惯性聚合 高效追踪和阅读你感兴趣的博客、新闻、科技资讯
阅读原文 在惯性聚合中打开

推荐订阅源

S
SegmentFault 最新的问题
OSCHINA 社区最新新闻
OSCHINA 社区最新新闻
B
Blog RSS Feed
Y
Y Combinator Blog
T
Tailwind CSS Blog
博客园 - 三生石上(FineUI控件)
J
Java Code Geeks
Stack Overflow Blog
Stack Overflow Blog
aimingoo的专栏
aimingoo的专栏
Jina AI
Jina AI
The GitHub Blog
The GitHub Blog
奇客Solidot–传递最新科技情报
奇客Solidot–传递最新科技情报
A
About on SuperTechFans
H
Hackread – Cybersecurity News, Data Breaches, AI and More
D
Docker
酷 壳 – CoolShell
酷 壳 – CoolShell
C
Check Point Blog
M
MIT News - Artificial intelligence
Last Week in AI
Last Week in AI
V
V2EX
腾讯CDC
F
Fortinet All Blogs
博客园 - 叶小钗
T
The Blog of Author Tim Ferriss

... eeNews Europe

Molex Teramount deal targets co-packaged optics NVIDIA and ServiceNow extend AI governance from desktops to data centres Faraday Future launches Physical AI robotics institute with BIBS SiTime targets AI data centers with sub-nanosecond timing chip System Check: Should engineers learn analog? Decoupled by Design: How Gateworks and NXP are rethinking edge AI architecture NVIDIA and Corning partner on AI photonics expansion GCT taps satellite partner to speed 5G rollout Sodankylä supersite to support ESA Earth observation SiTime posts 88% revenue growth on AI infrastructure demand Infrared LEDs support in-cabin sensing for vehicle safety Anthropic compute deal taps SpaceXAI Colossus 1 Quantum Brilliance CEO Mark Luo on deployable quantum systems and the future of diamond-based computing SEMI Summit spotlights Europe’s chiplet and packaging push AI data center infrastructure drives Pennsylvania energy expansion NXP CoreRide gains Vector software support for SDV platforms Elektor Lab Talk covers Red Pitaya and reconfigurable test gear SEMI names Julie Rogers to lead ESD Alliance ASML CEO backs joint call for Europe tech competitiveness push FlexIC RFID inlays bring NFC to paper packaging ROHM targets smart rings with ultra-compact NFC wireless power chipset China silicon wafers push boosts Eswin capacity ESD Alliance outlook spotlights agentic AI in chip design AI robotics sales growth rises as Faraday Future expands into education Microchip expands dsPIC33A controllers for AI data center power sensiBel MEMS microphone heads to Silex production AI drives photonics innovation Advantech adds Intel Core Series 3 to edge AI systems NI CHESS enables software-driven RF channel emulation into aerospace testing Forsee Power battery system powers new electric fire pump
SEMI: Global silicon wafer shipments jump 13% on AI demand
2026-05-04 · via ... eeNews Europe

SEMI: Global silicon wafer shipments jump 13% on AI demand

News |

By Asma Adhimi




Worldwide silicon wafer shipments saw a strong start to 2026, rising 13.1% year-on-year in the first quarter, according to SEMI. The growth highlights continued momentum in AI-related semiconductor demand, even as some end markets remain under pressure.

For eeNews Europe readers, the figures offer a useful snapshot of how AI is reshaping semiconductor supply chains and influencing wafer demand across multiple device segments.

AI demand drives growth

Shipments reached 3,275 million square inches (MSI) in Q1 2026, up from 2,896 MSI a year earlier. However, volumes declined 4.7% sequentially from Q4 2025, reflecting typical seasonal patterns.

“Silicon wafer demand related to AI data centers continues to be strong, including advanced logic and memory, and also now extending to power management devices,” said Ginji Yada, who also serves as an executive at SUMCO Corporation.

The data suggests AI workloads are not only boosting demand for high-end chips but also driving requirements for supporting components such as power devices.

Recovery remains uneven

Despite the overall growth, the market recovery is far from uniform. Industrial semiconductor segments are improving, helping absorb excess wafer inventory and contributing to a broader rebound.

“Overall, silicon wafer demand has improved, but the recovery is not uniform. Many device companies have noted improvements in the industrial semiconductor segment, and this is creating a more broad-based recovery as wafer inventory is absorbed. Weaker smartphone and PC shipments in the first quarter of this year may show the impact of tighter supply of memory due to AI high bandwidth memory (HBM) allocation decisions,” Yada added.

The shift in memory allocation toward AI applications appears to be affecting traditional consumer electronics markets, particularly smartphones and PCs.

Silicon wafers remain a foundational material for semiconductor manufacturing, underpinning everything from automotive electronics to cloud infrastructure. As AI continues to scale, wafer demand trends are likely to remain closely tied to data center investments and evolving chip architectures.

If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :

   eeNews on Google News


Linked Articles