惯性聚合 高效追踪和阅读你感兴趣的博客、新闻、科技资讯
阅读原文 在惯性聚合中打开

推荐订阅源

Martin Fowler
Martin Fowler
J
Java Code Geeks
博客园 - 【当耐特】
宝玉的分享
宝玉的分享
腾讯CDC
D
DataBreaches.Net
Microsoft Azure Blog
Microsoft Azure Blog
Engineering at Meta
Engineering at Meta
V
V2EX
F
Fortinet All Blogs
MyScale Blog
MyScale Blog
让小产品的独立变现更简单 - ezindie.com
让小产品的独立变现更简单 - ezindie.com
T
Tailwind CSS Blog
Jina AI
Jina AI
GbyAI
GbyAI
大猫的无限游戏
大猫的无限游戏
A
About on SuperTechFans
酷 壳 – CoolShell
酷 壳 – CoolShell
爱范儿
爱范儿
OSCHINA 社区最新新闻
OSCHINA 社区最新新闻
U
Unit 42
B
Blog
M
MIT News - Artificial intelligence
N
Netflix TechBlog - Medium

Latest from Tom's Hardware in Semiconductors

Post-silicon era gets closer as industry giants crack the 2D transistor scaling bottleneck with breakthrough tech — imec, ASML, and TSMC fab complementary 2D-material transistors at 50nm pitch on a 300mm wafer Intel Intel’s performance-enhanced 18A-P process enters risk production — drop-in 18A upgrade promises 9% performance improvement at iso-power, cuts thermal resistance by 40% Chinese fab SMIC TSMC says panel packaging won Analyzing TSMC's fab expansion roadmap — multi-fab N2 ramp, CoWoS, SoIC, and uncorking bottlenecks Chinese startup claims photonic chip production without DUV lithography, says nanoimprint process cuts costs by 90%… ASML becomes Europe's most valuable company ever as analysts bet on higher EUV output — its market cap hit… TSMC CEO C.C. Wei says, ‘It will be a long time before we can meet customer demand’ — tells shareholders that he will keep prices stable, refrain from implementing price hikes Samsung shows first HBM5 mockup with Heat Path Block cooling — thermal race with SK hynix shaping up Seven hospitalized after toxic gas fire at SK hynix advanced memory plant — Cheongju 4th campus incident today led… TikTok owner ByteDance is reportedly developing its own custom AI CPUs — company looks to ease China's… Trailing-edge foundry roadmaps for GlobalFoundries, UMC, and SMIC — mature node chipmakers each pursue differing… Chinese university builds 3D chip design tool tailored to Huawei's ‘LogicFolding’ architecture — 3D design delivers increased performance and better thermal management China adds homegrown AI chips to 'secure and reliable' procurement list for the first time — nine options added as move away from Nvidia continues SK hynix unveils 'iHBM' thermal architecture that cools AI memory at the source — integrated cooling elements inside HBM interface cut thermal resistance by 30%, target next-gen HBM5 accelerators and dense AI data centers Imec builds world's first High-NA EUV-fabricated quantum dot qubit device — breakthrough could pull quantum computing onto the same manufacturing roadmap as next-gen AI processors, compressing timelines Huawei claims sanctions-busting breakthrough with 1.4nm-class chips by 2031, claims 55% higher transistor density — firm claims new LogicFolding chip architecture can bypass EUV restrictions, introduces 'Tau Scaling Law' to replace Moore's Law Samsung's $400,000 payout for memory workers sparks revolt as other divisions get only $4,000, fueling intentional production slowdowns — internal resentment disrupts packaging operations, major AI chip project decisions to a complete halt The custom AI ASIC state of play (May 2026) — Broadcom deals, Google TPUs, Meta MTIA & beyond AMD begins production ramp of 256-core EPYC Venice — first 2nm HPC chip claims 70% performance leap Intel kicks off development on next-decade 10A and 7A process technologies — 14A node remains on track for… SMIC founder and AMEC CEO urge Chinese fabs to test domestic chipmaking tools on active production lines — equipment makers post record revenue but falling margins Russia’s Mikron is selling framed test wafers with up to 120,000 processors as souvenirs — 12 designs, priced around $170 each, sold alongside $2 vials of cleanroom air Trump calls $14 billion Taiwan arms deal a 'negotiating chip' with China after Xi said Taiwan issue could lead to 'clashes and even conflicts' — Trump says 'Taiwan would be very smart to cool it a little bit' Leading-edge foundry roadmaps for TSMC, Intel and Samsung — outlining the path to 1.4nm nodes and beyond TSMC allocates $20 billion to Arizona expansion — project faces water and labor shortages, complicated by visa… NASA partners with Microchip to build next-generation spaceflight chips with 100x the power of current offerings — chip designed to withstand radiation for extended missions on the Moon and Mars Intel, SK hynix shares surge following reports of chip packaging partnership — SK is said to be testing… Apple reportedly strikes deal for Intel to make some of its chips — two tech giants reached a preliminary…
TSMC considers an additional $100 billion investment into...
Anton Shilov · 2026-02-16 · via Latest from Tom's Hardware in Semiconductors
TSMC
(Image credit: TSMC)

