惯性聚合 高效追踪和阅读你感兴趣的博客、新闻、科技资讯
阅读原文 在惯性聚合中打开

推荐订阅源

U
Unit 42
C
Cybersecurity and Infrastructure Security Agency CISA
Exploit-DB.com RSS Feed
Exploit-DB.com RSS Feed
Know Your Adversary
Know Your Adversary
S
Securelist
I
Intezer
AWS News Blog
AWS News Blog
L
LINUX DO - 热门话题
P
Privacy International News Feed
Recent Announcements
Recent Announcements
cs.CL updates on arXiv.org
cs.CL updates on arXiv.org
博客园 - 聂微东
Threat Intelligence Blog | Flashpoint
Threat Intelligence Blog | Flashpoint
Attack and Defense Labs
Attack and Defense Labs
N
News and Events Feed by Topic
The GitHub Blog
The GitHub Blog
C
Cyber Attacks, Cyber Crime and Cyber Security
Schneier on Security
Schneier on Security
N
Netflix TechBlog - Medium
爱范儿
爱范儿
B
Blog
CTFtime.org: upcoming CTF events
CTFtime.org: upcoming CTF events
cs.CV updates on arXiv.org
cs.CV updates on arXiv.org
C
CERT Recently Published Vulnerability Notes
Hacker News: Ask HN
Hacker News: Ask HN
Google DeepMind News
Google DeepMind News
Engineering at Meta
Engineering at Meta
Blog — PlanetScale
Blog — PlanetScale
WordPress大学
WordPress大学
S
Secure Thoughts
K
Kaspersky official blog
N
News | PayPal Newsroom
O
OpenAI News
Last Week in AI
Last Week in AI
C
Check Point Blog
D
Darknet – Hacking Tools, Hacker News & Cyber Security
Cyberwarzone
Cyberwarzone
Application and Cybersecurity Blog
Application and Cybersecurity Blog
T
Tor Project blog
大猫的无限游戏
大猫的无限游戏
Vercel News
Vercel News
D
Docker
Hugging Face - Blog
Hugging Face - Blog
T
Threat Research - Cisco Blogs
Cisco Talos Blog
Cisco Talos Blog
The Register - Security
The Register - Security
博客园 - 司徒正美
Martin Fowler
Martin Fowler
人人都是产品经理
人人都是产品经理
P
Palo Alto Networks Blog

... eeNews Europe

Molex Teramount deal targets co-packaged optics NVIDIA and ServiceNow extend AI governance from desktops to data centres Faraday Future launches Physical AI robotics institute with BIBS System Check: Should engineers learn analog? Decoupled by Design: How Gateworks and NXP are rethinking edge AI architecture NVIDIA and Corning partner on AI photonics expansion GCT taps satellite partner to speed 5G rollout Sodankylä supersite to support ESA Earth observation SiTime posts 88% revenue growth on AI infrastructure demand Infrared LEDs support in-cabin sensing for vehicle safety Anthropic compute deal taps SpaceXAI Colossus 1 Quantum Brilliance CEO Mark Luo on deployable quantum systems and the future of diamond-based computing SEMI Summit spotlights Europe’s chiplet and packaging push AI data center infrastructure drives Pennsylvania energy expansion NXP CoreRide gains Vector software support for SDV platforms Elektor Lab Talk covers Red Pitaya and reconfigurable test gear SEMI names Julie Rogers to lead ESD Alliance ASML CEO backs joint call for Europe tech competitiveness push FlexIC RFID inlays bring NFC to paper packaging ROHM targets smart rings with ultra-compact NFC wireless power chipset China silicon wafers push boosts Eswin capacity ESD Alliance outlook spotlights agentic AI in chip design AI robotics sales growth rises as Faraday Future expands into education Microchip expands dsPIC33A controllers for AI data center power sensiBel MEMS microphone heads to Silex production SEMI: Global silicon wafer shipments jump 13% on AI demand AI drives photonics innovation Advantech adds Intel Core Series 3 to edge AI systems NI CHESS enables software-driven RF channel emulation into aerospace testing Forsee Power battery system powers new electric fire pump Advantech brings agentic AI to Jetson Thor edge platforms Rohde & Schwarz adds Pulsar signal simulation for LEO navigation UL Solutions builds new testing lab in Germany IonQ and Florida LambdaRail roll out US quantum-safe network initiative Tower Semiconductor and Axiro push high-efficiency SiGe for next-gen radar TSMC SoIC roadmap targets 2029 chip stacking Robotics development platform links EBV ecosystem for system design onsemi and Geely expand SiC collaboration for next-gen EV platforms Satellite connected cattle collars expand remote ranching SK hynix begins mass production of 192GB AI server memory 2Trust.AI and Carahsoft partner to scale AI governance for public sector Cerebras IPO filing revives AI chipmaker’s market push Omdia raises 2026 semiconductor forecast to 62.7% IQM to deploy Japan’s first enterprise quantum computer at TOYO TTM Technologies announces 2026 Investor Day event MATCH Act targets chip tool exports to China Musk teams with Intel for Terafab plans Siemens and TSMC expand AI-driven chip design collaboration Altilium EV battery recycling expands with new investment round Marvell acquires Polariton for optical scaling Credo to unveil AI interconnect solutions at TSMC 2026 Symposium Gartner projects IT spending at $6.31 Trillion in 2026 on AI surge Quectel expands IoT reach in Brazil with Vermont partnership Autonomous material handling stack links Thoro and Orbbec ROHM advances SiC MOSFETs for high-temperature power systems ST targets wide-voltage precision with new op amps NVIDIA and Google Cloud target physical AI factories OE-A publishes 10th edition of “Roadmap for Flexible and Printed Electronics” HCLTech FY26 revenue rises 3.9% as Advanced AI demand accelerates Infineon joins European quantum pilot lines for quantum chips Iran network backdoors claim hits Cisco, Juniper, Fortinet CVD Equipment advances SiC cystal growth with university collaboration EU unlocks €63M to accelerate AI in health and safety GTT targets AI networking growth with 2026 strategy Apple CEO transition as Tim Cook hands over to John Ternus Race Rock sign clamp gets TxDOT approval SEMI forum targets Europe’s semiconductor strategy Smartphone memory shortage to cut 2026 shipments: IDC Vector adds charging communication security tests to CANoe EV package Elektor to host EEI #59 on DIY synths and the Formant Nordic Semiconductor appoints Jo Uthus as EVP of Marketing and Developer Experience ADIOS first order tops $1 million as supply risks rise AMD partners with France to power AI research and exascale supercomputing EU updates tech licensing competition rules for the data era AECC rolls out data first architecture for automotive services Infineon rad-hard semiconductors validated in Artemis II mission Chinese chip tool makers hit record 2025 revenues UK experiment studies microgravity effects using worms on the ISS TSMC Q1 revenue tops $35.9bn on strong 3nm demand NVIDIA launches Ising AI models to accelerate quantum computing ASML reports €8.8bn Q1 revenue Zephyr RTOS 4.4 adds WireGuard, Wi-Fi Direct and OpenRISC Key quantum innovations covered by eeNews Europe MIT underwater robot teaming targets cable inspection Intel and Google expand AI infrastructure partnership SEALSQ and Kaynes advance India’s PQC chip hub Intel to reacquire 49% share of Ireland fab joint venture Intel names Aparna Bawa as Chief Legal & People Officer Stryten launches E-Series AGM batteries for telecom and utility reliability GaN gate drivers integrate protection for motion control and power systems System Check: are engineering certificates worth it? Pasqal partners with True Nexus on quantum food protein design Rigetti launches 108-qubit quantum system Undersea cable security drives UK warning to Russia The race to secure data Low-RDS(on) MOSFETs in automotive power systems SiFive funding backs datacentre CPU push Eclipse hawkBit 1.0 released for open-source IoT software updates Intel and SambaNova target agentic AI inference with Xeon 6 Vadzo publishes GMSL camera guide for embedded vision
NVIDIA backs FERC large-load interconnection push
https://facebook.com/briantw1 · 2026-06-19 · via ... eeNews Europe

