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The company said that in partnership with Broadcom, the chip was designed and reached manufacturing tape-out in just nine months, making it the fastest ASIC development cycle among advanced semiconductors. Jalapeno is part of a compute platform that will span multiple generations of these chips. The platform is being designed for initial deployment toward the end of 2026. There are no technical details about the chip itself, except that it's a contemporary multi-chip module with an interposer, a large and centrally-located logic tile, flanked by eight HBM3E stacks.
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