惯性聚合 高效追踪和阅读你感兴趣的博客、新闻、科技资讯
阅读原文 在惯性聚合中打开

推荐订阅源

博客园 - 三生石上(FineUI控件)
G
Google Developers Blog
Vercel News
Vercel News
Cyber Security Advisories - MS-ISAC
Cyber Security Advisories - MS-ISAC
N
Netflix TechBlog - Medium
奇客Solidot–传递最新科技情报
奇客Solidot–传递最新科技情报
钛媒体:引领未来商业与生活新知
钛媒体:引领未来商业与生活新知
Engineering at Meta
Engineering at Meta
B
Blog
博客园_首页
量子位
博客园 - 叶小钗
L
LangChain Blog
T
The Blog of Author Tim Ferriss
云风的 BLOG
云风的 BLOG
Blog — PlanetScale
Blog — PlanetScale
F
Fortinet All Blogs
S
SegmentFault 最新的问题
宝玉的分享
宝玉的分享
D
DataBreaches.Net
雷峰网
雷峰网
The Cloudflare Blog
freeCodeCamp Programming Tutorials: Python, JavaScript, Git & More
Threat Intelligence Blog | Flashpoint
Threat Intelligence Blog | Flashpoint
Last Week in AI
Last Week in AI
P
Proofpoint News Feed
TaoSecurity Blog
TaoSecurity Blog
罗磊的独立博客
MongoDB | Blog
MongoDB | Blog
The GitHub Blog
The GitHub Blog
I
Intezer
H
Help Net Security
The Hacker News
The Hacker News
The Register - Security
The Register - Security
cs.CL updates on arXiv.org
cs.CL updates on arXiv.org
AWS News Blog
AWS News Blog
V
V2EX
Microsoft Security Blog
Microsoft Security Blog
T
Tenable Blog
Spread Privacy
Spread Privacy
A
Arctic Wolf
P
Proofpoint News Feed
T
Threat Research - Cisco Blogs
Schneier on Security
Schneier on Security
C
CERT Recently Published Vulnerability Notes
让小产品的独立变现更简单 - ezindie.com
让小产品的独立变现更简单 - ezindie.com
The Last Watchdog
The Last Watchdog
Latest news
Latest news
T
Troy Hunt's Blog
L
LINUX DO - 热门话题

... eeNews Europe

Molex Teramount deal targets co-packaged optics NVIDIA and ServiceNow extend AI governance from desktops to data centres Faraday Future launches Physical AI robotics institute with BIBS System Check: Should engineers learn analog? Decoupled by Design: How Gateworks and NXP are rethinking edge AI architecture NVIDIA and Corning partner on AI photonics expansion GCT taps satellite partner to speed 5G rollout Sodankylä supersite to support ESA Earth observation SiTime posts 88% revenue growth on AI infrastructure demand Infrared LEDs support in-cabin sensing for vehicle safety Anthropic compute deal taps SpaceXAI Colossus 1 Quantum Brilliance CEO Mark Luo on deployable quantum systems and the future of diamond-based computing SEMI Summit spotlights Europe’s chiplet and packaging push AI data center infrastructure drives Pennsylvania energy expansion NXP CoreRide gains Vector software support for SDV platforms Elektor Lab Talk covers Red Pitaya and reconfigurable test gear SEMI names Julie Rogers to lead ESD Alliance ASML CEO backs joint call for Europe tech competitiveness push FlexIC RFID inlays bring NFC to paper packaging ROHM targets smart rings with ultra-compact NFC wireless power chipset China silicon wafers push boosts Eswin capacity ESD Alliance outlook spotlights agentic AI in chip design AI robotics sales growth rises as Faraday Future expands into education Microchip expands dsPIC33A controllers for AI data center power sensiBel MEMS microphone heads to Silex production SEMI: Global silicon wafer shipments jump 13% on AI demand AI drives photonics innovation Advantech adds Intel Core Series 3 to edge AI systems NI CHESS enables software-driven RF channel emulation into aerospace testing Forsee Power battery system powers new electric fire pump Advantech brings agentic AI to Jetson Thor edge platforms Rohde & Schwarz adds Pulsar signal simulation for LEO navigation UL Solutions builds new testing lab in Germany IonQ and Florida LambdaRail roll out US quantum-safe network initiative Tower Semiconductor and Axiro push high-efficiency SiGe for next-gen radar TSMC SoIC roadmap targets 2029 chip stacking Robotics development platform links EBV ecosystem for system design onsemi and Geely expand SiC collaboration for next-gen EV platforms Satellite connected cattle collars expand remote ranching SK hynix begins mass production of 192GB AI server memory 2Trust.AI and Carahsoft partner to scale AI governance for public sector Cerebras IPO filing revives AI chipmaker’s market push Omdia raises 2026 semiconductor forecast to 62.7% IQM to deploy Japan’s first enterprise quantum computer at TOYO TTM Technologies announces 2026 Investor Day event MATCH Act targets chip tool exports to China Musk teams with Intel for Terafab plans Siemens and TSMC expand AI-driven chip design collaboration Altilium EV battery recycling expands with new investment round Marvell acquires Polariton for optical scaling Credo to unveil AI interconnect solutions at TSMC 2026 Symposium Gartner projects IT spending at $6.31 Trillion in 2026 on AI surge Quectel expands IoT reach in Brazil with Vermont partnership Autonomous material handling stack links Thoro and Orbbec ROHM advances SiC MOSFETs for high-temperature power systems ST targets wide-voltage precision with new op amps NVIDIA and Google Cloud target physical AI factories OE-A publishes 10th edition of “Roadmap for Flexible and Printed Electronics” HCLTech FY26 revenue rises 3.9% as Advanced AI demand accelerates Infineon joins European quantum pilot lines for quantum chips Iran network backdoors claim hits Cisco, Juniper, Fortinet CVD Equipment advances SiC cystal growth with university collaboration EU unlocks €63M to accelerate AI in health and safety GTT targets AI networking growth with 2026 strategy Apple CEO transition as Tim Cook hands over to John Ternus Race Rock sign clamp gets TxDOT approval SEMI forum targets Europe’s semiconductor strategy Smartphone memory shortage to cut 2026 shipments: IDC Vector adds charging communication security tests to CANoe EV package Elektor to host EEI #59 on DIY synths and the Formant Nordic Semiconductor appoints Jo Uthus as EVP of Marketing and Developer Experience ADIOS first order tops $1 million as supply risks rise AMD partners with France to power AI research and exascale supercomputing EU updates tech licensing competition rules for the data era AECC rolls out data first architecture for automotive services Infineon rad-hard semiconductors validated in Artemis II mission Chinese chip tool makers hit record 2025 revenues UK experiment studies microgravity effects using worms on the ISS TSMC Q1 revenue tops $35.9bn on strong 3nm demand NVIDIA launches Ising AI models to accelerate quantum computing ASML reports €8.8bn Q1 revenue Zephyr RTOS 4.4 adds WireGuard, Wi-Fi Direct and OpenRISC Key quantum innovations covered by eeNews Europe MIT underwater robot teaming targets cable inspection Intel and Google expand AI infrastructure partnership SEALSQ and Kaynes advance India’s PQC chip hub Intel to reacquire 49% share of Ireland fab joint venture Intel names Aparna Bawa as Chief Legal & People Officer Stryten launches E-Series AGM batteries for telecom and utility reliability GaN gate drivers integrate protection for motion control and power systems System Check: are engineering certificates worth it? Pasqal partners with True Nexus on quantum food protein design Rigetti launches 108-qubit quantum system Undersea cable security drives UK warning to Russia The race to secure data Low-RDS(on) MOSFETs in automotive power systems SiFive funding backs datacentre CPU push Eclipse hawkBit 1.0 released for open-source IoT software updates Intel and SambaNova target agentic AI inference with Xeon 6 Vadzo publishes GMSL camera guide for embedded vision
Microchip timing module supports AI data centre and 5G synchronization
2026-05-19 · via ... eeNews Europe

