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TrendForce

[News] ASE Reportedly Raises Advanced Packaging Quotes by More Than 20% in Latest AI-Driven Price Hike [News] Musk’s TeraFab Lands First Major Hire as 18-Year Intel Veteran With 18A Experience Joins as Director [Insights] Memory Spot Price Update: DRAM Spot Prices See Gains in Low-Density DDR4 and DDR3 Amid Sideways Market [News] Passive Component Prices Rise as YAGEO Reportedly Begins Broadest Capacitor Hike in Years on July 1 [News] Intel Reportedly Breaks Ground on Santa Clara Expansion for Next-Gen EUV Mask Capacity [News] World’s First Mass-Production Line for 6-/8-Inch Homoepitaxial Gallium Oxide Wafers Comes Online [News] Samsung Electro-Mechanics Lands KRW 450B 1-Year MLCC Contract as AI Spurs Long-Term Agreements [News] Raw Material Inflation Deepens: FULLTECH Hikes Glass Fiber Cloth Prices Up to 30%; VPEC Adjusts Epi Wafer Prices [News] Samsung Reportedly Restarts 1.4nm Push, Targets 2029 Mass Production to Close Gap with TSMC, Intel [News] ByteDance Reportedly Eyes Next-Gen In-House CPU for 2H27 Mass Production; May Partner With Qualcomm [News] Samsung, SK hynix 800 Trillion Won Expansion Strains Chipmaking Tool Supply, Potentially Pressures TSMC, Intel [News] Goertek-Backed 12-Inch AR Optical Wafer Fab Commenced Production [News] China Signs First Domestic Ultra Wide Bandgap Semiconductor Full-Chain Project [News] Samsung, SK hynix, Micron Face U.S. Class-Action Lawsuit Over Alleged DRAM Supply Manipulation [News] Korea’s High-Purity CO₂ Inventory Reportedly Falls Below One Month; Samsung, SK hynix Under Pressure [News] TSMC’s 2Q Margins Reportedly Near 70% amid Strong 3/5nm Demand, 3Q Revenue Seen Growing Over 10% [Sponsored Content] Where Do You Stand as AI Reshapes Industries? [News] Mapping the Micro LED Optical Interconnect Ecosystem [News] Asian Memory Makers Turn to U.S. Capital Markets: SK hynix and Kioxia Advance ADR Plans [News] Lenovo Reportedly Sees Higher Memory Prices Becoming the New Normal Into 2030 [News] TSMC on Terafab: No Shortcuts in Foundry; Confirms Next-Gen LPU Project amid Samsung Rivalry [News] TSMC N3 Tightens on AI Demand; Arizona 2nd Fab 3nm Volume Production in 2H27, Kumamoto in 2028 [News] TSMC Sees 2Q Sales Up 10% QoQ to $40.2B; Margins Rise to 65.5%–67.5%, Capex at Top End of $52–56B [News] TSMC 1Q26 Net Income Soars 58% YoY to NT$572.5B Record, EPS NT$22.08; Gross Margin Beats Forecast at 66.2% [News] Tesla AI5 Reportedly Uses SK hynix Memory, Samsung LPDDR5X; Samsung SF2T Process Applied Ahead of AI6 [News] TSMC 1Q Profit Seen Up ~50% to Record; Meta–Broadcom AI Chips Reportedly Target 2nm, CoWoS-L in 1H27 [News] San’an Announced Three Advances in Optical Communications Business [News] Intel Reportedly to Brief Staff on TeraFab Involvement in Coming Weeks, While Key Foundry Details Remain Limited [News] ASML Raises 2026 Sales Outlook to €36B–€40B on Memory, Logic Demand; South Korea Share Hits 45% [News] Chinese Startup Dishan Reportedly Develops 2nm AI Chip in Prototype Verification; Foundry Access Uncertain
[News] ASUS to Raise Prices on Selected PC Lines from Jan...
2025-12-31 · via TrendForce


With memory prices surging, PC makers are accelerating price increases. Dell is said to have kicked off the latest round by lifting prices across its commercial portfolio from December 17, with increases ranging from 10% to 30%, as reported by Business Insider.

Notably, ASUS is now poised to follow suit, becoming the first PC vendor to raise prices in the new year, with the adjustment set to take effect on January 5, 2026, according to a notice obtained by industry sources.

ASUS explained in the notice that structural shifts in the global supply chain are driving unprecedented cost pressure on key components — especially memory (DRAM) and storage such as NAND and SSDs. The company attributed the increase to capacity realignments, heavier spending on advanced processes, and booming AI demand, which together are creating a structural supply gap now rippling through system costs across the industry.

The company said it will begin rolling out targeted price adjustments across parts of its product portfolio starting January 5, 2026, in a move aimed at safeguarding supply stability and maintaining product quality.

The move may be arriving slightly ahead of schedule, but it is hardly unexpected. As reported earlier by Commercial Times, Taiwan’s Acer and ASUS have both acknowledged that passing on soaring memory costs has become an industry-wide consensus. The market now widely expects that, starting January 2026, the MSRP for both consumer and business PCs will fully reflect the rising component costs, the report added.

ASUS Co-CEO Samson Hu told Commercial Times that memory prices are unlikely to ease before the first half of next year, reinforcing the rationale behind the price adjustments. He added that ASUS plans to dynamically adjust its product mix, specifications, and pricing based on market conditions, channel demand, and consumer needs, taking action at the most strategic moment.

Rising Memory Costs Threaten Notebook Shipments

The impact of rising memory costs on PC prices is one to watch closely. TrendForce’s latest analysis shows that, amid a sluggish economic recovery and cautious consumer spending, surging memory prices are squeezing notebook brands’ profit margins and limiting their pricing flexibility. As a result, TrendForce has revised its 2026 global notebook shipment forecast, now projecting a 5.4% year-on-year decline — down from the previous estimate of a 2.4% drop — totaling roughly 173 million units.

If memory price increases fail to ease significantly by the second quarter of 2026, and brands are unable to fully pass on higher costs, demand for entry-level and consumer notebooks could weaken further. Under this scenario, TrendForce warns that full-year 2026 shipments could fall as much as 10.1% year-on-year.

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(Photo credit: ASUS)

Please note that this article cites information from Business Insider and Commercial Times.