TSMC reportedly plans to build 12 fabs, four packaging facilities in Arizona — plan purportedly part of Taiwan's agreed $500 million investment in the US

Latest from Tom's Hardware in Semiconductors

Post-silicon era gets closer as industry giants crack the 2D transistor scaling bottleneck with breakthrough tech — imec, ASML, and TSMC fab complementary 2D-material transistors at 50nm pitch on a 300mm wafer Intel Intel’s performance-enhanced 18A-P process enters risk production — drop-in 18A upgrade promises 9% performance improvement at iso-power, cuts thermal resistance by 40% Chinese fab SMIC TSMC says panel packaging won Analyzing TSMC's fab expansion roadmap — multi-fab N2 ramp, CoWoS, SoIC, and uncorking bottlenecks Chinese startup claims photonic chip production without DUV lithography, says nanoimprint process cuts costs by 90%… ASML becomes Europe's most valuable company ever as analysts bet on higher EUV output — its market cap hit… TSMC CEO C.C. Wei says, ‘It will be a long time before we can meet customer demand’ — tells shareholders that he will keep prices stable, refrain from implementing price hikes Samsung shows first HBM5 mockup with Heat Path Block cooling — thermal race with SK hynix shaping up Seven hospitalized after toxic gas fire at SK hynix advanced memory plant — Cheongju 4th campus incident today led… TikTok owner ByteDance is reportedly developing its own custom AI CPUs — company looks to ease China's… Trailing-edge foundry roadmaps for GlobalFoundries, UMC, and SMIC — mature node chipmakers each pursue differing… Chinese university builds 3D chip design tool tailored to Huawei's ‘LogicFolding’ architecture — 3D design delivers increased performance and better thermal management China adds homegrown AI chips to 'secure and reliable' procurement list for the first time — nine options added as move away from Nvidia continues SK hynix unveils 'iHBM' thermal architecture that cools AI memory at the source — integrated cooling elements inside HBM interface cut thermal resistance by 30%, target next-gen HBM5 accelerators and dense AI data centers Imec builds world's first High-NA EUV-fabricated quantum dot qubit device — breakthrough could pull quantum computing onto the same manufacturing roadmap as next-gen AI processors, compressing timelines Huawei claims sanctions-busting breakthrough with 1.4nm-class chips by 2031, claims 55% higher transistor density — firm claims new LogicFolding chip architecture can bypass EUV restrictions, introduces 'Tau Scaling Law' to replace Moore's Law Samsung's $400,000 payout for memory workers sparks revolt as other divisions get only $4,000, fueling intentional production slowdowns — internal resentment disrupts packaging operations, major AI chip project decisions to a complete halt The custom AI ASIC state of play (May 2026) — Broadcom deals, Google TPUs, Meta MTIA & beyond AMD begins production ramp of 256-core EPYC Venice — first 2nm HPC chip claims 70% performance leap Intel kicks off development on next-decade 10A and 7A process technologies — 14A node remains on track for… SMIC founder and AMEC CEO urge Chinese fabs to test domestic chipmaking tools on active production lines — equipment makers post record revenue but falling margins Russia’s Mikron is selling framed test wafers with up to 120,000 processors as souvenirs — 12 designs, priced around $170 each, sold alongside $2 vials of cleanroom air Trump calls $14 billion Taiwan arms deal a 'negotiating chip' with China after Xi said Taiwan issue could lead to 'clashes and even conflicts' — Trump says 'Taiwan would be very smart to cool it a little bit' Leading-edge foundry roadmaps for TSMC, Intel and Samsung — outlining the path to 1.4nm nodes and beyond TSMC allocates $20 billion to Arizona expansion — project faces water and labor shortages, complicated by visa… NASA partners with Microchip to build next-generation spaceflight chips with 100x the power of current offerings — chip designed to withstand radiation for extended missions on the Moon and Mars Intel, SK hynix shares surge following reports of chip packaging partnership — SK is said to be testing… Apple reportedly strikes deal for Intel to make some of its chips — two tech giants reached a preliminary… Global semiconductor sales hit nearly $300 billion in Q1 2026 — chips are on track to top $1 trillion for this… Apple considering Intel and Samsung for US chip production, report claims — consumer electronics giant looks to… China pushes for 70% homegrown silicon wafer use as domestic firm ramps up 12-inch production — government