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By Asma Adhimi
SEMI FlexTech has launched a new request for proposals (RFP) aimed at advancing flexible hybrid electronics (FHE), with project awards ranging from $250,000 to $500,000. The initiative is funded by the Army Research Laboratory (ARL) and focuses on next-generation materials, additive processing and flexible device technologies.
The funding call highlights growing interest in flexible and moldable electronics for both commercial and defense applications. For eeNews Europe readers working in electronics design, materials engineering and advanced manufacturing, the RFP offers insight into where public-private investment is heading in the emerging FHE ecosystem.
The 2026 FlexTech RFP is targeting several technology areas, including flexible and moldable electronics, advanced bonding reliability, 2D materials and novel flexible energy storage architectures beyond conventional battery designs.
Organizations will be assessed on technical capability, experience and the potential impact of their proposals. Evaluation criteria also include collaboration value, dual-use applicability for industry and military markets, schedules, milestones and overall proposal quality.
According to FlexTech, the program is intended to support both high-risk, potentially disruptive concepts and more evolutionary developments that can deliver shorter-term improvements.
The coalition is also encouraging partnerships between industrial companies, R&D organizations and universities. Participants selected for funding will retain ownership of intellectual property developed under FlexTech agreements.
Full proposal submissions are due by July 6, 2026. To support applicants, FlexTech will host a live informational webinar on May 20 at 10:00 a.m. PDT covering the proposal and review process. A recording will also be made available for registered attendees unable to join live.
FlexTech operates as an industry-led public-private partnership under SEMI, bringing together industry, government and academic researchers to accelerate the development of flexible hybrid electronics infrastructure and products.
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