Intel CFO Dave Zinsner told the Morgan Stanley TMT conference last month that Intel Foundry is "close to closing some deals that are in the billions per year in terms of revenue" on advanced packaging alone, with EMIB-T, the next-generation variant of Intel's embedded bridge technology, driving customer interest as TSMC's CoWoS-L capacity remains structurally oversubscribed.

That tech, EMIB-T, which adds through silicon vias (TSVs) to the bridge, is expected to enter production fab rollout this year and addresses the limitations that have kept standard EMIB out of high-power AI accelerator sockets: HBM 4 class power delivery and large package scaling.