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By Brian Tristam Williams
MIPI Alliance has opened participation in its new industry participation process for the Physical AI BoF, a Birds of a Feather group intended to examine interface requirements for emerging humanoid robot systems. The group is open to MIPI members and to non-member companies in the physical AI ecosystem.
The move follows MIPI’s 28 April announcement of the group, which is initially focused on humanoids. The alliance says the work will assess how existing MIPI specifications, and possible extensions to them, could support machines that combine high sensor bandwidth, embedded compute, motion control and low-power operation.
The Physical AI BoF will analyse current hardware and software architectures used in humanoid robots, develop system diagrams for key applications, and identify where MIPI specifications could be reused or enhanced. Its output is expected to be a formal recommendation to the MIPI Alliance board on possible specification development opportunities.
Edo Cohen of Valens Semiconductor chairs the group and is also vice chair of MIPI’s Technical Steering Group. MIPI says many robotics systems still draw from mobile, automotive and industrial architectures, while the humanoid sector is now moving towards more efficient commercial designs that prioritise power, cost and size.
Standardised interfaces are a practical issue for humanoid platforms. These systems may need multiple cameras, depth sensors, inertial sensors, microphones, displays or indicators, actuator control, high-speed data movement and deterministic responses in compact, power-constrained designs. That makes the Physical AI BoF a logical extension of MIPI’s work in mobile and “mobile-influenced” markets such as automotive, IoT and robotics.
MIPI cites Yole Group as projecting a 56% CAGR for the humanoid robot market to more than $6 billion by 2030, with the market potentially reaching $51 billion by 2035. The nearer-term issue for suppliers is whether humanoid platforms can move from custom lab integration towards repeatable architectures that component vendors and OEMs can design around.
That is where MIPI’s existing interface work becomes relevant. As previously reported by eeNews Europe when MIPI A-PHY entered automotive mass production, the alliance has already pushed mobile-origin interface work into safety- and sensor-heavy applications. eeNews Europe has also covered physical AI at the board level, including the Arduino VENTUNO Q launch, where local inference and real-time control are being brought onto the same embedded platform.
Associates of MIPI member companies can join through the Causeway member site. Non-member companies can complete the participation form, after which MIPI says confirmation will be sent when the company has been set up in the group, with a processing time of 3-5 business days. Meeting details are expected in the coming weeks.
Companies listed as early participants include Amphenol, Intel, KIOXIA, Lattice Semiconductor, LG Electronics, MediaTek, NXP Semiconductors, Bosch, Samsung Electronics, Sony Group, STMicroelectronics, Synopsys, TDK, Texas Instruments, Unisoc and Valens Semiconductor, among others.
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