New Products |
By Alina Neacsu
Tageos and Pragmatic Semiconductor have expanded their partnership with the launch of FlexIC-based RFID product lines for NFC-enabled packaging and labels. The Tageos EOS Lite and EOS Zero Lite families use Pragmatic’s NFC Connect PR1301 chip, with the EOS-932 Zero Lite PR1301 introduced as the first paper-based NFC inlay in the range.
For eeNews Europe readers, the launch points to how RFID and NFC are moving beyond conventional labels into lower-carbon, high-volume packaging applications. It also shows how flexible semiconductor technology may help reduce material use and support item-level connectivity at scale.
The EOS-932 Zero Lite PR1301 is designed for integration into paper packaging and labels, with applications including consumer engagement, product authentication and brand protection. By combining a paper-based antenna with Pragmatic’s ultra-thin FlexIC, the inlay is intended to support NFC functionality without significantly changing the look or feel of the packaging.
Tageos said the product was developed at its Innovation Center of Excellence and is the first in its portfolio to feature Pragmatic’s NFC Connect PR1301 chip. The chip’s flexible form factor makes it suitable for curved surfaces, packaging and product-level integration, areas where conventional RFID or NFC designs can face limits around cost, thickness or recyclability.
The companies say the EOS Lite and EOS Zero Lite product families are aimed at reducing materials, carbon footprint and costs. For retail, consumer goods and logistics use cases, that could make NFC-based item identity more practical for mass-market deployment.
The wider market opportunity sits around connecting physical products to digital services. NFC inlays can allow consumers to interact with packaging using a smartphone, while also giving brands a route to authentication, traceability and customer engagement.
“Our close collaboration with Pragmatic Semiconductor combines innovation with a clear vision for sustainability, enabling customers to deliver highly scalable, cost-effective, and truly sustainable NFC inlays for smart packaging applications,” said Matthieu Picon, CEO, Tageos. “The new and growing FlexIC-based product lines EOS Lite and EOS Zero Lite are yet another example of our path to success, opening new possibilities for brands to connect to their customers through their products and the consumer’s most personal device, the smartphone.”
“Bringing this innovation to market is an exciting deployment of our FlexIC technology. With Tageos, we are addressing the rapidly expanding opportunity to seamlessly integrate intelligence at item level and deliver sustainable, connected experiences at scale,” said David Moore, CEO, Pragmatic Semiconductor. “Together, we are shaping a new era of smarter packaging, enabling direct consumer engagement with virtually any item to prove authenticity, deepen trust, and unlock data-driven insights and transparency across the value chain.”
Prototype samples of the EOS-932 Zero Lite PR1301 are expected by the end of Q2 2026 on request, with volume orders planned from Q3 2026.
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