L&T Semiconductor Technologies, a wholly owned subsidiary of Larsen & Toubro, has joined the IMEC Automotive Chiplet Program, a global research initiative aimed at accelerating the adoption of chiplet-based architectures for next-generation automotive computing.
The programme, led by IMEC, brings together stakeholders across the automotive and semiconductor value chain to evaluate chiplet designs and advanced packaging technologies. These are expected to address growing requirements for performance, functional safety, reliability and lifecycle management in modern vehicles.
The move comes as traditional monolithic system-on-chip (SoC) architectures face limitations in handling the rising compute and bandwidth needs of advanced driver-assistance systems (ADAS), software-defined vehicles (SDVs) and next-generation in-vehicle infotainment. Chiplets—modular silicon components integrated using advanced 2.5D and 3D packaging—are emerging as a viable alternative, offering improved performance per watt, scalability and faster time-to-market.
Sandeep Kumar, chief executive of LTSCT, said chiplets mark a fundamental shift in automotive system design, especially as vehicles become increasingly software-driven. He added that the collaboration would enable the company to contribute to defining standards and reference architectures for high-performance, energy-efficient automotive platforms, with a focus on safety-critical computing, high-bandwidth connectivity and lifecycle management.
Bart Placklé, vice president of automotive technologies at imec, said industry-wide collaboration is essential to make chiplet adoption commercially viable, noting that shared standards would reduce vendor lock-in and improve supply-chain flexibility for automakers.
The ACP leverages imec’s expertise in advanced packaging and its global ecosystem of automotive and semiconductor players. LTSCT’s participation is expected to strengthen India’s positioning in the global semiconductor landscape, particularly in emerging areas such as automotive electronics.
The development also reflects a broader industry shift toward modular chip design, as automakers and technology firms seek more flexible and scalable solutions to support the transition to connected, autonomous and software-defined vehicles.
Published on April 30, 2026