惯性聚合 高效追踪和阅读你感兴趣的博客、新闻、科技资讯
阅读原文 在惯性聚合中打开

推荐订阅源

Google Online Security Blog
Google Online Security Blog
S
Security @ Cisco Blogs
Recent Commits to openclaw:main
Recent Commits to openclaw:main
人人都是产品经理
人人都是产品经理
The Hacker News
The Hacker News
W
WeLiveSecurity
freeCodeCamp Programming Tutorials: Python, JavaScript, Git & More
OSCHINA 社区最新新闻
OSCHINA 社区最新新闻
The Cloudflare Blog
博客园 - 司徒正美
雷峰网
雷峰网
L
LINUX DO - 最新话题
博客园 - 叶小钗
云风的 BLOG
云风的 BLOG
The Last Watchdog
The Last Watchdog
V2EX - 技术
V2EX - 技术
S
Security Affairs
有赞技术团队
有赞技术团队
月光博客
月光博客
T
Threatpost
T
Tor Project blog
O
OpenAI News
cs.AI updates on arXiv.org
cs.AI updates on arXiv.org
cs.CL updates on arXiv.org
cs.CL updates on arXiv.org
V
V2EX
Know Your Adversary
Know Your Adversary
Project Zero
Project Zero
博客园 - 三生石上(FineUI控件)
D
Docker
AWS News Blog
AWS News Blog
AI
AI
P
Proofpoint News Feed
K
Kaspersky official blog
H
Hackread – Cybersecurity News, Data Breaches, AI and More
D
Darknet – Hacking Tools, Hacker News & Cyber Security
www.infosecurity-magazine.com
www.infosecurity-magazine.com
S
Securelist
F
Fortinet All Blogs
F
Full Disclosure
cs.CV updates on arXiv.org
cs.CV updates on arXiv.org
量子位
Hacker News - Newest:
Hacker News - Newest: "LLM"
CTFtime.org: upcoming CTF events
CTFtime.org: upcoming CTF events
P
Palo Alto Networks Blog
Cyberwarzone
Cyberwarzone
Cisco Talos Blog
Cisco Talos Blog
美团技术团队
N
News | PayPal Newsroom
T
The Blog of Author Tim Ferriss
MyScale Blog
MyScale Blog

... eeNews Europe

Molex Teramount deal targets co-packaged optics NVIDIA and ServiceNow extend AI governance from desktops to data centres Faraday Future launches Physical AI robotics institute with BIBS System Check: Should engineers learn analog? Decoupled by Design: How Gateworks and NXP are rethinking edge AI architecture NVIDIA and Corning partner on AI photonics expansion GCT taps satellite partner to speed 5G rollout Sodankylä supersite to support ESA Earth observation SiTime posts 88% revenue growth on AI infrastructure demand Infrared LEDs support in-cabin sensing for vehicle safety Anthropic compute deal taps SpaceXAI Colossus 1 Quantum Brilliance CEO Mark Luo on deployable quantum systems and the future of diamond-based computing SEMI Summit spotlights Europe’s chiplet and packaging push AI data center infrastructure drives Pennsylvania energy expansion NXP CoreRide gains Vector software support for SDV platforms Elektor Lab Talk covers Red Pitaya and reconfigurable test gear SEMI names Julie Rogers to lead ESD Alliance ASML CEO backs joint call for Europe tech competitiveness push FlexIC RFID inlays bring NFC to paper packaging ROHM targets smart rings with ultra-compact NFC wireless power chipset China silicon wafers push boosts Eswin capacity ESD Alliance outlook spotlights agentic AI in chip design AI robotics sales growth rises as Faraday Future expands into education Microchip expands dsPIC33A controllers for AI data center power sensiBel MEMS microphone heads to Silex production SEMI: Global silicon wafer shipments jump 13% on AI demand AI drives photonics innovation Advantech adds Intel Core Series 3 to edge AI systems NI CHESS enables software-driven RF channel emulation into aerospace testing Forsee Power battery system powers new electric fire pump Advantech brings agentic AI to Jetson Thor edge platforms Rohde & Schwarz adds Pulsar signal simulation for LEO navigation UL Solutions builds new testing lab in Germany IonQ and Florida LambdaRail roll out US quantum-safe network initiative Tower Semiconductor and Axiro push high-efficiency SiGe for next-gen radar TSMC SoIC roadmap targets 2029 chip stacking Robotics development platform links EBV ecosystem for system design onsemi and Geely expand SiC collaboration for next-gen EV platforms Satellite connected cattle collars expand remote ranching SK hynix begins mass production of 192GB AI server memory 2Trust.AI and Carahsoft partner to scale AI governance for public sector Cerebras IPO filing revives AI chipmaker’s market push Omdia raises 2026 semiconductor forecast to 62.7% IQM to deploy Japan’s first enterprise quantum computer at TOYO TTM Technologies announces 2026 Investor Day event MATCH Act targets chip tool exports to China Musk teams with Intel for Terafab plans Siemens and TSMC expand AI-driven chip design collaboration Altilium EV battery recycling expands with new investment round Marvell acquires Polariton for optical scaling Credo to unveil AI interconnect solutions at TSMC 2026 Symposium Gartner projects IT spending at $6.31 Trillion in 2026 on AI surge Quectel expands IoT reach in Brazil with Vermont partnership Autonomous material handling stack links Thoro and Orbbec ROHM advances SiC MOSFETs for high-temperature power systems ST targets wide-voltage precision with new op amps NVIDIA and Google Cloud target physical AI factories OE-A publishes 10th edition of “Roadmap for Flexible and Printed Electronics” HCLTech FY26 revenue rises 3.9% as Advanced AI demand accelerates Infineon joins European quantum pilot lines for quantum chips Iran network backdoors claim hits Cisco, Juniper, Fortinet CVD Equipment advances SiC cystal growth with university collaboration EU unlocks €63M to accelerate AI in health and safety GTT targets AI networking growth with 2026 strategy Apple CEO transition as Tim Cook hands over to John Ternus Race Rock sign clamp gets TxDOT approval SEMI forum targets Europe’s semiconductor strategy Smartphone memory shortage to cut 2026 shipments: IDC Vector adds charging communication security tests to CANoe EV package Elektor to host EEI #59 on DIY synths and the Formant Nordic Semiconductor appoints Jo Uthus as EVP of Marketing and Developer Experience ADIOS first order tops $1 million as supply risks rise AMD partners with France to power AI research and exascale supercomputing EU updates tech licensing competition rules for the data era AECC rolls out data first architecture for automotive services Infineon rad-hard semiconductors validated in Artemis II mission Chinese chip tool makers hit record 2025 revenues UK experiment studies microgravity effects using worms on the ISS TSMC Q1 revenue tops $35.9bn on strong 3nm demand NVIDIA launches Ising AI models to accelerate quantum computing ASML reports €8.8bn Q1 revenue Zephyr RTOS 4.4 adds WireGuard, Wi-Fi Direct and OpenRISC Key quantum innovations covered by eeNews Europe MIT underwater robot teaming targets cable inspection Intel and Google expand AI infrastructure partnership SEALSQ and Kaynes advance India’s PQC chip hub Intel to reacquire 49% share of Ireland fab joint venture Intel names Aparna Bawa as Chief Legal & People Officer Stryten launches E-Series AGM batteries for telecom and utility reliability GaN gate drivers integrate protection for motion control and power systems System Check: are engineering certificates worth it? Pasqal partners with True Nexus on quantum food protein design Rigetti launches 108-qubit quantum system Undersea cable security drives UK warning to Russia The race to secure data Low-RDS(on) MOSFETs in automotive power systems SiFive funding backs datacentre CPU push Eclipse hawkBit 1.0 released for open-source IoT software updates Intel and SambaNova target agentic AI inference with Xeon 6 Vadzo publishes GMSL camera guide for embedded vision
EU invests €400m in electrified industrial heat systems
Asma Adhimi · 2026-05-27 · via ... eeNews Europe

