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[News] ASE Reportedly Raises Advanced Packaging Quotes by More Than 20% in Latest AI-Driven Price Hike [News] Musk’s TeraFab Lands First Major Hire as 18-Year Intel Veteran With 18A Experience Joins as Director [Insights] Memory Spot Price Update: DRAM Spot Prices See Gains in Low-Density DDR4 and DDR3 Amid Sideways Market [News] Passive Component Prices Rise as YAGEO Reportedly Begins Broadest Capacitor Hike in Years on July 1 [News] Intel Reportedly Breaks Ground on Santa Clara Expansion for Next-Gen EUV Mask Capacity [News] World’s First Mass-Production Line for 6-/8-Inch Homoepitaxial Gallium Oxide Wafers Comes Online [News] Samsung Electro-Mechanics Lands KRW 450B 1-Year MLCC Contract as AI Spurs Long-Term Agreements [News] Raw Material Inflation Deepens: FULLTECH Hikes Glass Fiber Cloth Prices Up to 30%; VPEC Adjusts Epi Wafer Prices [News] Samsung Reportedly Restarts 1.4nm Push, Targets 2029 Mass Production to Close Gap with TSMC, Intel [News] ByteDance Reportedly Eyes Next-Gen In-House CPU for 2H27 Mass Production; May Partner With Qualcomm [News] Samsung, SK hynix 800 Trillion Won Expansion Strains Chipmaking Tool Supply, Potentially Pressures TSMC, Intel [News] Goertek-Backed 12-Inch AR Optical Wafer Fab Commenced Production [News] China Signs First Domestic Ultra Wide Bandgap Semiconductor Full-Chain Project [News] Samsung, SK hynix, Micron Face U.S. Class-Action Lawsuit Over Alleged DRAM Supply Manipulation [News] Korea’s High-Purity CO₂ Inventory Reportedly Falls Below One Month; Samsung, SK hynix Under Pressure [News] TSMC’s 2Q Margins Reportedly Near 70% amid Strong 3/5nm Demand, 3Q Revenue Seen Growing Over 10% [Sponsored Content] Where Do You Stand as AI Reshapes Industries? [News] Mapping the Micro LED Optical Interconnect Ecosystem [News] Asian Memory Makers Turn to U.S. Capital Markets: SK hynix and Kioxia Advance ADR Plans [News] Lenovo Reportedly Sees Higher Memory Prices Becoming the New Normal Into 2030 [News] TSMC on Terafab: No Shortcuts in Foundry; Confirms Next-Gen LPU Project amid Samsung Rivalry [News] TSMC N3 Tightens on AI Demand; Arizona 2nd Fab 3nm Volume Production in 2H27, Kumamoto in 2028 [News] TSMC Sees 2Q Sales Up 10% QoQ to $40.2B; Margins Rise to 65.5%–67.5%, Capex at Top End of $52–56B [News] TSMC 1Q26 Net Income Soars 58% YoY to NT$572.5B Record, EPS NT$22.08; Gross Margin Beats Forecast at 66.2% [News] Tesla AI5 Reportedly Uses SK hynix Memory, Samsung LPDDR5X; Samsung SF2T Process Applied Ahead of AI6 [News] TSMC 1Q Profit Seen Up ~50% to Record; Meta–Broadcom AI Chips Reportedly Target 2nm, CoWoS-L in 1H27 [News] San’an Announced Three Advances in Optical Communications Business [News] Intel Reportedly to Brief Staff on TeraFab Involvement in Coming Weeks, While Key Foundry Details Remain Limited [News] ASML Raises 2026 Sales Outlook to €36B–€40B on Memory, Logic Demand; South Korea Share Hits 45% [News] Chinese Startup Dishan Reportedly Develops 2nm AI Chip in Prototype Verification; Foundry Access Uncertain [News] Musk Confirms AI5 Tape-Out, but Wrong TSMC Tag Triggers Social Media Mix-Up [News] China Reportedly Sees Record 2025 Chip Tool Imports from Singapore, Malaysia; U.S. Hit Lowest Since 2017 [Insights] Memory Spot Price Update: DRAM Spot Sellers Hold Firm Ahead of Mid-April Pricing, DDR4 Edges Lower 0.48% [News] HBM4 Strategies Diverge: Samsung Reportedly Chases 80% 1c DRAM Yield While SK hynix Trims Shipments by 30% [News] Korea Challenges Intel on Glass Substrate Standards as Absolics, Samsung Accelerate Commercialization [Insights] NVIDIA’s US$2B Marvell Deal: What’s the Strategic Significance for CPO and AI Interconnects? [News] Samsung Reportedly Lifts HBM4 Logic Die Prices by 40–50% Amid AI Boom; 4nm at Full Capacity [News] Huawei Takes Early Lead in Horizontal Foldable Race vs Samsung and Apple, Eyes April Pura X Max Launch [News] China Reportedly Closes AI Performance Gap with U.S., Stanford Report Says; Anthropic Leads by Just 2.7% [News] Samsung 2nm Yields Reportedly at ~55%, Below Mass Production Threshold; Qualcomm May Opt for TSMC [Insights] Memory Spot Price Update: DDR4 Spot Prices Climb as Samsung Holds EOL Line [News] TSMC May Fast-Track 1.4nm at Central Taiwan Science Park as 2nm Yields Reportedly Beat Expectations [News] Micron Reportedly Weighs Acquiring PSMC 12-Inch Tongluo Fab, With Multiple Partners Also Interested [News] ASUS to Raise Prices on Selected PC Lines from Jan. 5 Amid Memory Cost Surge, Following Dell [News] 2025 Tech Layoffs: Meta, Amazon, Microsoft and Others Cut Tens of Thousands of Roles [News] Sony, Microsoft Reportedly Weigh Delaying Next-Gen Game Consoles Beyond 2028 Amid Memory Price Surge [News] Samsung Reportedly Plans 50% HBM Capacity Surge in 2026, Spotlight on HBM4 [News] China Diversification Reportedly Lifts Mature-Node Foundries UMC, VIS, PSMC Despite Tariff Delay [News] Samsung, SK hynix Escape Worst-Case as China VEU Ends: Annual Review Risks Loom [News] TSMC Advanced-Node Materials Reportedly Found at Lo’s Residence Amid Controversial Intel Hire [News] NVIDIA’s $20B Groq Deal Spotlights SRAM Shift—MediaTek NPU Already On Board [News] Chinese Scientists Achieved New Breakthrough in Next-Gen Optical Computing Chips [News] Five-Year-Old Chinese EDA Firm Univista Sets Sights on IPO, Led by Ex-Synopsys and Cadence Team [News] Samsung Reportedly Pushes In-House CPU and GPU for Exynos 2800 to Cut Qualcomm, AMD Reliance [News] SK hynix Reportedly Plans First U.S. 2.5D Packaging Line, Eyes Turnkey HBM to Challenge TSMC [News] TSMC Reportedly to Raise Sub-3nm Prices 3-10% in 2026, Plans Hikes Through 2029 [News] Samsung Emerges as Potential Second Foundry for NVIDIA Alongside TSMC After Groq Licensing Deal [News] 7.0 Quake Hits: TSMC Nears Full Production, Sector Losses Reportedly Tens of Billions NTD [News] NVIDIA Reportedly Denies USD 20B Groq Acquisition Rumors
[News] SLC-Based AI SSDs Gain Traction as SK hynix and Kioxia Accelerate Development With NVIDIA
2025-12-29 · via TrendForce


