Japan’s state-backed foundry Rapidus plans to begin production of 2nm-class semiconductors in the second half of its fiscal year 2027, with full-scale production expected in 2028, according to a business plan submitted to Japan’s Ministry of Economy, Trade and Industry.
Manufacturing will take place at the company’s Chitose facility in Hokkaido, which is designed to support both front-end wafer fabrication and back-end processes, including dicing and packaging. Rapidus has stated that integrating these stages into a single facility will help streamline production and shorten turnaround times between processes and packaging.