惯性聚合 高效追踪和阅读你感兴趣的博客、新闻、科技资讯
阅读原文 在惯性聚合中打开

推荐订阅源

Cyber Security Advisories - MS-ISAC
Cyber Security Advisories - MS-ISAC
Application and Cybersecurity Blog
Application and Cybersecurity Blog
T
Threat Research - Cisco Blogs
Latest news
Latest news
Project Zero
Project Zero
TaoSecurity Blog
TaoSecurity Blog
Cyberwarzone
Cyberwarzone
Threat Intelligence Blog | Flashpoint
Threat Intelligence Blog | Flashpoint
Google DeepMind News
Google DeepMind News
P
Privacy & Cybersecurity Law Blog
T
Troy Hunt's Blog
cs.AI updates on arXiv.org
cs.AI updates on arXiv.org
AWS News Blog
AWS News Blog
Hacker News: Ask HN
Hacker News: Ask HN
S
Security @ Cisco Blogs
C
Cisco Blogs
Help Net Security
Help Net Security
I
Intezer
W
WeLiveSecurity
Exploit-DB.com RSS Feed
Exploit-DB.com RSS Feed
腾讯CDC
S
Secure Thoughts
MyScale Blog
MyScale Blog
Recorded Future
Recorded Future
G
GRAHAM CLULEY
L
LINUX DO - 热门话题
A
About on SuperTechFans
C
CXSECURITY Database RSS Feed - CXSecurity.com
IT之家
IT之家
J
Java Code Geeks
The Hacker News
The Hacker News
阮一峰的网络日志
阮一峰的网络日志
Scott Helme
Scott Helme
Recent Announcements
Recent Announcements
AI
AI
Cisco Talos Blog
Cisco Talos Blog
B
Blog RSS Feed
V
Vulnerabilities – Threatpost
C
Check Point Blog
Security Latest
Security Latest
S
SegmentFault 最新的问题
T
The Exploit Database - CXSecurity.com
cs.CL updates on arXiv.org
cs.CL updates on arXiv.org
M
MIT News - Artificial intelligence
T
The Blog of Author Tim Ferriss
Attack and Defense Labs
Attack and Defense Labs
PCI Perspectives
PCI Perspectives
Recent Commits to openclaw:main
Recent Commits to openclaw:main
T
Tailwind CSS Blog
Apple Machine Learning Research
Apple Machine Learning Research

... eeNews Europe

Molex Teramount deal targets co-packaged optics NVIDIA and ServiceNow extend AI governance from desktops to data centres Faraday Future launches Physical AI robotics institute with BIBS System Check: Should engineers learn analog? Decoupled by Design: How Gateworks and NXP are rethinking edge AI architecture NVIDIA and Corning partner on AI photonics expansion GCT taps satellite partner to speed 5G rollout Sodankylä supersite to support ESA Earth observation SiTime posts 88% revenue growth on AI infrastructure demand Infrared LEDs support in-cabin sensing for vehicle safety Anthropic compute deal taps SpaceXAI Colossus 1 Quantum Brilliance CEO Mark Luo on deployable quantum systems and the future of diamond-based computing SEMI Summit spotlights Europe’s chiplet and packaging push AI data center infrastructure drives Pennsylvania energy expansion NXP CoreRide gains Vector software support for SDV platforms Elektor Lab Talk covers Red Pitaya and reconfigurable test gear SEMI names Julie Rogers to lead ESD Alliance ASML CEO backs joint call for Europe tech competitiveness push FlexIC RFID inlays bring NFC to paper packaging ROHM targets smart rings with ultra-compact NFC wireless power chipset China silicon wafers push boosts Eswin capacity ESD Alliance outlook spotlights agentic AI in chip design AI robotics sales growth rises as Faraday Future expands into education Microchip expands dsPIC33A controllers for AI data center power sensiBel MEMS microphone heads to Silex production SEMI: Global silicon wafer shipments jump 13% on AI demand AI drives photonics innovation Advantech adds Intel Core Series 3 to edge AI systems NI CHESS enables software-driven RF channel emulation into aerospace testing Forsee Power battery system powers new electric fire pump Advantech brings agentic AI to Jetson Thor edge platforms Rohde & Schwarz adds Pulsar signal simulation for LEO navigation UL Solutions builds new testing lab in Germany IonQ and Florida LambdaRail roll out US quantum-safe network initiative Tower Semiconductor and Axiro push high-efficiency SiGe for next-gen radar TSMC SoIC roadmap targets 2029 chip stacking Robotics development platform links EBV ecosystem for system design onsemi and Geely expand SiC collaboration for next-gen EV platforms Satellite connected cattle collars expand remote ranching SK hynix begins mass production of 192GB AI server memory 2Trust.AI and Carahsoft partner to scale AI governance for public sector Cerebras IPO filing revives AI chipmaker’s market push Omdia raises 2026 semiconductor forecast to 62.7% IQM to deploy Japan’s first enterprise quantum computer at TOYO TTM Technologies announces 2026 Investor Day event MATCH Act targets chip tool exports to China Musk teams with Intel for Terafab plans Siemens and TSMC expand AI-driven chip design collaboration Altilium EV battery recycling expands with new investment round Marvell acquires Polariton for optical scaling Credo to unveil AI interconnect solutions at TSMC 2026 Symposium Gartner projects IT spending at $6.31 Trillion in 2026 on AI surge Quectel expands IoT reach in Brazil with Vermont partnership Autonomous material handling stack links Thoro and Orbbec ROHM advances SiC MOSFETs for high-temperature power systems ST targets wide-voltage precision with new op amps NVIDIA and Google Cloud target physical AI factories OE-A publishes 10th edition of “Roadmap for Flexible and Printed Electronics” HCLTech FY26 revenue rises 3.9% as Advanced AI demand accelerates Infineon joins European quantum pilot lines for quantum chips Iran network backdoors claim hits Cisco, Juniper, Fortinet CVD Equipment advances SiC cystal growth with university collaboration EU unlocks €63M to accelerate AI in health and safety GTT targets AI networking growth with 2026 strategy Apple CEO transition as Tim Cook hands over to John Ternus Race Rock sign clamp gets TxDOT approval SEMI forum targets Europe’s semiconductor strategy Smartphone memory shortage to cut 2026 shipments: IDC Vector adds charging communication security tests to CANoe EV package Elektor to host EEI #59 on DIY synths and the Formant Nordic Semiconductor appoints Jo Uthus as EVP of Marketing and Developer Experience ADIOS first order tops $1 million as supply risks rise AMD partners with France to power AI research and exascale supercomputing EU updates tech licensing competition rules for the data era AECC rolls out data first architecture for automotive services Infineon rad-hard semiconductors validated in Artemis II mission Chinese chip tool makers hit record 2025 revenues UK experiment studies microgravity effects using worms on the ISS TSMC Q1 revenue tops $35.9bn on strong 3nm demand NVIDIA launches Ising AI models to accelerate quantum computing ASML reports €8.8bn Q1 revenue Zephyr RTOS 4.4 adds WireGuard, Wi-Fi Direct and OpenRISC Key quantum innovations covered by eeNews Europe MIT underwater robot teaming targets cable inspection Intel and Google expand AI infrastructure partnership SEALSQ and Kaynes advance India’s PQC chip hub Intel to reacquire 49% share of Ireland fab joint venture Intel names Aparna Bawa as Chief Legal & People Officer Stryten launches E-Series AGM batteries for telecom and utility reliability GaN gate drivers integrate protection for motion control and power systems System Check: are engineering certificates worth it? Pasqal partners with True Nexus on quantum food protein design Rigetti launches 108-qubit quantum system Undersea cable security drives UK warning to Russia The race to secure data Low-RDS(on) MOSFETs in automotive power systems SiFive funding backs datacentre CPU push Eclipse hawkBit 1.0 released for open-source IoT software updates Intel and SambaNova target agentic AI inference with Xeon 6 Vadzo publishes GMSL camera guide for embedded vision
Micron and Anthropic team up on AI memory infrastructure
Asma Adhimi · 2026-06-23 · via ... eeNews Europe

