White Paper
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This White Paper provides a comprehensive overview of how single-phase direct liquid cooling manages the rising thermal demands of AI and high-performance computing, and how it compares with two-phase and immersion approaches.
What you will learn about:
- Why rising compute density has made heat the central design constraint in AI and high-performance computing, where individual processors now exceed 1,000 watts and racks dissipate more than 100 kilowatts.
- How semiconductors respond to excess heat through thermal throttling, and why maintaining thermal margin supports higher performance and longer hardware life.
- Why air cooling reaches its practical limit at high rack densities, and how liquid absorbs and carries away far more heat in a closed loop.
- How single-phase direct liquid cooling works at the chip and system levels, and how it compares with two-phase and immersion cooling.
- How processor power and rack density are expected to grow, and what these trends mean for the future of thermal design.
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Presented by IEEE Spectrum and Wiley, sponsored by CoolIT Systems
More Information
As computing systems move toward denser processors, tightly coupled server nodes, and higher-power racks, managing the heat they generate has become a defining challenge in data center design. Modern AI accelerators can dissipate well over 1,000 watts, and a single rack may release more than 100 kilowatts of heat. This is far beyond what air cooling can practically remove. Single-phase direct liquid cooling addresses this by circulating water or a water-glycol coolant through coldplates mounted directly on high-heat components. The coolant absorbs the heat and carries it away in a closed loop to a coolant distribution unit. Because liquid stores far more heat than air and removes it much faster, this approach supports higher chip and rack densities within a smaller footprint. This paper explains how single-phase direct liquid cooling works, how it compares with two-phase and immersion cooling, and how rising processor power and rack density are shaping the future of thermal