Imec's semiconductor process technology roadmap sets the general direction of industry development and showcases the challenges the sector is set to face over the next few decades. The roadmap gives us an idea of the timelines for the next major process nodes and transistor architectures the company will research and develop in cooperation with industry giants, such as TSMC, Intel, Nvidia, AMD, Samsung, and ASML, among many others.
Imec's latest production node roadmap shows that the international research and development organization envisions 3 angstrom-class (0.3nm) fabrication technologies by 2038, but expects contact poly pitch (CPP) to stop scaling at A10 in 2030. While things might not be looking great for Moore's Law for imec, to continue scaling the chipmaker will need to adopt new technologies, such as CFET transistors and likely Hyper-NA EUV Lithography systems.