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Latest from Tom's Hardware in Semiconductors

Post-silicon era gets closer as industry giants crack the 2D transistor scaling bottleneck with breakthrough tech — imec, ASML, and TSMC fab complementary 2D-material transistors at 50nm pitch on a 300mm wafer Intel Intel’s performance-enhanced 18A-P process enters risk production — drop-in 18A upgrade promises 9% performance improvement at iso-power, cuts thermal resistance by 40% Chinese fab SMIC TSMC says panel packaging won Analyzing TSMC's fab expansion roadmap — multi-fab N2 ramp, CoWoS, SoIC, and uncorking bottlenecks Chinese startup claims photonic chip production without DUV lithography, says nanoimprint process cuts costs by 90%… TSMC CEO C.C. Wei says, ‘It will be a long time before we can meet customer demand’ — tells shareholders that he will keep prices stable, refrain from implementing price hikes Samsung shows first HBM5 mockup with Heat Path Block cooling — thermal race with SK hynix shaping up Seven hospitalized after toxic gas fire at SK hynix advanced memory plant — Cheongju 4th campus incident today led… TikTok owner ByteDance is reportedly developing its own custom AI CPUs — company looks to ease China's… Trailing-edge foundry roadmaps for GlobalFoundries, UMC, and SMIC — mature node chipmakers each pursue differing… Chinese university builds 3D chip design tool tailored to Huawei's ‘LogicFolding’ architecture — 3D design delivers increased performance and better thermal management China adds homegrown AI chips to 'secure and reliable' procurement list for the first time — nine options added as move away from Nvidia continues SK hynix unveils 'iHBM' thermal architecture that cools AI memory at the source — integrated cooling elements inside HBM interface cut thermal resistance by 30%, target next-gen HBM5 accelerators and dense AI data centers Imec builds world's first High-NA EUV-fabricated quantum dot qubit device — breakthrough could pull quantum computing onto the same manufacturing roadmap as next-gen AI processors, compressing timelines Huawei claims sanctions-busting breakthrough with 1.4nm-class chips by 2031, claims 55% higher transistor density — firm claims new LogicFolding chip architecture can bypass EUV restrictions, introduces 'Tau Scaling Law' to replace Moore's Law Samsung's $400,000 payout for memory workers sparks revolt as other divisions get only $4,000, fueling intentional production slowdowns — internal resentment disrupts packaging operations, major AI chip project decisions to a complete halt The custom AI ASIC state of play (May 2026) — Broadcom deals, Google TPUs, Meta MTIA & beyond AMD begins production ramp of 256-core EPYC Venice — first 2nm HPC chip claims 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— chip designed to withstand radiation for extended missions on the Moon and Mars Intel, SK hynix shares surge following reports of chip packaging partnership — SK is said to be testing… Apple reportedly strikes deal for Intel to make some of its chips — two tech giants reached a preliminary… Global semiconductor sales hit nearly $300 billion in Q1 2026 — chips are on track to top $1 trillion for this… Apple considering Intel and Samsung for US chip production, report claims — consumer electronics giant looks to… China pushes for 70% homegrown silicon wafer use as domestic firm ramps up 12-inch production — government seeking to localize critical chip supply chain amid AI boom and export restrictions ASML's roadmap for chipmaking lithography tools examined — from DUV to Low-NA, High-NA, Hyper-NA, and beyond Intel details 18A-P process node, touts higher performance, lower power, and better thermals — 9% more… TSMC SoIC 3D stacking roadmap outlines path from 6-micron pitches today to 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full control over Fab 34 The global helium shortage is a direct threat to the chipmaking supply chain — disruption impacts critical processes, high-capacity HDDs, and alternative supplies are plagued by delays TSMC industrial espionage saga heading to verdict next month in unprecedented Taiwan National Security Act case — former engineer accused of stealing 2nm technical info, faces a total of up to 20 years in prison if found guilty Analyzing Elon Musk's TeraFab — A step towards Tesla and SpaceX's partial vertical integration, or an… Chinese chip industry leaders admit the country lags five to ten years behind in AI data center chips — AI demand is straining equipment and talent supply Air Liquide opens Taiwan factory as helium shortage tightens around chip makers — 200 specialized helium containers stranded near the Strait of Hormuz Elon Musk's Terafab semiconductor project could cost $5 trillion, Bernstein claims — herculean effort would cost more than 70% of the total yearly US 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semiconductor fabs construction manager — Elon Musk's ambitious Terafab project begins How Nvidia's $20 billion Groq 3 LPU deal reshapes the Nvidia Vera Rubin Platform — Samsung 4nm process serves as bedrock for SRAM-based AI accelerator chip Researchers reach superconductivity at ambient pressure, record high temperature — milestone of -122°C reached by using pressure quenching, still 140 degrees off room temperature target AMD and Samsung ink memory supply memorandum for EPYC and Instinct products — unprecedented deal also includes… Meta's new MTIA lineup joins hyperscalers' unified push for dedicated inferencing chips — companies diversify AI chips in effort to diversify from sole reliance on Nvidia Intel's roadmaps examined — 14A, Nova Lake, Diamond Rapids & AI accelerator push STMicro to deploy humanoid robots to its legacy fabs in Europe — over 100 humanoid robots to be used for routine and physically demanding tasks in fight for efficiency Elon Musk says his chipmaking 'Terafab 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power of Nvidia H200 with lower power envelope ISSCC 2026: AMD discloses how the Instinct MI355X doubled per-CU throughput despite lower compute unit count — 'We are actually matching the performance of the more expensive and complex GB200' Rapidus secures $1.7 billion from Japan’s government and private investors for 2nm chip production — company says it is in active discussions with more than 60 potential customers Imec's new post-exposure bake method speeds up EUV chipmaking tools, boosting production for the most advanced chips — 20% gain in photoresist improvement from increased oxygen concentration Intel Foundry boss leaves for Qualcomm — Naga Chandrasekaran takes charge of the unit Chipmakers still suffering from rare earth shortages, says report — US-China trade truce apparently still hasn’t eased pressures despite agreement taking place in October last year China to increase leading-edge chip output by 5x in two years, report claims — aims to lift 7nm and 5nm production to 100,000 wafers per month, targeting half a million monthly by 2030 US gov't warned Nvidia CEO Jensen Huang, Tim Cook, and Lisa Su that China could invade Taiwan by 2027 — Apple CEO reportedly said he sleeps 'with one eye open' ASML makes breakthrough in EUV chipmaking tech, plans to increase speed by 50% by 2030 — new 1,000-watt light source fires three lasers at 100,000 tin droplets every second The state of China's decade-long semiconductor push: still a decade behind, despite hundreds of billions spent and significant progress — examining the original 'Made in China 2025' initiative TSMC considers an additional $100 billion investment into Arizona fabs to bolster American chipmaking efforts — move would help TSMC's chips avoid tariffs due to local production Rapidus targets mass 2nm chip production in 2027, quadruples capacity ramp up — company plans to scale to 25,000… Tachyum forced to shutter R&D office due to unpaid rent, wages, and taxes — firm still claims forthcoming Prodigy chip will have a 21x performance leap on Nvidia Rubin Ultra Cadence embeds AI 'super agent' to assist engineers when designing EDA tools — company aims for ‘over a trillion transistors’ by 2030, with AI helping to debug and verify complex projects Memory hoarding and skyrocketing prices hit entry-level electronics demand, foundry orders — China's top chipmaker points to supply chain pressures squeezing out consumers U.S. lawmakers demand sales ban on chipmaking tools to China — bipartisan group targets ASML's Dutch exports of lithography machines used to create advanced chips Memory makers are set to earn $551 billion from the AI boom, twice as much as contract chip manufacturers — forecasts suggest that 2026 revenue will skyrocket thanks to data center demand
ASML becomes Europe's most valuable company ever as analysts bet on higher EUV output — its market cap hit…
Luke James · 2026-06-07 · via Latest from Tom's Hardware in Semiconductors
ASML
(Image credit: ASML)

