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By Asma Adhimi
Europe’s semiconductor industry will put advanced packaging and heterogeneous integration in the spotlight next month as the SEMI 3D & Systems Summit returns to Dresden, Germany. Running from June 17–19, the event will bring together chipmakers, equipment suppliers and research organisations to discuss AI hardware, chiplets, hybrid bonding and co-packaged optics.
The summit comes as Europe looks to strengthen its semiconductor position amid growing geopolitical pressure and rising demand for AI-focused hardware platforms. For eeNews Europe readers, the event highlights where European companies and research institutes are focusing investment and innovation in next-generation semiconductor packaging and system integration technologies.
Under the theme “Enabling Next-Gen Heterogeneous Systems Integration,” the conference programme will cover everything from advanced packaging capacity and AI system architectures to AR/VR devices and wearable intelligence.
One major focus will be Europe’s emerging chiplet ecosystem, with discussions around 3D integration strategies, CPU startups and system-level semiconductor design. Other sessions will explore hybrid bonding technologies, including die-to-wafer and wafer-to-wafer approaches for high-density integration and memory stacking.
Photonics and co-packaged optics will also feature heavily as the industry looks for more efficient ways to move data in AI accelerators and high-performance computing systems.
“We look forward to welcoming industry leaders, innovators, and researchers to the 3D & Systems Summit 2026 in Dresden,” said Laith Altimime. “As heterogeneous integration, chiplet architectures, and advanced packaging redefine system performance, the Summit provides a critical platform to align technology roadmaps, accelerate innovation, and strengthen Europe’s position in next-generation semiconductor systems.”
The speaker lineup includes representatives from ASML, GlobalFoundries, NXP Semiconductors, STMicroelectronics and research organisations including imec and CEA-Leti.
Alongside the summit, SEMI Europe has also opened the call for abstracts for its 2026 Advanced Packaging Conference, which will focus on power and interconnect innovations for AI systems, HPC, automotive and edge applications.
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