AMD's next-gen Zen 7 "Grimlock" CPUs are rumored to utilize TSMC's 1.4nm (A14) process tech & new packaging innovations.
The Zen 6 architecture is yet to make a formal entry into mainstream server and consumer segments, and while mass production has already begun on TSMC's 2nm process tech, the company is now prepping its supply chain partners for the next-generation lineup.
In a report by Taiwanese Commercial Times, it is said that AMD has begun supply chain preparations for its next-generation x86 CPU architecture called Zen 7, and codenamed Grimlock. The next generation of CPUs based on the Zen 7 architecture will harness TSMC's cutting-edge A14 process technology, which is a 1.4nm design. TSMC A14 will be competing with Intel's 14A at the same time, and Zen 7 is expected to land around 2028.
It is also reported that AMD's CEO, Dr. Lisa Su, recently visited Powertech during her trip to Taiwan, where she met various supply chain and industry partners. The visit to Powertech is said to be associated with an advanced packaging tech allocation. AMD is likely going to leverage Powertech's FOPLP (Fan-Out Panel-Level Packaging) technology.
AMD has begun its supply chain preparations for its next-generation Zen 7 platform ahead of schedule. Supply chain sources reveal that the Zen 7 core chipset (CCD), codenamed Grimlock, will utilize TSMC's A14 process and incorporate next-generation 3D V-Cache technology. The company is also evaluating Powertech's FOPLP (Fan-Out Panel-Level Packaging) solution.
Commercial Times
The TSMC Dachung Fab 25 P1 plant is where the company is a semiconductor maker, is expected to begin trial production by 2027, followed by mass production in 2028. TSMC's race towards A14 by 2028 is going to be crucial as Intel recently gained big traction with its Foundry business, allegedly gaining support from major customers for its 18A-P and 14A nodes, with Apple and TeraFab already being confirmed customers.
As for AMD's Zen 7, the CPUs are expected to feature a brand new CCD design with up to 16 cores, and up to 224 MB of L3 cache on a single 3D V-Cache CCD. This shows that both standard L3 caches and 3D V-Cache capacities will see a boost in future CPUs. For servers, AMD's Zen 7 core brings updated MATRIX engine capabilities along with expansion to the AI Data formats.
But while those upgrades sound nice, we should also understand that the ongoing AI hyper-cycle is not ending anytime soon, and with CPUs being massively in demand from AI firms, AMD will be doubling down on the data center segments just like their rivals, so expect a contested CPU space for many years to come as the big three fight for the $200B CPU TAM.
About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.
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