Microchip timing module supports AI data centre and 5G synchronization

New Products |

By Alina Neacsu




Microchip has introduced a plug-in timing module for data centre servers and 5G virtualized RAN systems, developed with Intel for Xeon 6 SoC-powered platforms. The MD-990-0011-B module is designed to simplify synchronization in infrastructure where timing accuracy affects distributed AI workloads, cloud services and real-time network functions.

For eeNews Europe readers, the release is relevant because timing is becoming a design-level issue in AI infrastructure and 5G systems, not just a back-end network function. The module could help OEMs and ODMs add resilient synchronization without developing custom timing circuitry.

Plug-in timing for infrastructure designs

The MD-990-0011-B supports automatic source selection and locking across GNSS, Synchronous Ethernet and Precision Time Protocol. This allows systems to maintain accurate timing even when one source is disrupted, which can be important for high-availability data centre and telecom deployments.

Microchip says the module is compatible with Intel Xeon 6 SoC-powered server platforms and builds on Intel’s vRAN architecture. The aim is to support lower-latency synchronization for applications such as 5G radio access networks, distributed AI processing and real-time cloud workloads.

“Timing is the invisible force that guides the world’s most transformative technologies. With the MD-990-0011-B timing modules, Microchip enables designers to address timing requirements proactively, whether at the outset or during upgrades,” said Randy Brudzinski, corporate vice president of Microchip’s frequency and time systems business unit. “Our plug-in solution eliminates the complexity of custom timing circuits, providing integration and reliability, accelerating innovation and reducing time-to-market for data centers and 5G networks.”

Holdover options and integrated components

The timing module is available in two variants. The MD-990-0011-BC01 provides 8 hours of holdover performance, while the MD-990-0011-BA01 provides 4 hours. Holdover helps maintain stable timing during GNSS outages or network disruption.

The module integrates several Microchip technologies, including the ZL80132B SyncE synthesizer with two independent DPLL channels, OX-22x oven-controlled crystal oscillators, an MCP9808 temperature sensor, a 24LC024 EEPROM and VC-820 low-jitter technology.

“Microchip’s MD-990-0011-B Timing Module aligns with Intel’s commitment to enable next-generation infrastructure by providing scalable, high-performance platforms that are ready for the demands of 5G, AI and cloud computing,” said Mike Merluzzi, GM of radio access networks at Intel Corporation. “By simplifying timing integration and enhancing reliability on Intel Xeon 6 SoC-powered platforms, we’re helping customers accelerate innovation and deployment.”

If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :

   eeNews on Google News


Linked Articles