SK hynix Inc. announced today the launch of the iHBM solution that embeds integrated cooling elements (ICEs) within the high-bandwidth memory (HBM) package for next-generation HBM products. Heat management has become a critical challenge as HBM technology advances with higher stacking and faster speeds to cater to the surging demand for AI data processing. The efficient management of power density in the Die-to-Die Physical Layer (D2D PHY)—the interface connecting HBM and GPU—has emerged as a key factor defining the competitiveness of next-generation HBM.

With the iHBM solution, the company has taken a structural approach to addressing the heat management issue. Existing HBM products rely on an indirect cooling method that draws heat away through the core die. In contrast, the iHBM solution places ICEs directly in the D2D PHY area where heat concentration is the highest, creating an additional heat dissipation path. This latest heat management solution helps reduce thermal resistance by 30% and enables chips to operate stably even in high-temperature and high-pressure conditions.

The company's mass-production capabilities also serves as a key advantage. SK hynix's Wafer Level Packaging (WLP) process, based on its market-proven Mass Reflow Molded Underfill (MR-MUF) technology, enables stable high-volume production of iHBM-equipped chips. Furthermore, the solution offers high design compatibility with existing System-in-Package (SiP) architectures, allowing customers to adopt the new thermal technology with minimal design adjustments.

Through the iHBM solution, slated for deployment in next-generation HBM products including HBM5, SK hynix aims to increase the stability and operational efficiency of HPCs, AI data centers by meeting heat management standards required in high-density and high-bandwidth environments.

"iHBM is an optimal solution for thermal management, combining our memory design capabilities with advanced packaging technology," said Kangwook Lee, Senior Vice President and Head of PKG Development at SK hynix, adding "The company will cement its AI memory leadership by taking preemptive steps to offer values needed in the AI environment for its customers."