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By Asma Adhimi
Applied Materials and TSMC are deepening a long-running collaboration with a new partnership focused on accelerating semiconductor technologies for AI. The companies will work together at Applied’s EPIC Center in Silicon Valley to develop new materials, equipment and process technologies aimed at next-generation logic devices and advanced packaging.
The move comes as chipmakers face growing pressure to improve power efficiency and performance for AI workloads, while also managing the increasing complexity of advanced process nodes and 3D device architectures.
For eeNews Europe readers, the announcement highlights how leading semiconductor companies are reshaping R&D collaboration models to speed up the transition from research to volume manufacturing. It also underlines the growing importance of materials engineering and process integration as Europe and the wider industry compete for AI semiconductor leadership.
The collaboration will center on Applied’s EPIC Center, a new semiconductor equipment R&D facility that the company says represents a long-term investment expected to scale to around $5 billion. The site is designed to shorten the time needed to commercialize emerging semiconductor technologies by bringing chipmakers and equipment engineers together earlier in the development cycle.
The joint work between Applied and TSMC will focus on several key areas, including process technologies for leading-edge logic scaling and new materials and manufacturing equipment for increasingly complex 3D transistor structures. In addition, the companies will develop advanced integration techniques aimed at improving yield and reliability.
“Applied and TSMC share a long history of deep collaboration built on trust and a shared commitment to advancing innovation at the leading edge of semiconductor technology,” said Gary Dickerson, President and CEO of Applied Materials. “By bringing our teams together at the EPIC Center, we are strengthening that partnership and accelerating the development of technologies to address the unprecedented complexity driving the chipmaking roadmap.”
The companies say the partnership is intended to help accelerate the path from technology development to high-volume manufacturing, particularly as AI and high-performance computing systems drive demand for more advanced semiconductors.
“As semiconductor device architectures evolve with each new generation, the demands on materials engineering and process integration continue to increase,” said Dr. Y.J. Mii, Executive Vice President and Co-Chief Operating Officer at TSMC. “Meeting the challenges of AI at a global scale requires industry-wide collaboration. Applied Materials’ EPIC Center provides an ideal environment to accelerate equipment and process readiness for next-generation technologies.”
Applied says the EPIC Center will also provide customers with earlier access to its R&D programs and next-generation tools while giving the company more visibility into future technology requirements across multiple process nodes.
“Advancing leading foundry technologies calls for a new model for collaboration and innovation,” said Dr. Prabu Raja, President of the Semiconductor Products Group at Applied Materials. “As a founding partner of the EPIC Center, TSMC gains earlier access to Applied’s innovation teams and next-generation equipment, helping accelerate the path from technology development to high-volume manufacturing.”
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