seeking to localize critical chip supply chain amid AI boom and export restrictions ASML's roadmap for chipmaking lithography tools examined — from DUV to Low-NA, High-NA, Hyper-NA, and beyond Intel details 18A-P process node, touts higher performance, lower power, and better thermals — 9% more… TSMC SoIC 3D stacking roadmap outlines path from 6-micron pitches today to 4.5-micron in 2029 — Fujitsu's… Inside Google TSMC Bolt Graphics tapes out its first Zeus GPU test chip on TSMC 12nm — firm touts 17x lower cost of compute Elon Musk says his TeraFab facilities will use Intel TSMC unveils process technology roadmap through 2029 — A12, A13, N2U announced, A16 slips to 2027 Congress moves to strip the DoC of chip-export discretion with the MATCH Act — DUV lithography machines among those targeted in chipmaking tool crackdown Enthusiast builds his own RAM in garden shed cleanroom — fledgling array of memory cells groundwork for much larger future project 40 years ago we entered the megabit memory era with IBM’s DRAM breakthrough — a major leap beyond the 64 kilobit chips common at the time US lawmakers amend new restrictions on Chinese chipmakers — MATCH Act Intel hires tenured Samsung exec to lead Foundry Services — signals company focus on winning business from potential Foundry suitors Elon Musk pushing forward with Terafab at TSMC ups revenue guidance and CapEx, buoyed by TSMC warns of Intel Foundry YMTC China Intel's EMIB-T packaging technology set for fab rollout this year — as TSMC CoWoS capacity remains limited, EMIB-T is preparing for advanced AI accelerator designs China intensifies efforts to poach semiconductor talent from Taiwan, claims report — international restrictions… Intel joins Elon Musk's TeraFab project — 'Intel is proud to join the Terafab project with SpaceX, xAI, and Tesla to help refactor silicon fab technology' Intel reportedly in talks with Google and Amazon over advanced packaging — major customers could take advantage of… US lawmakers aim to ban export of DUV chipmaking and etching tools to leading firms in China — bipartisan proposal would ban lithography equipment for Huawei, SMIC, and others Intel buys back 49% stake in Ireland Fab Joint Venture — takes full control over Fab 34 The global helium shortage is a direct threat to the chipmaking supply chain — disruption impacts critical processes, high-capacity HDDs, and alternative supplies are plagued by delays TSMC industrial espionage saga heading to verdict next month in unprecedented Taiwan National Security Act case — former engineer accused of stealing 2nm technical info, faces a total of up to 20 years in prison if found guilty Analyzing Elon Musk's TeraFab — A step towards Tesla and SpaceX's partial vertical integration, or an… Chinese chip industry leaders admit the country lags five to ten years behind in AI data center chips — AI demand is straining equipment and talent supply Air Liquide opens Taiwan factory as helium shortage tightens around chip makers — 200 specialized helium containers stranded near the Strait of Hormuz Elon Musk's Terafab semiconductor project could cost $5 trillion, Bernstein claims — herculean effort would cost more than 70% of the total yearly US government budget SK hynix places record $8 billion order for ASML EUV lithography machines — should pay for up to 30 EUV machines over two years, serving HBM and advanced DRAM production Microsoft-backed start-up raises $40 million for helium atom beam lithography that could print chips at atomic resolution — 0.1nm beam is 135 times narrower than ASML's EUV light Trump administration targets $4 trillion Pax Silica investment fund for semiconductors — the US will start with a… Elon Musk unveils $20 billion ‘TeraFab’ chip project to make chips, memory, and package processors all under one roof — targets a terawatt of annual compute 'Silicon' is a new five-pound art book charting the semiconductor revolution with full-page die shots and commentary — 384 page tome is $99 to pre-order now Supermicro employees accused of smuggling $2.5 billion worth of Nvidia hardware to China — perps used a hairdryer to move serial numbers between real hardware and thousands of dummy servers Tesla hiring semiconductor fabs construction manager — Elon Musk's ambitious Terafab project begins How Nvidia's $20 billion Groq 3 LPU deal reshapes the Nvidia Vera Rubin Platform — Samsung 4nm process serves as bedrock for SRAM-based AI accelerator chip Researchers reach superconductivity at ambient pressure, record high temperature — milestone of -122°C reached by using pressure