EU invests €400m in electrified industrial heat systems

News |

By Asma Adhimi



The European Commission has selected 65 projects across Europe to share around €400 million in funding aimed at cutting industrial emissions through cleaner heat production technologies. The projects were chosen under the first Innovation Fund Heat Auction, an EU-wide initiative designed to accelerate the deployment of low-carbon industrial heating systems.

The selected projects span 10 countries including Germany, France, Spain and Denmark, and cover technologies ranging from industrial heat pumps and solar thermal systems to electric resistance heating. Together, the projects are expected to avoid more than 6.6 million tonnes of CO2 emissions over the next decade.

For eeNews Europe readers, the programme highlights the growing commercial and political momentum behind industrial electrification and process heat decarbonisation. It also signals significant opportunities for suppliers of power electronics, thermal management systems, industrial automation and renewable energy technologies.

Electrification gains momentum

Most of the successful projects rely on direct or indirect electric resistance heating, underlining the increasing role of electrification in hard-to-abate industrial sectors. Moreover, other projects involve hybrid systems, electromagnetic heating, dielectric heating and large-scale heat pumps.

The Commission said the projects are expected to generate around 16.3TWh of decarbonised heat during their first five years of operation, supported by a combined thermal capacity of 766MW. According to the Commission, that would replace more than 1.5 billion cubic metres of natural gas — equivalent to the annual gas consumption of around 4 million EU households.

Industrial sectors covered by the programme include pulp and paper, glass, ceramics, construction materials, iron and steel, food and beverage, textiles and pharmaceuticals.

The funding comes from revenues generated by the EU Emissions Trading System (ETS) and forms part of the wider Innovation Fund, which has an estimated €40 billion budget between 2020 and 2030.

Pilot for future decarbonisation bank

The auction is also being positioned as a pilot scheme for the future Industrial Decarbonisation Bank, intended to scale up investment into low-carbon industrial technologies across Europe.

“This is a real game changer for EU decarbonisation,” said Wopke Hoekstra. “The projects span technologies from heat pumps and solar thermal to electric resistance heating. Collectively, they are expected to replace more than 1.5 billion cubic metres of natural gas over the next five years — roughly equivalent to the annual gas consumption of 4 million EU households. A win for climate, competitiveness, and energy independence.”

The projects will now move into grant agreement negotiations with the European Climate, Infrastructure and Environment Executive Agency (CINEA). Agreements are expected to be signed during the second half of 2026.

Projects must reach financial close within two years and enter operation within four years of signing.

The Commission has already started preparations for a second Heat Auction round in 2026, with a planned budget of €1 billion, reflecting strong industry interest. The first call attracted 85 applications with nearly €10 billion worth of bids for decarbonisation support.

If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :

   eeNews on Google News