惯性聚合 高效追踪和阅读你感兴趣的博客、新闻、科技资讯
阅读原文 在惯性聚合中打开

推荐订阅源

H
Heimdal Security Blog
P
Privacy International News Feed
S
Schneier on Security
P
Proofpoint News Feed
L
Lohrmann on Cybersecurity
Spread Privacy
Spread Privacy
P
Privacy & Cybersecurity Law Blog
D
Darknet – Hacking Tools, Hacker News & Cyber Security
Scott Helme
Scott Helme
K
Kaspersky official blog
大猫的无限游戏
大猫的无限游戏
freeCodeCamp Programming Tutorials: Python, JavaScript, Git & More
aimingoo的专栏
aimingoo的专栏
Simon Willison's Weblog
Simon Willison's Weblog
S
Securelist
Help Net Security
Help Net Security
B
Blog
H
Hackread – Cybersecurity News, Data Breaches, AI and More
Security Archives - TechRepublic
Security Archives - TechRepublic
云风的 BLOG
云风的 BLOG
The GitHub Blog
The GitHub Blog
N
News and Events Feed by Topic
Hacker News: Ask HN
Hacker News: Ask HN
cs.CV updates on arXiv.org
cs.CV updates on arXiv.org
CTFtime.org: upcoming CTF events
CTFtime.org: upcoming CTF events
M
MIT News - Artificial intelligence
雷峰网
雷峰网
博客园 - 司徒正美
V
V2EX
AWS News Blog
AWS News Blog
Know Your Adversary
Know Your Adversary
N
News | PayPal Newsroom
T
Tor Project blog
Cisco Talos Blog
Cisco Talos Blog
OSCHINA 社区最新新闻
OSCHINA 社区最新新闻
PCI Perspectives
PCI Perspectives
Google DeepMind News
Google DeepMind News
Threat Intelligence Blog | Flashpoint
Threat Intelligence Blog | Flashpoint
U
Unit 42
C
Cybersecurity and Infrastructure Security Agency CISA
P
Palo Alto Networks Blog
G
Google Developers Blog
T
Threat Research - Cisco Blogs
博客园 - Franky
I
InfoQ
D
DataBreaches.Net
爱范儿
爱范儿
Y
Y Combinator Blog
博客园 - 叶小钗
奇客Solidot–传递最新科技情报
奇客Solidot–传递最新科技情报

