New Products |
By Alina Neacsu
STMicroelectronics has introduced the IIS3DWB10IS, an industrial MEMS vibration sensor with embedded AI processing for condition-monitoring applications. The device combines wide-bandwidth vibration sensing with ST’s ISPU 2.0 processing unit, aiming to give equipment makers a digital alternative to piezoelectric sensors.
The launch is relevant for eeNews Europe readers because predictive maintenance is increasingly moving toward compact, edge-based sensing. For European industrial and automation engineers, the device could help simplify vibration-monitoring designs while supporting local processing at the sensor level.
The IIS3DWB10IS measures vibration and shock up to 200g at frequencies of 10kHz and above. ST says the sensor offers a noise floor as low as 35µg/√Hz, putting it closer to the performance expected from piezoelectric sensing in higher-end condition-monitoring systems.
The device operates up to 125°C, supporting use in harsher industrial environments such as motors, pumps, drives and rotating machinery. Its MEMS-based design also brings digital interface benefits, smaller size, lower power consumption and potentially simpler mechanical and electrical integration.
“Our industrial MEMS vibration sensor delivers the dynamic range and bandwidth needed for high-end applications and extends the advantages of ST in-sensor digital processing. Integrating the ISPU 2.0, with its new hardware accelerators for fast signal processing and AI inference, sharpens equipment-wear recognition while reducing latency and power consumption,“ said Simone Ferri, APMS executive VP MEMS sub-group. “Industries can expect a new generation of condition monitoring sensors, the first compelling alternative to piezosensor, that is lightweight, easy to fit and design, ultra-accurate, and energy efficient enough for battery-powered operations.”
The integrated ISPU 2.0 is designed to run signal processing and AI inference close to the sensing element. It delivers 40 MIPS and 40 MFLOPS, up to four times the processing performance of the previous generation, according to ST. The sensor interface also supports six times faster data transfer with the MEMS circuitry.
ST’s software ecosystem includes libraries for vibration-monitoring functions such as FFT, filtering, envelope analysis, velocity severity and anomaly detection. This could help designers partition more processing inside the sensor, reducing latency and system-level power consumption.
“The IIS3DWB10IS delivers unique properties for our target markets and environments. Its high dynamic range, wide bandwidth, and high-temperature capability, combined with ease of adoption and a cost-effective, simplified circuit design, allowed us to replace the incumbent piezosensor technology. Moreover, the integrated ISPU 2.0 processor positions complex signal processing and rapid AI inference close to the sensing element, enabling smarter system responses,” said Andrea Torcelli, Chief Technology Officer at Bonfiglioli S.P.A.
The IIS3DWB10IS includes a 2048×80-bit FIFO register and an integrated temperature sensor. It comes in a 4.5mm x 4.5mm x 1.5mm 16-lead LGA package with wettable flanks for optical inspection.
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