惯性聚合 高效追踪和阅读你感兴趣的博客、新闻、科技资讯
阅读原文 在惯性聚合中打开

推荐订阅源

F
Fortinet All Blogs
云风的 BLOG
云风的 BLOG
M
MIT News - Artificial intelligence
WordPress大学
WordPress大学
T
Tailwind CSS Blog
钛媒体:引领未来商业与生活新知
钛媒体:引领未来商业与生活新知
S
Secure Thoughts
博客园 - 【当耐特】
Know Your Adversary
Know Your Adversary
NISL@THU
NISL@THU
博客园 - 司徒正美
Last Week in AI
Last Week in AI
C
Cybersecurity and Infrastructure Security Agency CISA
P
Privacy & Cybersecurity Law Blog
C
CXSECURITY Database RSS Feed - CXSecurity.com
B
Blog
The GitHub Blog
The GitHub Blog
小众软件
小众软件
freeCodeCamp Programming Tutorials: Python, JavaScript, Git & More
Spread Privacy
Spread Privacy
Martin Fowler
Martin Fowler
博客园 - 叶小钗
Security Archives - TechRepublic
Security Archives - TechRepublic
T
Tenable Blog
S
Securelist
博客园 - 三生石上(FineUI控件)
Threat Intelligence Blog | Flashpoint
Threat Intelligence Blog | Flashpoint
Microsoft Security Blog
Microsoft Security Blog
Apple Machine Learning Research
Apple Machine Learning Research
罗磊的独立博客
T
Threat Research - Cisco Blogs
Application and Cybersecurity Blog
Application and Cybersecurity Blog
F
Full Disclosure
Cloudbric
Cloudbric
The Cloudflare Blog
Y
Y Combinator Blog
Hugging Face - Blog
Hugging Face - Blog
Microsoft Azure Blog
Microsoft Azure Blog
H
Hacker News: Front Page
腾讯CDC
L
Lohrmann on Cybersecurity
C
CERT Recently Published Vulnerability Notes
V2EX - 技术
V2EX - 技术
GbyAI
GbyAI
TaoSecurity Blog
TaoSecurity Blog
I
Intezer
The Last Watchdog
The Last Watchdog
G
GRAHAM CLULEY
Google Online Security Blog
Google Online Security Blog
T
The Blog of Author Tim Ferriss

