惯性聚合 高效追踪和阅读你感兴趣的博客、新闻、科技资讯
阅读原文 在惯性聚合中打开

推荐订阅源

WordPress大学
WordPress大学
GbyAI
GbyAI
P
Proofpoint News Feed
B
Blog
MyScale Blog
MyScale Blog
V
V2EX
B
Blog RSS Feed
Microsoft Security Blog
Microsoft Security Blog
量子位
Jina AI
Jina AI
博客园 - 叶小钗
Recent Announcements
Recent Announcements
有赞技术团队
有赞技术团队
罗磊的独立博客
L
LangChain Blog
I
InfoQ
云风的 BLOG
云风的 BLOG
freeCodeCamp Programming Tutorials: Python, JavaScript, Git & More
人人都是产品经理
人人都是产品经理
小众软件
小众软件
V
Visual Studio Blog
月光博客
月光博客
The Cloudflare Blog
雷峰网
雷峰网

... eeNews Europe

Molex Teramount deal targets co-packaged optics NVIDIA and ServiceNow extend AI governance from desktops to data centres Faraday Future launches Physical AI robotics institute with BIBS SiTime targets AI data centers with sub-nanosecond timing chip System Check: Should engineers learn analog? Decoupled by Design: How Gateworks and NXP are rethinking edge AI architecture NVIDIA and Corning partner on AI photonics expansion GCT taps satellite partner to speed 5G rollout Sodankylä supersite to support ESA Earth observation SiTime posts 88% revenue growth on AI infrastructure demand Infrared LEDs support in-cabin sensing for vehicle safety Anthropic compute deal taps SpaceXAI Colossus 1 Quantum Brilliance CEO Mark Luo on deployable quantum systems and the future of diamond-based computing SEMI Summit spotlights Europe’s chiplet and packaging push AI data center infrastructure drives Pennsylvania energy expansion NXP CoreRide gains Vector software support for SDV platforms Elektor Lab Talk covers Red Pitaya and reconfigurable test gear SEMI names Julie Rogers to lead ESD Alliance ASML CEO backs joint call for Europe tech competitiveness push FlexIC RFID inlays bring NFC to paper packaging ROHM targets smart rings with ultra-compact NFC wireless power chipset China silicon wafers push boosts Eswin capacity ESD Alliance outlook spotlights agentic AI in chip design AI robotics sales growth rises as Faraday Future expands into education Microchip expands dsPIC33A controllers for AI data center power sensiBel MEMS microphone heads to Silex production SEMI: Global silicon wafer shipments jump 13% on AI demand AI drives photonics innovation Advantech adds Intel Core Series 3 to edge AI systems NI CHESS enables software-driven RF channel emulation into aerospace testing
Robotics development platform links EBV ecosystem for sys...
2026-04-29 · via ... eeNews Europe

Robotics development platform links EBV ecosystem for system design

Technology News |

By Alina Neacsu




EBV Elektronik has introduced MOVE, a robotics development platform designed to connect engineers with embedded technologies, supplier resources and application guidance for next-generation robotic systems.

The initiative, developed by EBV Elektronik’s Embedded Solutions team, brings together processors, AI accelerators, sensors, motion control, connectivity, memory, storage, power management and display technologies in one central resource. For eeNews Europe readers, the launch is relevant as robotics designs increasingly depend on tightly integrated embedded subsystems rather than standalone components.

Robotics development needs broader integration

Robotics development is expanding across industrial automation, logistics, healthcare, agriculture, research and education. In each of these areas, engineers face rising system complexity as compute, perception, control and communications functions need to work together reliably.

MOVE is intended to support this process by giving developers a more structured route to relevant technologies and design resources. The platform covers applications including industrial robots, autonomous mobile robots (AMRs), service robots, commercial drones, medical robotics, humanoid systems and agricultural robotics.

Knowledge hub adds engineering support

MOVE also includes a Robotics Knowledge Hub with technical articles, application insights and educational resources. EBV says the hub is intended to support engineers throughout the design and development process, from early exploration to component selection and system integration.

A Field Insights collective database will allow participants to contribute first-hand experience on robotics trends, technical shifts and common design practices. Engineers can also submit technical questions through a Q&A portal, which routes requests to EBV Embedded Solutions specialists.

“Robotics innovation increasingly depends on advanced embedded technologies working seamlessly together,” said Sergio Timpretti, Vice President Marketing EMEA at EBV Elektronik. “From component selection to full system integration, we at the EBV Embedded Solutions team support robotics advancements worldwide. The MOVE initiative brings technologies, suppliers, and engineering expertise together in one place.”

If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :

   eeNews on Google News


Linked Articles