TrendForce

[News] ASE Reportedly Raises Advanced Packaging Quotes by More Than 20% in Latest AI-Driven Price Hike [News] Musk’s TeraFab Lands First Major Hire as 18-Year Intel Veteran With 18A Experience Joins as Director [Insights] Memory Spot Price Update: DRAM Spot Prices See Gains in Low-Density DDR4 and DDR3 Amid Sideways Market [News] Passive Component Prices Rise as YAGEO Reportedly Begins Broadest Capacitor Hike in Years on July 1 [News] Intel Reportedly Breaks Ground on Santa Clara Expansion for Next-Gen EUV Mask Capacity [News] World’s First Mass-Production Line for 6-/8-Inch Homoepitaxial Gallium Oxide Wafers Comes Online [News] Samsung Electro-Mechanics Lands KRW 450B 1-Year MLCC Contract as AI Spurs Long-Term Agreements [News] Raw Material Inflation Deepens: FULLTECH Hikes Glass Fiber Cloth Prices Up to 30%; VPEC Adjusts Epi Wafer Prices [News] Samsung Reportedly Restarts 1.4nm Push, Targets 2029 Mass Production to Close Gap with TSMC, Intel [News] ByteDance Reportedly Eyes Next-Gen In-House CPU for 2H27 Mass Production; May Partner With Qualcomm [News] Samsung, SK hynix 800 Trillion Won Expansion Strains Chipmaking Tool Supply, Potentially Pressures TSMC, Intel [News] Goertek-Backed 12-Inch AR Optical Wafer Fab Commenced Production [News] China Signs First Domestic Ultra Wide Bandgap Semiconductor Full-Chain Project [News] Samsung, SK hynix, Micron Face U.S. Class-Action Lawsuit Over Alleged DRAM Supply Manipulation [News] Korea’s High-Purity CO₂ Inventory Reportedly Falls Below One Month; Samsung, SK hynix Under Pressure [News] TSMC’s 2Q Margins Reportedly Near 70% amid Strong 3/5nm Demand, 3Q Revenue Seen Growing Over 10% [Sponsored Content] Where Do You Stand as AI Reshapes Industries? [News] Mapping the Micro LED Optical Interconnect Ecosystem [News] Asian Memory Makers Turn to U.S. Capital Markets: SK hynix and Kioxia Advance ADR Plans [News] Lenovo Reportedly Sees Higher Memory Prices Becoming the New Normal Into 2030 [News] TSMC on Terafab: No Shortcuts in Foundry; Confirms Next-Gen LPU Project amid Samsung Rivalry [News] TSMC N3 Tightens on AI Demand; Arizona 2nd Fab 3nm Volume Production in 2H27, Kumamoto in 2028 [News] TSMC Sees 2Q Sales Up 10% QoQ to $40.2B; Margins Rise to 65.5%–67.5%, Capex at Top End of $52–56B [News] TSMC 1Q26 Net Income Soars 58% YoY to NT$572.5B Record, EPS NT$22.08; Gross Margin Beats Forecast at 66.2% [News] Tesla AI5 Reportedly Uses SK hynix Memory, Samsung LPDDR5X; Samsung SF2T Process Applied Ahead of AI6 [News] TSMC 1Q Profit Seen Up ~50% to Record; Meta–Broadcom AI Chips Reportedly Target 2nm, CoWoS-L in 1H27 [News] San’an Announced Three Advances in Optical Communications Business [News] Intel Reportedly to Brief Staff on TeraFab Involvement in Coming Weeks, While Key Foundry Details Remain Limited [News] ASML Raises 2026 Sales Outlook to €36B–€40B on Memory, Logic Demand; South Korea Share Hits 45% [News] Chinese Startup Dishan Reportedly Develops 2nm AI Chip in Prototype Verification; Foundry Access Uncertain [News] Musk Confirms AI5 Tape-Out, but Wrong TSMC Tag Triggers Social Media Mix-Up [News] China Reportedly Sees Record 2025 Chip Tool Imports from Singapore, Malaysia; U.S. Hit Lowest Since 2017 [Insights] Memory Spot Price Update: DRAM Spot Sellers Hold Firm Ahead of Mid-April Pricing, DDR4 Edges Lower 0.48% [News] HBM4 Strategies Diverge: Samsung Reportedly Chases 80% 1c DRAM Yield While SK hynix Trims Shipments by 30% [News] Korea Challenges Intel on Glass Substrate Standards as Absolics, Samsung Accelerate Commercialization [Insights] NVIDIA’s US$2B Marvell Deal: What’s the Strategic Significance for CPO and AI Interconnects? [News] Samsung Reportedly Lifts HBM4 Logic Die Prices by 40–50% Amid AI Boom; 4nm at Full Capacity [News] Huawei Takes Early Lead in Horizontal Foldable Race vs Samsung and Apple, Eyes April Pura X Max Launch [News] China Reportedly Closes AI Performance Gap with U.S., Stanford Report Says; Anthropic Leads by Just 2.7% [News] Samsung 2nm Yields Reportedly at ~55%, Below Mass Production Threshold; Qualcomm May Opt for TSMC [Insights] Memory Spot Price Update: DDR4 Spot Prices Climb as Samsung Holds EOL Line [News] Micron Reportedly Weighs Acquiring PSMC 12-Inch Tongluo Fab, With Multiple Partners Also Interested [News] ASUS to Raise Prices on Selected PC Lines from Jan. 5 Amid Memory Cost Surge, Following Dell [News] 2025 Tech Layoffs: Meta, Amazon, Microsoft and Others Cut Tens of Thousands of Roles [News] Sony, Microsoft Reportedly Weigh Delaying Next-Gen Game Consoles Beyond 2028 Amid Memory Price Surge [News] Samsung Reportedly Plans 50% HBM Capacity Surge in 2026, Spotlight on HBM4 [News] China Diversification Reportedly Lifts Mature-Node Foundries UMC, VIS, PSMC Despite Tariff Delay [News] Samsung, SK hynix Escape Worst-Case as China VEU Ends: Annual Review Risks Loom [News] TSMC Advanced-Node Materials Reportedly Found at Lo’s Residence Amid Controversial Intel Hire [News] NVIDIA’s $20B Groq Deal Spotlights SRAM Shift—MediaTek NPU Already On Board [News] Chinese Scientists Achieved New Breakthrough in Next-Gen Optical Computing Chips [News] Five-Year-Old Chinese EDA Firm Univista Sets Sights on IPO, Led by Ex-Synopsys and Cadence Team [News] Samsung Reportedly Pushes In-House CPU and GPU for Exynos 2800 to Cut Qualcomm, AMD Reliance [News] SK hynix Reportedly Plans First U.S. 2.5D Packaging Line, Eyes Turnkey HBM to Challenge TSMC [News] TSMC Reportedly to Raise Sub-3nm Prices 3-10% in 2026, Plans Hikes Through 2029 [News] Samsung Emerges as Potential Second Foundry for NVIDIA Alongside TSMC After Groq Licensing Deal [News] 7.0 Quake Hits: TSMC Nears Full Production, Sector Losses Reportedly Tens of Billions NTD [News] SLC-Based AI SSDs Gain Traction as SK hynix and Kioxia Accelerate Development With NVIDIA [News] NVIDIA Reportedly Denies USD 20B Groq Acquisition Rumors
[News] TSMC May Fast-Track 1.4nm at Central Taiwan Science Park as 2nm Yields Reportedly Beat Expectations
2025-12-31 · via TrendForce


