BAE Systems has demonstrated that its Endura system-on-chip (SoC) processor can withstand both natural space radiation and the extreme radiation conditions associated with strategic missions, marking a step toward more resilient space electronics.

The company said the Endura SoC successfully completed strategic radiation-hardened testing, validating its ability to operate in environments where conventional commercial processors would be vulnerable to radiation-induced failures.

Developed using BAE Systems’ radiation-hardened 45-nanometer (RH45 nm) technology, the processor is designed for satellites and other spacecraft that require high reliability while maintaining lower size, weight and power requirements.

The technology was built on GlobalFoundries’ commercial 45 nm silicon-on-insulator manufacturing platform at the company’s New York fabrication facility, enabling secure domestic production for aerospace and defense applications.

Built for space

“This milestone positions the Endura SoC as a leading high-performance processor for the space community,” said Joe Dziezynski, Space Systems product line director at BAE Systems. “Leveraging commercial foundry technology, Endura delivers a smaller, lower-power and more cost-effective solution for missions requiring survivability in harsh radiation.”

Space electronics are continuously exposed to radiation from solar activity and cosmic rays, which can damage circuits, corrupt memory or cause processors to malfunction. Radiation-hardened chips are specially designed to continue operating in these environments, making them critical for satellites, military spacecraft and deep-space missions.

Unlike conventional commercial processors, radiation-hardened chips are engineered to resist single-event upsets and cumulative radiation damage that can disrupt onboard computing. This helps spacecraft maintain reliable operation during long-duration missions where repairing failed hardware is often impossible.

According to BAE Systems, the latest testing also demonstrates that its RH45 technology can improve the survivability of other space electronics, including single-board computers.

The Endura SoC combines general-purpose processing, networking, secure boot capabilities and integrated Level 1 and Level 2 cache. It also incorporates field-programmable gate array (FPGA) components that can be configured for mission-specific computing tasks while accelerating data input and output.

Faster space computing

“GlobalFoundries’ facility in Malta, New York, is a cornerstone of trusted U.S. semiconductor manufacturing, providing the secure, domestic foundational technologies needed for mission-critical aerospace and defense applications,” said Ezra Hall, senior director of aerospace and defense at GlobalFoundries.

“Working with the U.S. government, GF and BAE Systems are extending strategic manufacturing and technology advancements to address the evolving needs for resilient, trusted and scalable microelectronics.”

BAE Systems said the processor is being integrated into its next-generation Endura product family, which is intended to support both high-reliability Class A missions and lower-cost Class C and D space missions.

The company added that Endura products are designed to deliver improvements in processing performance, power efficiency and size while supporting a broad range of spacecraft applications.

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