惯性聚合 高效追踪和阅读你感兴趣的博客、新闻、科技资讯
阅读原文 在惯性聚合中打开

推荐订阅源

J
Java Code Geeks
Martin Fowler
Martin Fowler
B
Blog RSS Feed
D
DataBreaches.Net
L
LangChain Blog
月光博客
月光博客
S
SegmentFault 最新的问题
阮一峰的网络日志
阮一峰的网络日志
V
Visual Studio Blog
美团技术团队
Jina AI
Jina AI
博客园 - 司徒正美
雷峰网
雷峰网
Last Week in AI
Last Week in AI
让小产品的独立变现更简单 - ezindie.com
让小产品的独立变现更简单 - ezindie.com
IT之家
IT之家
博客园 - 三生石上(FineUI控件)
WordPress大学
WordPress大学
小众软件
小众软件
罗磊的独立博客
博客园_首页
freeCodeCamp Programming Tutorials: Python, JavaScript, Git & More
A
About on SuperTechFans
Engineering at Meta
Engineering at Meta

... eeNews Europe

Molex Teramount deal targets co-packaged optics NVIDIA and ServiceNow extend AI governance from desktops to data centres Faraday Future launches Physical AI robotics institute with BIBS SiTime targets AI data centers with sub-nanosecond timing chip System Check: Should engineers learn analog? Decoupled by Design: How Gateworks and NXP are rethinking edge AI architecture NVIDIA and Corning partner on AI photonics expansion GCT taps satellite partner to speed 5G rollout Sodankylä supersite to support ESA Earth observation SiTime posts 88% revenue growth on AI infrastructure demand Infrared LEDs support in-cabin sensing for vehicle safety Anthropic compute deal taps SpaceXAI Colossus 1 Quantum Brilliance CEO Mark Luo on deployable quantum systems and the future of diamond-based computing SEMI Summit spotlights Europe’s chiplet and packaging push AI data center infrastructure drives Pennsylvania energy expansion NXP CoreRide gains Vector software support for SDV platforms Elektor Lab Talk covers Red Pitaya and reconfigurable test gear SEMI names Julie Rogers to lead ESD Alliance ASML CEO backs joint call for Europe tech competitiveness push FlexIC RFID inlays bring NFC to paper packaging ROHM targets smart rings with ultra-compact NFC wireless power chipset China silicon wafers push boosts Eswin capacity ESD Alliance outlook spotlights agentic AI in chip design AI robotics sales growth rises as Faraday Future expands into education Microchip expands dsPIC33A controllers for AI data center power sensiBel MEMS microphone heads to Silex production SEMI: Global silicon wafer shipments jump 13% on AI demand AI drives photonics innovation Advantech adds Intel Core Series 3 to edge AI systems NI CHESS enables software-driven RF channel emulation into aerospace testing
onsemi and Geely expand SiC collaboration for next-gen EV...
2026-04-29 · via ... eeNews Europe

onsemi and Geely expand SiC collaboration for next-gen EV platforms

News |

By Asma Adhimi




onsemi and Geely Auto Group are expanding their strategic collaboration to accelerate next-generation electric and hybrid vehicle development. The move centers on deeper integration of silicon carbide (SiC) technologies into future vehicle platforms.

For eeNews Europe readers, the announcement highlights how power semiconductor innovation is increasingly shaping EV architectures and system-level design decisions, particularly as the industry moves toward higher-voltage platforms.

Deeper SiC integration in EV platforms

At the core of the partnership is the integration of onsemi’s EliteSiC power technologies into vehicles built on Geely’s SEA-S (Sustainable Experience Architecture – Super Hybrid) platform. These systems are designed to support emerging 900V electrical architectures, enabling faster charging, longer range, and improved performance consistency. Geely is already showcasing its SEA-S–based Super Electric Power (SEP) system, where EliteSiC devices play a central role in the electric drive. Higher power density allows more compact and lighter designs, while improved thermal performance supports reliability under demanding conditions. The result is a more efficient drivetrain with smoother power delivery and enhanced driving dynamics.

Why 900V matters

The shift from today’s typical 400V–800V systems to 900V architectures reflects a broader push for efficiency. Higher voltage reduces current for the same power level, cutting losses and heat generation. This directly translates into shorter charging times and extended driving range — key metrics for EV adoption. onsemi’s SiC technology is critical here, as it can handle higher voltages with better efficiency than traditional silicon.

Industry collaboration intensifies

“The EV market is entering a new phase, driven by higher-voltage architectures and increasing system complexity. Our expanded engagement with Geely reflects how automakers and semiconductor partners are working more closely and earlier to shape critical vehicle design decisions. Together, we are enabling EVs that deliver higher efficiency and performance.” — Hassane El-Khoury

“As we advance our electrification strategy, closer coordination with technology partners is increasingly critical. Integrating onsemi technologies across our SEA-S–based electric vehicle platforms reflects this deeper collaboration in action. Working with onsemi as a key system-level partner enables stronger alignment across platform design and engineering execution, supporting our goal of delivering high-performance, efficient electric vehicles to customers worldwide.” — Gan JiaYue

The collaboration underscores a growing trend: semiconductor vendors are no longer just component suppliers but key contributors to EV platform architecture and performance.

If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :

   eeNews on Google News


Linked Articles