... eeNews Europe

Molex Teramount deal targets co-packaged optics NVIDIA and ServiceNow extend AI governance from desktops to data centres Faraday Future launches Physical AI robotics institute with BIBS SiTime targets AI data centers with sub-nanosecond timing chip System Check: Should engineers learn analog? Decoupled by Design: How Gateworks and NXP are rethinking edge AI architecture NVIDIA and Corning partner on AI photonics expansion GCT taps satellite partner to speed 5G rollout Sodankylä supersite to support ESA Earth observation SiTime posts 88% revenue growth on AI infrastructure demand Infrared LEDs support in-cabin sensing for vehicle safety Anthropic compute deal taps SpaceXAI Colossus 1 Quantum Brilliance CEO Mark Luo on deployable quantum systems and the future of diamond-based computing SEMI Summit spotlights Europe’s chiplet and packaging push AI data center infrastructure drives Pennsylvania energy expansion NXP CoreRide gains Vector software support for SDV platforms Elektor Lab Talk covers Red Pitaya and reconfigurable test gear SEMI names Julie Rogers to lead ESD Alliance ASML CEO backs joint call for Europe tech competitiveness push FlexIC RFID inlays bring NFC to paper packaging ROHM targets smart rings with ultra-compact NFC wireless power chipset China silicon wafers push boosts Eswin capacity ESD Alliance outlook spotlights agentic AI in chip design AI robotics sales growth rises as Faraday Future expands into education Microchip expands dsPIC33A controllers for AI data center power sensiBel MEMS microphone heads to Silex production SEMI: Global silicon wafer shipments jump 13% on AI demand AI drives photonics innovation Advantech adds Intel Core Series 3 to edge AI systems NI CHESS enables software-driven RF channel emulation into aerospace testing Forsee Power battery system powers new electric fire pump Advantech brings agentic AI to Jetson Thor edge platforms Rohde & Schwarz adds Pulsar signal simulation for LEO navigation UL Solutions builds new testing lab in Germany IonQ and Florida LambdaRail roll out US quantum-safe network initiative Tower Semiconductor and Axiro push high-efficiency SiGe for next-gen radar TSMC SoIC roadmap targets 2029 chip stacking Robotics development platform links EBV ecosystem for system design onsemi and Geely expand SiC collaboration for next-gen EV platforms Satellite connected cattle collars expand remote ranching SK hynix begins mass production of 192GB AI server memory 2Trust.AI and Carahsoft partner to scale AI governance for public sector Cerebras IPO filing revives AI chipmaker’s market push Omdia raises 2026 semiconductor forecast to 62.7% IQM to deploy Japan’s first enterprise quantum computer at TOYO TTM Technologies announces 2026 Investor Day event MATCH Act targets chip tool exports to China Musk teams with Intel for Terafab plans Siemens and TSMC expand AI-driven chip design collaboration Altilium EV battery recycling expands with new investment round Marvell acquires Polariton for optical scaling Credo to unveil AI interconnect solutions at TSMC 2026 Symposium Gartner projects IT spending at $6.31 Trillion in 2026 on AI surge Quectel expands IoT reach in Brazil with Vermont partnership Autonomous material handling stack links Thoro and Orbbec ROHM advances SiC MOSFETs for high-temperature power systems NVIDIA and Google Cloud target physical AI factories OE-A publishes 10th edition of “Roadmap for Flexible and Printed Electronics” HCLTech FY26 revenue rises 3.9% as Advanced AI demand accelerates Infineon joins European quantum pilot lines for quantum chips Iran network backdoors claim hits Cisco, Juniper, Fortinet CVD Equipment advances SiC cystal growth with university collaboration EU unlocks €63M to accelerate AI in health and safety GTT targets AI networking growth with 2026 strategy Apple CEO transition as Tim Cook hands over to John Ternus Race Rock sign clamp gets TxDOT approval SEMI forum targets Europe’s semiconductor strategy Smartphone memory shortage to cut 2026 shipments: IDC Vector adds charging communication security tests to CANoe EV package Elektor to host EEI #59 on DIY synths and the Formant Nordic Semiconductor appoints Jo Uthus as EVP of Marketing and Developer Experience ADIOS first order tops $1 million as supply risks rise AMD partners with France to power AI research and exascale supercomputing EU updates tech licensing competition rules for the data era AECC rolls out data first architecture for automotive services Infineon rad-hard semiconductors validated in Artemis II mission Chinese chip tool makers hit record 2025 revenues UK experiment studies microgravity effects using worms on the ISS TSMC Q1 revenue tops $35.9bn on strong 3nm demand NVIDIA launches Ising AI models to accelerate quantum computing ASML reports €8.8bn Q1 revenue Zephyr RTOS 4.4 adds WireGuard, Wi-Fi Direct and OpenRISC Key quantum innovations covered by eeNews Europe MIT underwater robot teaming targets cable inspection Intel and Google expand AI infrastructure partnership SEALSQ and Kaynes advance India’s PQC chip hub Intel to reacquire 49% share of Ireland fab joint venture Intel names Aparna Bawa as Chief Legal & People Officer Stryten launches E-Series AGM batteries for telecom and utility reliability GaN gate drivers integrate protection for motion control and power systems System Check: are engineering certificates worth it? Pasqal partners with True Nexus on quantum food protein design Rigetti launches 108-qubit quantum system Undersea cable security drives UK warning to Russia The race to secure data Low-RDS(on) MOSFETs in automotive power systems SiFive funding backs datacentre CPU push Eclipse hawkBit 1.0 released for open-source IoT software updates Intel and SambaNova target agentic AI inference with Xeon 6 Vadzo publishes GMSL camera guide for embedded vision
ST targets wide-voltage precision with new op amps
2026-04-24 · via ... eeNews Europe

ST targets wide-voltage precision with new op amps

News |

By Jens Nickel




STMicroelectronics has introduced a new dual operational amplifier aimed at high-precision applications across a wide supply range. The TSB192 devices combine low offset voltage with extended operating voltage, addressing a gap between traditional precision op amps and higher-voltage designs.

For eeNews Europe readers working in industrial, automotive, and instrumentation design, the combination of precision and flexibility could simplify analog front-end architectures. It also points to continued innovation in signal-conditioning components for mixed-signal systems.

Precision meets wide supply range

The TSB192 dual op amps operate from 4V to 36V, a range that is typically difficult to achieve without sacrificing precision. ST claims an offset voltage of 20µV, with a maximum of 30µV across the full temperature range, and a temperature drift of just 100nV/°C. These figures are usually associated with low-voltage precision amplifiers, making the wider supply capability notable.

The devices also feature rail-to-rail outputs, enabling designers to maximize dynamic range, while drawing up to 1.9mA per channel—helpful for extending battery life in portable equipment. By reducing offset and drift, the amplifiers minimize the need for compensation in signal-conditioning networks, simplifying system design.

Target applications include industrial and automotive systems, as well as healthcare and consumer electronics, where stable and repeatable analog performance is critical.

Performance for sensing and measurement

ST positions the TSB192 for use in analog integrators and measurement circuits, including temperature sensing, medical instrumentation, electronic scales, and industrial test equipment. The devices offer an 8MHz gain-bandwidth, 5V/µs slew rate, and low input noise of 11nV/√Hz, supporting improved frequency response and reduced distortion.

This makes them suitable for amplifying signals from transducers, bridges, and strain gauges, as well as for use in precision active filters. The operating temperature range of -40°C to 125°C further supports deployment in automotive environments, while ESD protection up to 4kV HBM enhances robustness.

The TSB192 is already in production in SO-8 and MiniSO-8 packages, with pricing starting at $1.06 in 1,000-piece volumes. ST also plans to release an automotive-grade version later in 2026, expanding its suitability for safety-critical and high-reliability applications.

If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :

   eeNews on Google News


Linked Articles