Micron and Anthropic team up on AI memory infrastructure

News |

By Asma Adhimi



Micron Technology has signed a broad strategic agreement with AI developer Anthropic that aims to strengthen the memory and storage foundations behind next-generation artificial intelligence systems.

The partnership covers joint development of AI infrastructure architectures, a long-term supply agreement, enterprise deployment of Anthropic’s Claude models within Micron, and Micron’s participation in Anthropic’s latest funding round.

For eeNews Europe readers, the announcement highlights the growing importance of memory and storage technologies in AI system design. It also underscores how semiconductor suppliers are moving beyond component delivery to become strategic partners in AI infrastructure development.

Memory and storage move to the center of AI

As AI models continue to scale, memory bandwidth, storage performance and power efficiency have become critical bottlenecks. Under the agreement, Micron and Anthropic will work together to analyze how memory and storage subsystems perform across AI training and inference workloads.

The collaboration will focus on optimizing the interaction between memory, storage and compute resources throughout the AI infrastructure stack. Micron said its portfolio of high-bandwidth memory (HBM), DRAM and SSD products will play a central role in improving performance, energy efficiency and overall system economics.

“The AI revolution has permanently elevated the role of memory and storage solutions from the data center to the edge,” said Sumit Sadana, executive vice president and chief business officer at Micron. “Micron’s strategic collaboration with Anthropic brings together the industry-leading capabilities of both companies to innovate and scale next-generation AI infrastructure.”

Anthropic sees the partnership as a way to support the rapid growth of its Claude family of AI models.

“Our compute strategy depends on getting every layer of the stack right, and memory and storage are central to how efficiently we can train and serve Claude,” said Tom Brown, co-founder and chief compute officer at Anthropic. “Partnering with Micron means we collaborate closely on optimizing these systems for our workloads and secure the supply we need. As demand for Claude grows, this is how we scale our compute for the long term.”

Long-term supply and AI adoption

Alongside the technical collaboration, the companies have entered into a multi-year memory and storage supply agreement. The deal is intended to give Anthropic access to the infrastructure components needed to support future expansion of its AI computing capacity.

Micron is also expanding its use of Anthropic’s Claude models across its own operations. The company said it is already using the technology to support software development, engineering workflows, manufacturing activities and enterprise functions, with a focus on productivity improvements and more advanced AI-driven processes.

The agreement also includes a strategic investment by Micron in Anthropic’s Series H funding round. Financial terms were not disclosed.

The deal reflects a wider trend in the AI industry, where leading model developers and semiconductor suppliers are forging deeper partnerships to address the growing infrastructure demands of frontier AI systems. As AI workloads become increasingly memory-intensive, closer collaboration between chipmakers and AI companies is likely to play a key role in determining future performance, efficiency and scalability.

If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :

   eeNews on Google News