AI is reshaping the data center SSD market, with SLC-based AI SSDs gaining traction as a next-generation storage solution. According to ZDNet, data center SSDs have traditionally prioritized higher storage capacity, but major memory companies are now shifting toward SLC (single-level cell)–based designs to maximize data-processing performance.

The data center SSD market has traditionally been dominated by TLC and QLC technologies, as storing more bits per cell enables much higher data density per unit area. The report notes that demand continues to climb in AI data centers, where massive volumes of data must be processed, leading to increasing interest in SLC. However, it also notes that while SLC offers faster performance and greater reliability, it has long been viewed as impractical for large-scale data center deployments due to its limited capacity and higher costs.

SK hynix and Kioxia Accelerate SLC-Based AI SSD Development

As the report notes, SK hynix is developing its “AIN Family” lineup for the AI data center market, targeting three core dimensions: AI-N P (performance), AI-N B (bandwidth), and AI-N D (density). The company says AI-N P is being built on SLC NAND and is designed to efficiently handle massive data input and output in large-scale AI inference environments.

Notably, the report says the first-generation product delivers up to 25 million IOPS (input/output operations per second), roughly eight to ten times higher than current high-performance SSDs, which typically peak at around 3 million IOPS. The report adds that a second-generation version, targeted for readiness for mass production by the end of 2027, is expected to reach as high as 100 million IOPS.

NVIDIA Partnerships Drive Next-Gen AI SSD Development

To achieve these performance targets, SK hynix is redesigning both the NAND and the controller using a new architecture. As the report highlights, the company is also working closely with its key customer, NVIDIA, and plans to unveil the first samples by the end of 2026. Alongside SK hynix’s efforts, the report notes that Japan’s Kioxia plans to commercialize next-generation SSDs delivering 100 million IOPS in cooperation with NVIDIA by 2027, and the products are likewise expected to be based on SLC NAND.

NVIDIA has identified SLC NAND as a key enabler of next-generation AI storage, according to the report. The company is developing a software platform called SCADA (SCaled Accelerated Data Access) to support SLC NAND deployment. As the report notes, by bypassing conventional architectures—where data is first read from SSDs by the CPU before being passed to the GPU—SCADA shortens the data path and improves both training and inference speed and efficiency. The report adds that delivering NVIDIA’s SCADA solution requires a substantial leap in SSD performance, spurring major memory suppliers to race toward next-generation SSDs capable of exceeding 100 million IOPS.

HBF Emerges as SLC-Based AI Storage Technology

In addition, HBF (High Bandwidth Flash) is also being developed using SLC NAND. By stacking NAND dies, HBF significantly expands data-transmission bandwidth. SK hynix is currently working with SanDisk on standardization efforts, with a proof-of-concept (PoC) sample expected in 2027, followed by full-scale evaluation, the report adds.

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(Photo credit: SK hynix)

Please note that this article cites information from ZDNet.