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Latest from Tom's Hardware in Semiconductors

Post-silicon era gets closer as industry giants crack the 2D transistor scaling bottleneck with breakthrough tech — imec, ASML, and TSMC fab complementary 2D-material transistors at 50nm pitch on a 300mm wafer Intel Intel’s performance-enhanced 18A-P process enters risk production — drop-in 18A upgrade promises 9% performance improvement at iso-power, cuts thermal resistance by 40% Chinese fab SMIC TSMC says panel packaging won Analyzing TSMC's fab expansion roadmap — multi-fab N2 ramp, CoWoS, SoIC, and uncorking bottlenecks Chinese startup claims photonic chip production without DUV lithography, says nanoimprint process cuts costs by 90%… ASML becomes Europe's most valuable company ever as analysts bet on higher EUV output — its market cap hit… TSMC CEO C.C. Wei says, ‘It will be a long time before we can meet customer demand’ — tells shareholders that he will keep prices stable, refrain from implementing price hikes Samsung shows first HBM5 mockup with Heat Path Block cooling — thermal race with SK hynix shaping up Seven hospitalized after toxic gas fire at SK hynix advanced memory plant — Cheongju 4th campus incident today led… TikTok owner ByteDance is reportedly developing its own custom AI CPUs — company looks to ease China's… Trailing-edge foundry roadmaps for GlobalFoundries, UMC, and SMIC — mature node chipmakers each pursue differing… Chinese university builds 3D chip design tool tailored to Huawei's ‘LogicFolding’ architecture — 3D design delivers increased performance and better thermal management China adds homegrown AI chips to 'secure and reliable' procurement list for the first time — nine options added as move away from Nvidia continues SK hynix unveils 'iHBM' thermal architecture that cools AI memory at the source — integrated cooling elements inside HBM interface cut thermal resistance by 30%, target next-gen HBM5 accelerators and dense AI data centers Imec builds world's first High-NA EUV-fabricated quantum dot qubit device — breakthrough could pull quantum computing onto the same manufacturing roadmap as next-gen AI processors, compressing timelines Huawei claims sanctions-busting breakthrough with 1.4nm-class chips by 2031, claims 55% higher transistor density — firm claims new LogicFolding chip architecture can bypass EUV restrictions, introduces 'Tau Scaling Law' to replace Moore's Law Samsung's $400,000 payout for memory workers sparks revolt as other divisions get only $4,000, fueling intentional production slowdowns — internal resentment disrupts packaging operations, major AI chip project decisions to a complete halt The custom AI ASIC state of play (May 2026) — Broadcom deals, Google TPUs, Meta MTIA & beyond AMD begins production ramp of 256-core EPYC Venice — first 2nm HPC chip claims 70% performance leap Intel kicks off development on next-decade 10A and 7A process technologies — 14A node remains on track for… SMIC founder and AMEC CEO urge Chinese fabs to test domestic chipmaking tools on active production lines — equipment makers post record revenue but falling margins Russia’s Mikron is selling framed test wafers with up to 120,000 processors as souvenirs — 12 designs, priced around $170 each, sold alongside $2 vials of cleanroom air Trump calls $14 billion Taiwan arms deal a 'negotiating chip' with China after Xi said Taiwan issue could lead to 'clashes and even conflicts' — Trump says 'Taiwan would be very smart to cool it a little bit' Leading-edge foundry roadmaps for TSMC, Intel and Samsung — outlining the path to 1.4nm nodes and beyond TSMC allocates $20 billion to Arizona expansion — project faces water and labor shortages, complicated by visa… NASA partners with Microchip to build next-generation spaceflight chips with 100x the power of current offerings — chip designed to withstand radiation for extended missions on the Moon and Mars Intel, SK hynix shares surge following reports of chip packaging partnership — SK is said to be testing… Apple reportedly strikes deal for Intel to make some of its chips — two tech giants reached a preliminary…
Elon Musk pushing forward with Terafab at
https://www.tomshardware.com/author/jowi-morales · 2026-04-17 · via Latest from Tom's Hardware in Semiconductors
Elon Musk
(Image credit: Shutterstock)

People working on Elon Musk's Terafab project are said to be aggressively tapping suppliers for pricing and delivery times for photomasks, substrates, etchers, and more. According to Bloomberg, his people have reportedly talked with Applied Materials Inc., Tokyo Electron Ltd., Lam Research Corp., and even chip manufacturing partner Samsung Electronics Co., with one source saying they reached out to a company during a Friday holiday for an estimate to be delivered the following Monday because Musk wants to move at “light speed."

According to the report, representatives for the project have been asking for "speedy" price estimates, while being decidedly coy about specific products they're planning to build. The inquiries show Musk is serious about his dreams of building his own chips, which he started talking about in late 2025. The billionaire founder may be one of the richest people on earth, but Nvidia’s Jensen Huang warns that building a fab is a complex engineering problem that requires more than money to solve. “Building advanced chip manufacturing is extremely hard,” Huang said. “It is not just building the plant, but the engineering, the science, and the artistry of doing what TSMC does for a living is extremely hard.”

Still, this seemingly did not deter Elon, who successfully made electric vehicles mainstream with Tesla and commercialized space flight by building low-cost, reusable orbital rockets through SpaceX. It seems that semiconductor manufacturing is his next big project, especially as he criticized existing chip fabs for not having enough capacity to meet the needs of his companies.

The project officially launched in March 2026, less than five months after he first publicly talked about the idea. Musk injected $20 billion into Terafab to kickstart it, although experts estimate that costs could hit more than $5 trillion. Less than a month after the announcement, Intel said it joined the Terafab project to “help refactor silicon fab technology” and “accelerate Terafab’s aim to produce 1 TW/year of compute.” It’s currently unclear what Intel will do for Terafab, but this tie-in allowed the chipmaker, which was on the verge of collapse just two years ago, to hit its highest market cap in 25 years.

The other companies Terafab reached out to all similarly experienced uplifts in stock prices, with Tokyo Electron closing at +5.3% in Tokyo, while Applied Materials and Lam Research were up 2% in pre-market trading, despite no fixed orders being placed by the startup just yet. We also do not expect the company to start churning out chips in the next couple of years. “It takes two to three years to build a new plant — no shortcut — and it takes another one or two years to ramp it up,” TSMC CEO C.C. Wei said during an earnings call. “There are no shortcuts.”

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Jowi Morales is a tech enthusiast with years of experience working in the industry. He’s been writing with several tech publications since 2021, where he’s been interested in tech hardware and consumer electronics.