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Toshiba has expanded its portfolio of power MOSFETs with nine N-channel devices aimed at industrial equipment operating on 24V and 48V power rails. The devices are offered in three package formats designed to balance thermal performance, board space and implementation flexibility.

The announcement reflects a broader trend in industrial electronics, where equipment manufacturers are increasingly adopting 48V architectures to improve power efficiency and reduce current levels. This shift creates demand for higher-voltage switching devices capable of handling transient conditions while maintaining compact footprints.

For eeNews Europe readers, the development highlights how power semiconductor vendors are adapting their portfolios to support evolving industrial power distribution architectures. The availability of multiple package options may also provide designers with greater flexibility when optimising thermal performance and board layout.

Designed for higher-voltage industrial systems

According to Toshiba, three of the devices are rated at 100V for use on 48V power lines, while six are rated at 60V for conventional 24V systems. The company notes that voltage spikes and inrush currents on 48V rails can push operating voltages beyond 50V and sometimes as high as 80V, making higher-voltage power MOSFETs necessary for reliable operation.

The 100V family comprises the SSM3K387R, SSM6K387R and SSM6K387NU, each offering an on-resistance (RDS(ON)) of 198mΩ. For 24V applications, Toshiba is offering the SSM3K388R, SSM6K388R and SSM6K388NU with an RDS(ON) of 99mΩ, alongside the SSM3K389R, SSM6K389R and SSM6K389NU, which provide an RDS(ON) of 200mΩ.

Three package formats

The devices are available in three package variants. The SOT-23F package measures 2.9mm × 2.4mm and supports power dissipation of 1W. The TSOP6F package, at 2.9mm × 2.8mm, increases power dissipation capability to 1.5W and is intended for applications requiring improved thermal performance.

For designs where board space is limited, Toshiba also offers the UDFN6B package. Measuring 2.0mm × 2.0mm, it provides a smaller footprint while supporting up to 1.25W of power dissipation.

Potential application areas include programmable logic controllers (PLCs), servo drives, industrial inverters, servers and a range of consumer products such as LED lighting systems and robotic vacuum cleaners. Toshiba says the combination of compact packaging and relatively low on-resistance can help reduce power losses while supporting further miniaturisation of power designs.

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