惯性聚合 高效追踪和阅读你感兴趣的博客、新闻、科技资讯
阅读原文 在惯性聚合中打开

推荐订阅源

CTFtime.org: upcoming CTF events
CTFtime.org: upcoming CTF events
量子位
腾讯CDC
月光博客
月光博客
博客园 - 【当耐特】
博客园 - 聂微东
罗磊的独立博客
aimingoo的专栏
aimingoo的专栏
D
DataBreaches.Net
Apple Machine Learning Research
Apple Machine Learning Research
F
Fortinet All Blogs
博客园 - Franky
爱范儿
爱范儿
L
LangChain Blog
云风的 BLOG
云风的 BLOG
TaoSecurity Blog
TaoSecurity Blog
N
News and Events Feed by Topic
Security Archives - TechRepublic
Security Archives - TechRepublic
阮一峰的网络日志
阮一峰的网络日志
人人都是产品经理
人人都是产品经理
The Cloudflare Blog
Simon Willison's Weblog
Simon Willison's Weblog
Google DeepMind News
Google DeepMind News
S
Schneier on Security
H
Help Net Security
H
Heimdal Security Blog
The GitHub Blog
The GitHub Blog
Hacker News - Newest:
Hacker News - Newest: "LLM"
Y
Y Combinator Blog
N
Netflix TechBlog - Medium
Microsoft Azure Blog
Microsoft Azure Blog
Cyberwarzone
Cyberwarzone
Cloudbric
Cloudbric
Recorded Future
Recorded Future
Hacker News: Ask HN
Hacker News: Ask HN
S
Security @ Cisco Blogs
Project Zero
Project Zero
AWS News Blog
AWS News Blog
Spread Privacy
Spread Privacy
MyScale Blog
MyScale Blog
H
Hackread – Cybersecurity News, Data Breaches, AI and More
S
Securelist
Recent Announcements
Recent Announcements
cs.AI updates on arXiv.org
cs.AI updates on arXiv.org
Cyber Security Advisories - MS-ISAC
Cyber Security Advisories - MS-ISAC
C
CERT Recently Published Vulnerability Notes
M
MIT News - Artificial intelligence
IT之家
IT之家
Google Online Security Blog
Google Online Security Blog
C
CXSECURITY Database RSS Feed - CXSecurity.com

