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Toshiba Releases 2:1 Multiplexer / 1:2 Demultiplexer Swit...
Philippe Nicolas · 2026-06-22 · via StorageNewsletter

RAIDON

Suitable for Industrial applications with operating temperatures up to 125°C

This is a Press Release edited by StorageNewsletter.com on June 22, 2026 at 2:00 pm

Toshiba Electronic Devices & Storage Corp. has launched TDS5C212MX and TDS5B212MX, 2:1 multiplexer (Mux) / 1:2 demultiplexer (De‑Mux) switches that support next-gen high-speed interfaces such as PCIe 6.0 [1] and USB4 Version 2.0 [2]. Volume shipments of the new products already started.As servers, industrial testers, robots, and PCs continue to evolve, demand is growing for reliable switching of ultra‑high‑speed, wide‑bandwidth differential signals – such as PCIe 6.0 and USB4 Version 2.0 – within increasingly limited board space. Toshiba’s new products meet this requirement with a proprietary SOI process (TarfSOI) [3] that achieves an industry‑leading [4] -3‑dB bandwidth (differential) of 34GHz (typ.) for TDS5C212MX and 29GHz (typ.) for TDS5B212MX. These wide bandwidths significantly suppress signal waveform distortion and help to improve reliability in high-speed data transmission.Toshiba 1200 628 Switches Tds5These devices can be used as 2-input/1-output Mux switches or 1-input/2-output De-Mux switches in high-speed differential signal applications, such as PCIe 6.0 and USB4 Version 2.0. They support sharing of a single high-speed interface among multiple devices and switching signal paths according to system requirements.

Both products feature pin layouts optimized for high-frequency characteristics. In particular, TDS5C212MX minimizes signal path length to reduce reflections and losses, improving high-speed signal integrity. They both support an operating temperature range of -40°C to 125°C, making them suitable for industrial applications.

Toshiba will continue to contribute to next‑gen systems by developing high‑performance, highly reliable analog switches that support the evolution of high‑speed interfaces.

Applications

  • Industrial testers, robots
  • PCs, servers, mobile devices, wearable devices, etc.

Supported Interfaces

  • PCIe series: PCIe 6.0 / 5.0 / 4.0 / 3.0
  • CXL series: CXL 3.0 / 2.0 / 1.0
  • USB series: USB4 Version 2.0 / USB4 / USB 3.2 Gen2×1 / Gen1×1
  • Thunderbolt series: Thunderbolt 5 / 4 / 3 / 2
  • DisplayPort series: DisplayPort 2.0 / 1.4 / 1.3 / 1.2

Features

  • High -3-dB bandwidth (differential) supporting high‑speed differential signals such as PCIe 6.0 and USB4 Version 2.0
    TDS5C212MX: 34GHz (typ.)
    TDS5B212MX: 29GHz (typ.)
  • Wide operating temperature range: -40°C to 125°C

[1] Next-gen interface standard defined by PCI-SIG that doubles the data transfer rate to 64GT/s compared with PCIe 5.0
[2] Interface standard defined by USB-IF that supports high-speed data transfer of up to 80Gb/s
[3] TarfSOI (Toshiba advanced RF SOI): TarfSOI is an SOI-CMOS (silicon-on-insulator-complementary metal oxide semiconductor) front-end process technology developed by Toshiba for high-frequency semiconductor applications
[4] As a 2:1 Mux / 1:2 De-Mux switch. Based on Toshiba survey as of May 2026

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