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TrendForce

[News] ASE Reportedly Raises Advanced Packaging Quotes by More Than 20% in Latest AI-Driven Price Hike [News] Musk’s TeraFab Lands First Major Hire as 18-Year Intel Veteran With 18A Experience Joins as Director [Insights] Memory Spot Price Update: DRAM Spot Prices See Gains in Low-Density DDR4 and DDR3 Amid Sideways Market [News] Passive Component Prices Rise as YAGEO Reportedly Begins Broadest Capacitor Hike in Years on July 1 [News] Intel Reportedly Breaks Ground on Santa Clara Expansion for Next-Gen EUV Mask Capacity [News] World’s First Mass-Production Line for 6-/8-Inch Homoepitaxial Gallium Oxide Wafers Comes Online [News] Samsung Electro-Mechanics Lands KRW 450B 1-Year MLCC Contract as AI Spurs Long-Term Agreements [News] Raw Material Inflation Deepens: FULLTECH Hikes Glass Fiber Cloth Prices Up to 30%; VPEC Adjusts Epi Wafer Prices [News] Samsung Reportedly Restarts 1.4nm Push, Targets 2029 Mass Production to Close Gap with TSMC, Intel [News] ByteDance Reportedly Eyes Next-Gen In-House CPU for 2H27 Mass Production; May Partner With Qualcomm [News] Samsung, SK hynix 800 Trillion Won Expansion Strains Chipmaking Tool Supply, Potentially Pressures TSMC, Intel [News] Goertek-Backed 12-Inch AR Optical Wafer Fab Commenced Production [News] China Signs First Domestic Ultra Wide Bandgap Semiconductor Full-Chain Project [News] Samsung, SK hynix, Micron Face U.S. Class-Action Lawsuit Over Alleged DRAM Supply Manipulation [News] Korea’s High-Purity CO₂ Inventory Reportedly Falls Below One Month; Samsung, SK hynix Under Pressure [News] TSMC’s 2Q Margins Reportedly Near 70% amid Strong 3/5nm Demand, 3Q Revenue Seen Growing Over 10% [Sponsored Content] Where Do You Stand as AI Reshapes Industries? [News] Mapping the Micro LED Optical Interconnect Ecosystem [News] Asian Memory Makers Turn to U.S. Capital Markets: SK hynix and Kioxia Advance ADR Plans [News] Lenovo Reportedly Sees Higher Memory Prices Becoming the New Normal Into 2030 [News] TSMC on Terafab: No Shortcuts in Foundry; Confirms Next-Gen LPU Project amid Samsung Rivalry [News] TSMC N3 Tightens on AI Demand; Arizona 2nd Fab 3nm Volume Production in 2H27, Kumamoto in 2028 [News] TSMC Sees 2Q Sales Up 10% QoQ to $40.2B; Margins Rise to 65.5%–67.5%, Capex at Top End of $52–56B [News] TSMC 1Q26 Net Income Soars 58% YoY to NT$572.5B Record, EPS NT$22.08; Gross Margin Beats Forecast at 66.2% [News] Tesla AI5 Reportedly Uses SK hynix Memory, Samsung LPDDR5X; Samsung SF2T Process Applied Ahead of AI6 [News] TSMC 1Q Profit Seen Up ~50% to Record; Meta–Broadcom AI Chips Reportedly Target 2nm, CoWoS-L in 1H27 [News] San’an Announced Three Advances in Optical Communications Business [News] Intel Reportedly to Brief Staff on TeraFab Involvement in Coming Weeks, While Key Foundry Details Remain Limited [News] ASML Raises 2026 Sales Outlook to €36B–€40B on Memory, Logic Demand; South Korea Share Hits 45% [News] Chinese Startup Dishan Reportedly Develops 2nm AI Chip in Prototype Verification; Foundry Access Uncertain
[News] Samsung Reportedly Lifts HBM4 Logic Die Prices by ...
TrendForce · 2026-04-14 · via TrendForce


Memory is not the only segment where Samsung Electronics is pushing price increases amid surging AI demand. According to Financial News, the chip giant has reportedly raised prices for HBM4 logic dies by around 40–50% since early 2026, signaling a broader normalization of pricing across its semiconductor portfolio.

Financial News reports that the chip—manufactured using Samsung Electronics’s 4nm process—serves as the “brain” of HBM4. Against the backdrop of rapidly rising HBM4 shipments, demand for logic dies has surged in tandem, giving Samsung stronger pricing leverage and driving the reported price increases, the report adds.

The trend, according to Financial News, also reflects that key production lines such as 4nm are already running at full capacity, with Samsung foundry’s overall profitability showing a gradual improvement trend.

Foundry Turnaround Expected in 4Q26

DealSite further notes that improving yields and stabilized performance at Samsung’s 4nm node are beginning to materially reflect HBM4’s impact from this year. The company has adopted a 10nm-class 6th-generation (1c) DRAM core die alongside a 4nm FinFET foundry-based base die in its HBM4 architecture, the report suggests, adding that the base die has already started shipping and is expected to contribute to foundry revenue from the second half of 2026.

Meanwhile, HBM4E—built on the same base die process—is also targeting mass production within 2026, according to DealSite.

DealSite further suggests that in the context of expanding captive demand alongside rising Big Tech reference wins, Samsung’s foundry division is accelerating expectations for an earlier-than-expected turnaround in its non-memory business. According to industry sources cited by the report, the foundry unit could swing to profitability as early as Q4 this year, followed by a more pronounced improvement cycle starting next year.

As a result, the broader non-memory segment—which includes System LSI operations such as mobile application processors (APs) and sensor chips—could see operating losses narrow sharply from an estimated KRW 3–4 trillion in 2026 to around KRW 500 billion in 2027, the report notes.

Notably, TrendForce observed that Samsung is not the only foundry benefiting from high utilization for 4nm: TSMC’s 5/4 nm and below capacity is expected to remain fully utilized through the end of the year, while Samsung Foundry has also seen a notable increase in orders for its 5/4 nm-class modes.

TSMC has therefore raised foundry prices across all nodes at 5/4 nm and below for 2026, and with order visibility extending into 2027, further price increases in subsequent years cannot be ruled out. Samsung similarly informed customers in 4Q25 that it would raise prices for its 5/4 nm foundry services, TrendForce adds.

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(Photo credit: Samsung)

Please note that this article cites information from Financial News and DealSite.