Samsung Electronics today announced a significant advancement in Fixed Wireless Access (FWA) technology, successfully validating 5G Power Class 1 (PC1) capability through its virtualized RAN (vRAN) and the Qualcomm Dragonwing™ FWA Gen 4 Platform featuring the Qualcomm® X85 Modem-RF chipset. This reflects Samsung and Qualcomm Technologies Inc.’s commitment to enhancing FWA performance and coverage to ensure more seamless connectivity across congested urban environments, as well as remote or low-signal areas.

Power Class (PC) is a 3GPP^TM1 standard that defines how strongly a device can transmit its signal, with a lower-class number indicating a higher output power. Higher power is critical for improving signal quality and extending network reach, especially useful in harder-to-reach areas. At the same time, the rise of data- and time-intensive services like physical AI, autonomous systems and AR/VR is driving a surge in upload demand. PC1 is expected to be a key factor in elevating the FWA user experience by offering fiber-like uplink speeds and reducing bottlenecks, which will support the demands of evolving technologies and next-generation AI services.

The test was completed at Samsung’s R&D lab using its fully software-driven vRAN solution, 3.7GHz Massive MIMO radios and Qualcomm Technologies’ X85 chipset-equipped test device. Key technical findings include:

• Up to 10x Uplink Throughput Enhancement: During the lab test, the application of PC1 technology achieved up to 10 times higher uplink throughput at the cell-edge compared to PC1.5 standard. For users, this means smoother video calls and faster file upload in areas where signals are typically weakest, like remote regions or isolated corners of buildings.

• 1.4x Coverage Expansion: In addition to performance improvements, PC1 is capable of extending the coverage range by up to 40% more compared to PC1.5. This allows individual devices to stay connected across a much wider area, maintaining strong signals even when farther away from a base station.

“As networks continue to evolve and support more AI-driven services, high-performance wireless infrastructure becomes more essential,” said Eun Yong Kim, Vice President and Head of Air Technology, Networks Business at Samsung Electronics. “This validation highlights Samsung’s readiness to bring advanced technologies to market with partners like Qualcomm Technologies, empowering operators to deliver faster, more efficient networks that are ready to handle everything from seamless industrial data transmission to increasingly data-heavy user experiences.”

“With its higher transmission power, PC1 technology expands both the performance and reach of FWA devices,” said Gautam Sheoran, Senior Vice President & General Manager, Connectivity, Broadband and Networking at Qualcomm Technologies, Inc. “Our collaboration with Samsung demonstrates how ecosystem innovation is driving smarter, more capable networks — bringing stronger, more reliable connectivity to every day users.”

Building on the successful lab test, the companies have also recently conducted field tests on a U.S. Tier 1 operator’s network, with the feature expected to be commercially available in 2027.

Samsung Networks has pioneered the successful delivery of 5G end-to-end solutions, including chipsets, radios and cores. Through ongoing research and development, Samsung is driving the industry to advance 5G networks and paving the way for 6G and beyond with its market-leading product portfolio, from purpose-built RAN, vRAN, Open RAN, AI RAN and cloud-native core to private network solutions and AI-powered automation tools. The company currently provides innovative network solutions to mobile operators that deliver boundless connectivity to hundreds of millions of users worldwide.

1. 3GPP is a trade mark of ETSI ↩︎