
WordPress大学
D
DataBreaches.Net
The Cloudflare Blog
M
MIT News - Artificial intelligence
Last Week in AI
Last Week in AI
OSCHINA 社区最新新闻
OSCHINA 社区最新新闻
D
Docker
雷峰网
雷峰网
C
Check Point Blog
S
SegmentFault 最新的问题
U
Unit 42
月光博客
月光博客
Apple Machine Learning Research
Apple Machine Learning Research

... eeNews Europe

Molex Teramount deal targets co-packaged optics NVIDIA and ServiceNow extend AI governance from desktops to data centres Faraday Future launches Physical AI robotics institute with BIBS System Check: Should engineers learn analog? Decoupled by Design: How Gateworks and NXP are rethinking edge AI architecture NVIDIA and Corning partner on AI photonics expansion GCT taps satellite partner to speed 5G rollout Sodankylä supersite to support ESA Earth observation SiTime posts 88% revenue growth on AI infrastructure demand Infrared LEDs support in-cabin sensing for vehicle safety Anthropic compute deal taps SpaceXAI Colossus 1 Quantum Brilliance CEO Mark Luo on deployable quantum systems and the future of diamond-based computing SEMI Summit spotlights Europe’s chiplet and packaging push AI data center infrastructure drives Pennsylvania energy expansion NXP CoreRide gains Vector software support for SDV platforms Elektor Lab Talk covers Red Pitaya and reconfigurable test gear SEMI names Julie Rogers to lead ESD Alliance ASML CEO backs joint call for Europe tech competitiveness push FlexIC RFID inlays bring NFC to paper packaging ROHM targets smart rings with ultra-compact NFC wireless power chipset China silicon wafers push boosts Eswin capacity ESD Alliance outlook spotlights agentic AI in chip design AI robotics sales growth rises as Faraday Future expands into education Microchip expands dsPIC33A controllers for AI data center power sensiBel MEMS microphone heads to Silex production SEMI: Global silicon wafer shipments jump 13% on AI demand AI drives photonics innovation Advantech adds Intel Core Series 3 to edge AI systems NI CHESS enables software-driven RF channel emulation into aerospace testing Forsee Power battery system powers new electric fire pump
TE expands 1.27 mm connector portfolio with AMP SMC series
Alina Neacsu · 2026-06-26 · via ... eeNews Europe

TE expands 1.27 mm connector portfolio with AMP SMC series

New Products |

By Alina Neacsu



TE Connectivity has expanded its 1.27 mm pitch connector portfolio with the introduction of the AMP SMC essential connector series, aimed at industrial applications. The new board-to-board and board-to-wire connectors complement the company’s existing ERNI SMC range by offering a lower-cost alternative for less demanding operating environments.

For eeNews Europe readers, the announcement reflects the continued demand for compact, reliable interconnect solutions in industrial electronics. 

Connector portfolio targets cost-sensitive industrial designs

The AMP SMC essential connector supports currents of up to 1.7 A, operates at temperatures up to 125°C, and meets IEC 60603 Class 2 requirements for vibration and shock resistance. TE says the connector has been designed for applications that do not require the higher mechanical performance of its existing ERNI SMC connector.

The ERNI SMC series, which shares the same 1.27 mm pitch, remains positioned for harsher industrial environments. It complies with the more stringent IEC 60603 Class 1 vibration and shock requirements and supports a higher number of mating cycles.

By offering both product families within the same pitch, TE aims to give equipment manufacturers greater flexibility when selecting interconnects based on application requirements rather than adopting a single performance level across an entire design.

Shared features simplify board-level integration

Despite their different performance targets, both SMC connector families share several design characteristics intended to improve assembly and long-term reliability.

Both use double-sided spring contacts to maintain reliable electrical connections, while locating pegs provide additional mechanical strength. Polarisation features help prevent incorrect mating, and lead-in chamfers improve blind-mating performance by accommodating misalignment of up to ±0.7 mm during assembly.

If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :

   eeNews on Google News