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Latest from Tom's Hardware in Semiconductors

Post-silicon era gets closer as industry giants crack the 2D transistor scaling bottleneck with breakthrough tech — imec, ASML, and TSMC fab complementary 2D-material transistors at 50nm pitch on a 300mm wafer Intel Intel’s performance-enhanced 18A-P process enters risk production — drop-in 18A upgrade promises 9% performance improvement at iso-power, cuts thermal resistance by 40% Chinese fab SMIC TSMC says panel packaging won Analyzing TSMC's fab expansion roadmap — multi-fab N2 ramp, CoWoS, SoIC, and uncorking bottlenecks Chinese startup claims photonic chip production without DUV lithography, says nanoimprint process cuts costs by 90%… ASML becomes Europe's most valuable company ever as analysts bet on higher EUV output — its market cap hit… Samsung shows first HBM5 mockup with Heat Path Block cooling — thermal race with SK hynix shaping up Seven hospitalized after toxic gas fire at SK hynix advanced memory plant — Cheongju 4th campus incident today led… TikTok owner ByteDance is reportedly developing its own custom AI CPUs — company looks to ease China's… Trailing-edge foundry roadmaps for GlobalFoundries, UMC, and SMIC — mature node chipmakers each pursue differing… Chinese university builds 3D chip design tool tailored to Huawei's ‘LogicFolding’ architecture — 3D design delivers increased performance and better thermal management China adds homegrown AI chips to 'secure and reliable' procurement list for the first time — nine options added as move away from Nvidia continues SK hynix unveils 'iHBM' thermal architecture that cools AI memory at the source — integrated cooling elements inside HBM interface cut thermal resistance by 30%, target next-gen HBM5 accelerators and dense AI data centers Imec builds world's first High-NA EUV-fabricated quantum dot qubit device — breakthrough could pull quantum computing onto the same manufacturing roadmap as next-gen AI processors, compressing timelines Huawei claims sanctions-busting breakthrough with 1.4nm-class chips by 2031, claims 55% higher transistor density — firm claims new LogicFolding chip architecture can bypass EUV restrictions, introduces 'Tau Scaling Law' to replace Moore's Law Samsung's $400,000 payout for memory workers sparks revolt as other divisions get only $4,000, fueling intentional production slowdowns — internal resentment disrupts packaging operations, major AI chip project decisions to a complete halt The custom AI ASIC state of play (May 2026) — Broadcom deals, Google TPUs, Meta MTIA & beyond AMD begins production ramp of 256-core EPYC Venice — first 2nm HPC chip claims 70% performance leap Intel kicks off development on next-decade 10A and 7A process technologies — 14A node remains on track for… SMIC founder and AMEC CEO urge Chinese fabs to test domestic chipmaking tools on active production lines — equipment makers post record revenue but falling margins Russia’s Mikron is selling framed test wafers with up to 120,000 processors as souvenirs — 12 designs, priced around $170 each, sold alongside $2 vials of cleanroom air Trump calls $14 billion Taiwan arms deal a 'negotiating chip' with China after Xi said Taiwan issue could lead to 'clashes and even conflicts' — Trump says 'Taiwan would be very smart to cool it a little bit' Leading-edge foundry roadmaps for TSMC, Intel and Samsung — outlining the path to 1.4nm nodes and beyond TSMC allocates $20 billion to Arizona expansion — project faces water and labor shortages, complicated by visa… NASA partners with Microchip to build next-generation spaceflight chips with 100x the power of current offerings — chip designed to withstand radiation for extended missions on the Moon and Mars Intel, SK hynix shares surge following reports of chip packaging partnership — SK is said to be testing… Apple reportedly strikes deal for Intel to make some of its chips — two tech giants reached a preliminary… Global semiconductor sales hit nearly $300 billion in Q1 2026 — chips are on track to top $1 trillion for this…
TSMC CEO C.C. Wei says, ‘It will be a long time before we...
Jowi Morales · 2026-06-05 · via Latest from Tom's Hardware in Semiconductors

TSMC CEO C.C. Wei has told company shareholders that it still won’t be able to completely address the production demands for AI chips in the years to come. Even though the company has opened multiple fabs across the world, including the one in Arizona, the insatiable demand for the most advanced processors means that there still isn’t enough production capacity to go around for all customers. Bloomberg reports that the additional capacity that is expected to go online in the U.S. is still not enough to feed the increasing demand from hyperscalers.

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“It will be a long time before we can meet customer demand,” C.C. Wei said. Despite that, TSMC is still forecasting a 30% increase in sales this year. It’s also not taking advantage of the supply bottleneck, with Wei adding that the company will avoid sudden price hikes similar to the memory and storage chip market industry’s experience to ensure business stability.

Hyperscaler buildouts are expected to hit $725 billion just this year. And unless the AI bubble bursts, demand is only expected to go up every year. TSMC has been building many new fabs in Taiwan, the U.S., and other parts of the world. But building these manufacturing plants would take years, and it seems that semiconductor manufacturing demand would outpace supply if the current AI infrastructure build-out continues.

TSMC Arizona’s manufacturing capacity has been sold out through 2027 since early 2025, showing the massive demand for the company’s output. The company is continually expanding this site, too, with its Taiwan headquarters authorizing a $20 billion capital injection last month to continue the development of Fab 21 phase 2. It’s expected that this would allow the company to start mass producing 3nm chips in Arizona in 2027, which is about a year earlier than the original 2028 launch date. There have also been reports of additional fabs and other units, bringing the total Arizona site to 12 fabs, 4 packaging facilities, and an R&D center.

These production shortages mean that TSMC can expect that their expansion plans will have customers once they’re completed. However, this is also an opportunity for Intel, which is trying to win customers for its 18A and 14A processes. Both Apple and Nvidia are reportedly considering Intel for some of their 2028 chip production, and sources say that the former has already reached a preliminary agreement with Team Blue.

The lack of availability has also led Elon Musk into semiconductor manufacturing. Even though building chips is a totally different beast when compared to building electric cars and even rocket ships, it seems that the billionaire founder is ready to take on the challenge with Terafab. It seems that he’s pretty serious, too, with his team already in talks with various suppliers and that they’re willing to pay a premium to ensure priority.

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Jowi Morales is a tech enthusiast with years of experience working in the industry. He’s been writing with several tech publications since 2021, where he’s been interested in tech hardware and consumer electronics.