M31 Collaborates with TSMC to Achieve Tapeout of eUSB2V2 on N2P Process, Advancing Design IP Ecosystem
PRNewsWire
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2026-04-23
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via The Tech Buzz - Press Releases
HSINCHU, April 23, 2026 /PRNewswire/ -- M31 Technology (M31), a global silicon intellectual property (IP) provider, today announced at the TSMC 2026 North America Technology Symposium that its eUSB2V2
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