ASML closed Wednesday, June 3rd, as the most valuable company in European history, reaching a market cap of $668 billion and passing the $650 billion record Novo Nordisk set in June 2024. The Dutch firm, which is the sole supplier of the extreme ultraviolet (EUV) lithography machines that TSMC, Samsung, and Intel use to print leading-edge logic, rose after JPMorgan and Morgan Stanley published near-identical notes arguing it can manufacture far more machines than the market had assumed.

The two banks raised their price targets on the same day, JPMorgan to €1,900 from €1,515 and Morgan Stanley to €1,660 from €1,400, both keeping Overweight ratings. JPMorgan analyst Sandeep Deshpande argued that ASML can deliver more than 110 low-NA EUV systems without adding new building capacity, well above the roughly 90 units investors had previously cited as the maximum and above the company's own near-term output.

That output is mission-critical for the chip industry because EUV remains a severe chokepoint on advanced chip supply. Every wafer of leading-edge silicon used to train and run AI models passes through an ASML scanner at some stage, so more machines shipping translates directly into more capacity for the fabs downstream.

Morgan Stanley said its greater confidence in near-term shipments stemmed from comments at ASML's April annual general meeting, where the company outlined an expansion at the Brainport Industries Campus in Eindhoven, with construction set to begin in the third quarter of 2026. The bank cautioned that the campus "needs to be the start of a multi-phase build-out" to fully alleviate capacity concerns.

ASML’s record ironically sits below the bar set by the companies ASML supplies. Its market cap remains short of the trillion-dollar mark that several U.S. chip firms have cleared, and the stock's roughly 50% gain this year has trailed the broader semiconductor sector, which has run far hotter on AI demand. ASML had already passed SAP as Europe's largest listed company and is now worth more than the next two European firms, HSBC and Roche, combined.

And while the company holds a monopoly, its long-term dominance isn’t guaranteed; several efforts are currently taking aim at it. Substrate, a San Francisco startup backed by Peter Thiel's Founders Fund and the CIA-linked In-Q-Tel, has raised $100 million for a particle-accelerator X-ray lithography system that it claims can pattern 2nm-class features at roughly $10,000 per wafer against the $100,000 it models for leading-edge EUV. Canon is also shipping commercial nanoimprint tools, while Nikon has entered with a lower-end product, and China has touted a workaround to ASML's equipment.

None of these is likely to replace an EUV scanner in high-volume logic anytime soon, where ASML's tools run from roughly $235 million for a low-NA system to about $380 million for the High-NA EXE:5200B that Intel installed late last year for its 14A node.

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Asked about rivals by TechCrunch last month, ASML CEO Christophe Fouquet said the gap between wanting the technology and having it remains vast, adding that "when you start from scratch, the challenge is enormous."

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Luke James is a freelance writer and journalist.  Although his background is in legal, he has a personal interest in all things tech, especially hardware and microelectronics, and anything regulatory.