As the HBM4 race heats up, earlier reports from outlets like SeDaily indicate that both Samsung Electronics and SK hynix have started delivering paid final HBM4 samples to NVIDIA. Riding the wave of strong demand, Etnews reports that Samsung plans to ramp up its HBM production capacity by 50% in 2026.

While Samsung remains tight-lipped on specific plans to meet surging demand, Etnews reports the company aims to boost HBM production to around 250,000 wafers per month by the end of 2026—a roughly 47% increase from the current 170,000 wafers.

For context, the report explains that Samsung’s current capacity is roughly on par with SK hynix at 160,000–170,000 wafers per month, though actual output has lagged due to challenges in meeting the demand from NVIDIA.

According to Etnews, Samsung’s investment will involve converting existing lines and expanding the new Pyeongtaek 4 (P4) line. The report cites sources saying major facility investments could begin as early as next month, with key HBM manufacturing equipment reportedly in the final stages of testing.

Another source notes that Samsung’s recent HBM investment is centered on HBM4. SeDaily reported earlier that Samsung, along with SK hynix, has begun delivering paid final samples to NVIDIA, signaling performance is close to customer specs and negotiations are in a pre-contract phase. The final hurdle remains quality qualification, with volumes and pricing expected to be set in Q1 2026.

TrendForce adds that a definitive outcome will only become clear in the mid-to-late part of the quarter, once contracts are formally finalized.

Amid rising prices across both its DRAM and NAND lines, Samsung is staging a strong comeback from earlier challenges, set to close 2025 well above market expectations. According to the Korea Economic Daily, internal projections for Q4 indicate an operating profit exceeding KRW 20 trillion—over $14 billion at current exchange rates—about 30% higher than the average analyst forecast.

SK hynix Gears up for HBM4 Production

On the other hand, according to The Elec, SK hynix will start commercial production at its new M15X fab four months ahead of schedule, kicking off 1b DRAM output for HBM4 in February.

The fab was originally set for wafer insertion in June, the report notes, with initial production expected at around 10,000 wafers per month and plans to scale severalfold by the end of 2026.

Read more

• [News] SK hynix, Samsung Reportedly Deliver Paid HBM4 Samples to NVIDIA Ahead of 1Q26 Contracts
• [News] Samsung HBM4 Reportedly Beats Expectations in Broadcom Test, Set to Lead 2026 Google TPU Supply

(Photo credit: Samsung)