quenching, still 140 degrees off room temperature target AMD and Samsung ink memory supply memorandum for EPYC and Instinct products — unprecedented deal also includes… Meta's new MTIA lineup joins hyperscalers' unified push for dedicated inferencing chips — companies diversify AI chips in effort to diversify from sole reliance on Nvidia Intel's roadmaps examined — 14A, Nova Lake, Diamond Rapids & AI accelerator push STMicro to deploy humanoid robots to its legacy fabs in Europe — over 100 humanoid robots to be used for routine and physically demanding tasks in fight for efficiency Elon Musk says his chipmaking 'Terafab Project' venture will launch in seven days — Musk's latest moonshot multi-billion project launches on a Saturday IBM and Lam's new partnership paves the way toward sub-1nm logic using High-NA EUV — Albany lab to pioneer… Meta reveals four new MTIA chips built for AI inference — to be released on a six-month cadence IBM and Lam Research team up on High NA EUV dry resist to push chip scaling past 1nm Ambitious semiconductor enthusiast builds DIY 'class 100 cleanroom' in his garden shed — contains a plasma etcher, vacuum furnace, and even custom software-driven lithography machine China's top chip execs claim ASML alternative 'small, fragmented, and weak' — Chinese industry titans call for national effort to invest in advanced chipmaking tools Intel CEO embraces its 18A node for external customers as 18A-P gets 'inbound interest' — company cites… ISSCC 2026: Rebellions details industry's first quad-chiplet AI solution with UCIe interconnects — claims Rebel100 AI accelerator equals the power of Nvidia H200 with lower power envelope ISSCC 2026: AMD discloses how the Instinct MI355X doubled per-CU throughput despite lower compute unit count — 'We are actually matching the performance of the more expensive and complex GB200' Rapidus secures $1.7 billion from Japan’s government and private investors for 2nm chip production — company says it is in active discussions with more than 60 potential customers Imec's new post-exposure bake method speeds up EUV chipmaking tools, boosting production for the most advanced chips — 20% gain in photoresist improvement from increased oxygen concentration Intel Foundry boss leaves for Qualcomm — Naga Chandrasekaran takes charge of the unit Chipmakers still suffering from rare earth shortages, says report — US-China trade truce apparently still hasn’t eased pressures despite agreement taking place in October last year China to increase leading-edge chip output by 5x in two years, report claims — aims to lift 7nm and 5nm production to 100,000 wafers per month, targeting half a million monthly by 2030 US gov't warned Nvidia CEO Jensen Huang, Tim Cook, and Lisa Su that China could invade Taiwan by 2027 — Apple CEO reportedly said he sleeps 'with one eye open' ASML makes breakthrough in EUV chipmaking tech, plans to increase speed by 50% by 2030 — new 1,000-watt light source fires three lasers at 100,000 tin droplets every second The state of China's decade-long semiconductor push: still a decade behind, despite hundreds of billions spent and significant progress — examining the original 'Made in China 2025' initiative TSMC considers an additional $100 billion investment into Arizona fabs to bolster American chipmaking efforts — move would help TSMC's chips avoid tariffs due to local production Rapidus targets mass 2nm chip production in 2027, quadruples capacity ramp up — company plans to scale to 25,000… Tachyum forced to shutter R&D office due to unpaid rent, wages, and taxes — firm still claims forthcoming Prodigy chip will have a 21x performance leap on Nvidia Rubin Ultra Cadence embeds AI 'super agent' to assist engineers when designing EDA tools — company aims for ‘over a trillion transistors’ by 2030, with AI helping to debug and verify complex projects Memory hoarding and skyrocketing prices hit entry-level electronics demand, foundry orders — China's top chipmaker points to supply chain pressures squeezing out consumers U.S. lawmakers demand sales ban on chipmaking tools to China — bipartisan group targets ASML's Dutch exports of lithography machines used to create advanced chips Memory makers are set to earn $551 billion from the AI boom, twice as much as contract chip manufacturers — forecasts suggest that 2026 revenue will skyrocket thanks to data center demand

ashilov@gmail.com (Anton Shilov) · 2026-04-03 · via Latest from Tom's Hardware in Semiconductors

此内容由惯性聚合(RSS阅读器)自动聚合整理，仅供阅读参考。原文来自 — 版权归原作者所有。

推荐订阅源

Latest from Tom's Hardware in Semiconductors