As part of the recently concluded trade arrangement between the U.S. and Taiwan, Taiwanese companies including TSMC will invest $250 billion in the U.S. in exchange for exemptions from potential chip tariffs, Financial Times reports.

Limited disclosure around the terms of this commitment has introduced major uncertainties regarding TSMC's future capital spending, manufacturing allocation, and long-term strategy, however. And meanwhile, a market rumor suggests that TSMC may invest an additional $100 billion in its U.S. facilities, bringing its total commitments to $265 billion — and making TSMC one of the biggest ever investors in America.

The $250 billion figure largely reflects previously announced plans, and TSMC is projected to be the biggest spender. The company has already committed $165 billion to its Fab 21 campus in Arizona, which includes six fab modules, two advanced packaging facilities, and a research and development center. According to U.S. commerce secretary Howard Lutnick, roughly $100 billion of TSMC’s existing commitments are included in the investment total, and TSMC's supply chain partners are projected to contribute about $30 billion.

According to market rumors, TSMC may invest an additional $100 billion to construct four more fab modules in Arizona in a bid to avoid tariffs. TSMC's recent acquisition of approximately 900 acres of land adjacent to its existing 1,100-acre site supports the possibility of expansion on that scale.

Other Taiwanese companies, including Foxconn, are expanding U.S. capacity to assemble AI servers, though these projects are considerably less capital-intensive and are expected to total no more than $20 billion, according to Financial Times.

The arrangement reportedly allows companies building U.S. facilities to import chips tariff-free at up to 2.5 times the planned capacity during construction, followed by a reduced quota equivalent to 1.5 times capacity once production begins, Financial Times reports. Analysts say that once the new fabs finish construction, the temporary rule allowing higher tariff-free import volumes will expire. After 2032, this could leave TSMC without enough U.S. capacity to keep all shipments to American customers exempt from tariffs, which is why the company may need to build additional fabs by around 2035 to maintain full tariff-free coverage, according to Financial Times.

Even if the Arizona complex ultimately reaches its theoretical capacity — 10 fab modules, at least two advanced packaging facilities, and an R&D center — TSMC's presence in the U.S. is poised to remain considerably smaller than its operations in Taiwan. For now, TSMC estimates that up to 30% of its chips on N2 (2nm-class) and more advanced process technologies will be made in America. Taiwanese officials have rejected suggestions that 40% - 50% of semiconductor production on the island could shift overseas, particularly to the U.S.

Get Tom's Hardware's best news and in-depth reviews, straight to your inbox.

It should be noted that only $8.2 billion of Taiwan’s $198 billion in exports to the U.S. in 2025 consisted of standalone semiconductors. Most chips made in Taiwan enter the U.S. being installed into finished goods spanning from smartphones to AI servers, which greatly complicates tariff enforcement as importers may struggle to identify or report the value of individual chips. As a result, many observers wonder whether such tariffs could be practically collected.

Google Preferred Source

Follow Tom's Hardware on Google News, or add us as a preferred source, to get our latest news, analysis, & reviews in your feeds.

Anton Shilov is a contributing writer at Tom’s Hardware. Over the past couple of decades, he has covered everything from CPUs and GPUs to supercomputers and from modern process technologies and latest fab tools to high-tech industry trends.