IT之家 News on May 20 - BOE Technology Group Co., Ltd. (京东方科技集团股份有限公司) today issued an announcement on the Shenzhen Stock Exchange, stating that it signed a Memorandum of Understanding with Corning Incorporated (hereinafter referred to as "Corning") on May 20.

BOE stated that it possesses leading capabilities in display devices, display modules, advanced manufacturing, process development, application innovation, and industrial implementation, while Corning has significant advantages in glass materials, advanced materials and solutions for semiconductor applications, and other areas.

Based on the above, the two parties will collaborate on key areas such as glass-based packaging substrates, foldable glass, perovskite glass substrates, and optical interconnect-related applications, jointly exploring technology and market opportunities with commercial potential.

IT之家 (IT之家) provides the following progress updates on BOE's related business areas:

• Glass-based packaging substrate business: The company invested 993 million yuan in 2024 to build a glass-based packaging substrate test line. Currently, samples have been sent to some domestic customers, and some customers have passed concept certification and entered the technical testing phase. As of now, the company has not achieved mass production, and this business has not yet generated revenue from mass production. The yield rate of the company's test line has not reached the level of mass production, and when it will reach that level is subject to significant uncertainty;

• Foldable screen business: The company has been producing foldable products since 2019, and has successfully introduced them to multiple global brand customers, achieving stable mass production supply;

• Perovskite business: Since 2024, the company has built three platforms: a glove box (25mm*25mm), an experimental line (300mm*300mm), and a pilot line (1200*2400mm), adopting parallel development of rigid/flexible/tandem module technology routes. The total investment in the three R&D platforms is nearly 1 billion yuan. Currently, the company is continuously developing related product technologies and conducting life verification work with domestic customers. At present, the productization process is mainly focused on the implementation of demonstration and verification projects, and mass production revenue has not yet been achieved. When it will be achieved is subject to significant uncertainty;

• Optical Interconnection Business : The company's subsidiary invested in building a Micro LED chip production line in 2023. Currently, the subsidiary has produced samples of Micro LED optical interconnection chips and delivered them to customers for evaluation. As of now, this business has not generated any sales revenue, and there is significant uncertainty regarding when it will do so.

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