... eeNews Europe

Molex Teramount deal targets co-packaged optics NVIDIA and ServiceNow extend AI governance from desktops to data centres Faraday Future launches Physical AI robotics institute with BIBS System Check: Should engineers learn analog? Decoupled by Design: How Gateworks and NXP are rethinking edge AI architecture NVIDIA and Corning partner on AI photonics expansion GCT taps satellite partner to speed 5G rollout Sodankylä supersite to support ESA Earth observation SiTime posts 88% revenue growth on AI infrastructure demand Infrared LEDs support in-cabin sensing for vehicle safety Anthropic compute deal taps SpaceXAI Colossus 1 Quantum Brilliance CEO Mark Luo on deployable quantum systems and the future of diamond-based computing SEMI Summit spotlights Europe’s chiplet and packaging push AI data center infrastructure drives Pennsylvania energy expansion NXP CoreRide gains Vector software support for SDV platforms Elektor Lab Talk covers Red Pitaya and reconfigurable test gear SEMI names Julie Rogers to lead ESD Alliance ASML CEO backs joint call for Europe tech competitiveness push FlexIC RFID inlays bring NFC to paper packaging ROHM targets smart rings with ultra-compact NFC wireless power chipset China silicon wafers push boosts Eswin capacity ESD Alliance outlook spotlights agentic AI in chip design AI robotics sales growth rises as Faraday Future expands into education Microchip expands dsPIC33A controllers for AI data center power sensiBel MEMS microphone heads to Silex production SEMI: Global silicon wafer shipments jump 13% on AI demand AI drives photonics innovation Advantech adds Intel Core Series 3 to edge AI systems NI CHESS enables software-driven RF channel emulation into aerospace testing Forsee Power battery system powers new electric fire pump Advantech brings agentic AI to Jetson Thor edge platforms Rohde & Schwarz adds Pulsar signal simulation for LEO navigation UL Solutions builds new testing lab in Germany IonQ and Florida LambdaRail roll out US quantum-safe network initiative Tower Semiconductor and Axiro push high-efficiency SiGe for next-gen radar TSMC SoIC roadmap targets 2029 chip stacking Robotics development platform links EBV ecosystem for system design onsemi and Geely expand SiC collaboration for next-gen EV platforms Satellite connected cattle collars expand remote ranching SK hynix begins mass production of 192GB AI server memory 2Trust.AI and Carahsoft partner to scale AI governance for public sector Cerebras IPO filing revives AI chipmaker’s market push Omdia raises 2026 semiconductor forecast to 62.7% IQM to deploy Japan’s first enterprise quantum computer at TOYO TTM Technologies announces 2026 Investor Day event MATCH Act targets chip tool exports to China Musk teams with Intel for Terafab plans Siemens and TSMC expand AI-driven chip design collaboration Altilium EV battery recycling expands with new investment round Marvell acquires Polariton for optical scaling Credo to unveil AI interconnect solutions at TSMC 2026 Symposium Gartner projects IT spending at $6.31 Trillion in 2026 on AI surge Quectel expands IoT reach in Brazil with Vermont partnership Autonomous material handling stack links Thoro and Orbbec ROHM advances SiC MOSFETs for high-temperature power systems ST targets wide-voltage precision with new op amps NVIDIA and Google Cloud target physical AI factories OE-A publishes 10th edition of “Roadmap for Flexible and Printed Electronics” HCLTech FY26 revenue rises 3.9% as Advanced AI demand accelerates Infineon joins European quantum pilot lines for quantum chips Iran network backdoors claim hits Cisco, Juniper, Fortinet CVD Equipment advances SiC cystal growth with university collaboration EU unlocks €63M to accelerate AI in health and safety GTT targets AI networking growth with 2026 strategy Apple CEO transition as Tim Cook hands over to John Ternus Race Rock sign clamp gets TxDOT approval SEMI forum targets Europe’s semiconductor strategy Smartphone memory shortage to cut 2026 shipments: IDC Vector adds charging communication security tests to CANoe EV package Elektor to host EEI #59 on DIY synths and the Formant Nordic Semiconductor appoints Jo Uthus as EVP of Marketing and Developer Experience ADIOS first order tops $1 million as supply risks rise AMD partners with France to power AI research and exascale supercomputing EU updates tech licensing competition rules for the data era AECC rolls out data first architecture for automotive services Infineon rad-hard semiconductors validated in Artemis II mission Chinese chip tool makers hit record 2025 revenues UK experiment studies microgravity effects using worms on the ISS TSMC Q1 revenue tops $35.9bn on strong 3nm demand NVIDIA launches Ising AI models to accelerate quantum computing ASML reports €8.8bn Q1 revenue Zephyr RTOS 4.4 adds WireGuard, Wi-Fi Direct and OpenRISC Key quantum innovations covered by eeNews Europe MIT underwater robot teaming targets cable inspection Intel and Google expand AI infrastructure partnership SEALSQ and Kaynes advance India’s PQC chip hub Intel to reacquire 49% share of Ireland fab joint venture Intel names Aparna Bawa as Chief Legal & People Officer Stryten launches E-Series AGM batteries for telecom and utility reliability GaN gate drivers integrate protection for motion control and power systems System Check: are engineering certificates worth it? Pasqal partners with True Nexus on quantum food protein design Rigetti launches 108-qubit quantum system Undersea cable security drives UK warning to Russia The race to secure data Low-RDS(on) MOSFETs in automotive power systems SiFive funding backs datacentre CPU push Eclipse hawkBit 1.0 released for open-source IoT software updates Intel and SambaNova target agentic AI inference with Xeon 6 Vadzo publishes GMSL camera guide for embedded vision
Infineon adds 2300 V SiC modules for energy systems
2026-05-15 · via ... eeNews Europe

Infineon adds 2300 V SiC modules for energy systems

New Products |

By Alina Neacsu




Infineon has expanded its XHP 2 power module range with 2300 V CoolSiC MOSFET variants for high-voltage energy systems. The SiC modules support DC-link voltages up to 1500 V, reflecting the shift toward higher system voltages in renewable energy infrastructure.

For eeNews Europe readers, the development is relevant because it addresses efficiency, power density and thermal performance in large-scale converters used in wind, photovoltaic and battery storage systems.

Higher-voltage SiC module platform

The XHP 2 CoolSiC MOSFET modules are designed to reduce switching and conduction losses compared with silicon-based alternatives. This could help inverter designers improve efficiency and power density, or increase switching frequency to reduce harmonics and system size.

Infineon is offering the modules with on-resistance values from 1 mΩ to 2 mΩ and isolation voltages of 4 kV or 6 kV. The XHP 2 package also supports symmetrical switching behaviour, which can simplify paralleling in large power converters.

Focus on renewable energy converters

The modules integrate Infineon’s .XT interconnection technology, intended to support reliability and operational lifetime. Variants are also available with pre-applied thermal interface material, which can reduce assembly complexity and support more consistent thermal behaviour.

Infineon says the devices have shown system-level results in renewable energy use cases. In a wind power demonstration system, the modules achieved a power density of 300 kW/L. Tests in battery storage systems showed semiconductor losses of less than 0.7 percent of output power.

Availability

The 2300 V XHP 2 CoolSiC MOSFET modules are available now from Infineon and its distribution partners. The listed variants are FF1000UXTR23T2M1, FF1300UXTR23T2M1, FF2000UXTR23T2M1 and FF1000UXTR23T2M1_B5.

If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :

   eeNews on Google News


Linked Articles