TSMC has announced that its 2nm process has entered mass production on schedule this quarter, with momentum at the advanced-node level continuing to build. According to Economic Daily News, sources say that because its 2nm yields have exceeded expectations, the company’s 1.4nm advanced process fab in Central Taiwan Science Park could also see an accelerated rollout. The new fab is expected to complete risk production by the end of 2027, with volume production targeted for 2028.

As the report indicates, the fab began foundation piling work in early November. More recently, tenders for the Central Utility Plant (CUP) have been completed, and bidding for the main fab construction is expected to begin soon.

TSMC’s Central Taiwan Fab Moves to 1.4nm, 1nm Reportedly Possible

The report notes that the Central Taiwan Science Park Administration said TSMC confirmed during a land-lease briefing a shift from the originally planned 2nm process to a 1.4nm process or an even more advanced node. Industry sources cited by the report also say that 1nm process could potentially be deployed at the Central Taiwan Science Park fab earlier than expected.

TSMC plans to introduce its 2nm and 1.6nm processes at its Arizona fabs, while prioritizing 1.4nm production in Taiwan, the report indicates. As a result, once the Central Taiwan Science Park fab enters volume production, it is expected to become the world’s largest manufacturing base for AI and HPC chips.

The new Central Taiwan Science Park fab complex is planned to include four fab buildings and an office facility, with total investment estimated at around NT$1.5 trillion and initial annual revenue expected to exceed NT$500 billion, as the report highlights.

TSMC Accelerates Advanced Process Timelines in Arizona

The foundry giant has also been pushing ahead with advanced process manufacturing in the U.S. According to Economic Daily News, sources say that the second fab at TSMC’s Arizona site could reach 3nm volume production up to a year earlier than originally planned. The fab had been slated for mass production in 2028, but TSMC may accelerate the timeline to early 2027 or even sometime in 2026, using 3nm technology.

In addition, the report notes that the third Arizona fab could begin volume production of 2nm and A16 processes as early as around 2028. The progress of both fabs would be at least four quarters ahead of the company’s original targets.

Read more

(Photo credit: TSMC)

Please note that this article cites information from TSMC and Economic Daily News.