In addition to high-speed RDIMMs, G.Skill, in its Computex 2026 booth, showcased its first memory kits to feature AMD EXPO-ULL (ultra-low latency) profiles. Shown at Computex, was a DDR5-6000 kit with 26-36-36-32 CR1 from the profile. Also shown were DDR5-6000 kits with 28-36-36-32 CR1, and 30-38-38-32 CR1, all of which are significantly tighter than the typical 38-44-44 that tends to be typical of JEDEC-standard DDR5-6000 kits.

The DDR6-6000 with CL26 kit in particular, featured a per-module active cooling solution that G.Skill co-developed with Cooler Master. This module is two slots thick, and so you'll need a motherboard with at least 1 slot gap between the two memory channels. This could be a problem for motherboards with a 1 DIMM per channel memory slot layout without sufficient gap between the two slots. The others appear to look like Trident Z5 Neo and Trident Z5 Royal Neos. G.Skill will launch its first AMD EXPO-ULL memory kits in the 2nd half of 2026.