NVIDIA backs FERC large-load interconnection push

Business news |

By Brian Tristam Williams



NVIDIA has backed the latest US regulatory move on grid access, after the Federal Energy Regulatory Commission issued show-cause orders aimed at speeding the connection of data centres, manufacturing plants and other large electricity users.

The FERC large-load interconnection action directs six regional grid operators under FERC jurisdiction to justify their existing tariff rules or file changes that address large users more directly. The order is aimed at AI data centres and other power-intensive facilities that are now arriving in grid queues at a scale utilities were not built to process quickly.

NVIDIA welcomed the action, arguing that AI factories, semiconductor support systems and advanced manufacturing facilities need faster routes to electricity supply while also helping to fund grid upgrades, add generation and operate more flexibly. The company’s framing is predictably pro-AI, but the regulatory problem behind it is real: large computing loads are starting to collide with long transmission planning cycles.

FERC large-load interconnection targets grid queues

FERC’s orders cover PJM, MISO, SPP, CAISO, ISO-NE and NYISO. They do not cover ERCOT in Texas, which sits largely outside federal jurisdiction. Each operator and its transmission owners now has 60 days to explain why existing rules remain just and reasonable, or to propose tariff revisions.

The five areas under review include transmission service application and study processes, transparency around grid upgrade costs, co-location agreements and behind-the-meter generation, flexible transmission services for large loads, and studies for generation facilities serving nearby or co-located loads. A separate FERC docket describes large loads generally as demand above 20 MW.

FERC has also ordered each grid operator and its transmission owners to file an informational report within 30 days explaining how they intend to ensure enough generation is available for existing and new large loads.

NVIDIA links flexible AI factories to FERC large-load interconnection

NVIDIA says large customers should be treated less as passive demand and more as participants in the power system. In practice, that means paying for required network upgrades, bringing additional generation to the grid, and offering flexible load that can be shifted or curtailed when grid conditions are tight.

The argument connects with NVIDIA’s separate work with Emerald AI on flexible AI factories. The companies have said commercial-scale deployment of their DSX Flex approach is expected later this year at the NVIDIA AI Factory Research Center in Virginia, using NVIDIA Vera Rubin infrastructure. The pitch is that some AI workloads can respond to grid signals without simply behaving like fixed industrial load.

As we reported previously when AI data centres drove power trends at PCIM, accelerator-heavy computing is already pushing interest in higher-voltage power architectures, energy storage, solid-state transformers and more efficient conversion stages. FERC’s action sits one level above that hardware story: before power can be converted inside the facility, the facility has to get connected.

Grid reform follows rising AI demand

The FERC move follows an October 2025 direction from US Energy Secretary Chris Wright to begin rulemaking around faster connection of large loads, including data centres. It also follows FERC’s separate approval of PJM’s expedited interconnection track for selected capacity projects, which is due to take effect on July 31, 2026.

The policy tension is straightforward enough. AI infrastructure developers want speed-to-power. Utilities and regulators want reliability, cost transparency and protection for existing customers. The FERC large-load interconnection orders do not settle that balance, but they force the main regional grid operators to put their rules on the table.

If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :

   eeNews on Google News