Compared to their non-pro variants, Duronaut Pro and Hydronaut Pro offer increased thermal conductivity while otherwise meeting the specific requirements of their predecessors. Duronaut Pro was developed for particularly high long-term stability, while Hydronaut Pro can be used as a thermal paste in industrial systems thanks to its silicone-free carrier structure.
At first glance, the temperature differences measured under laboratory conditions between the Pro pastes and the non-pro variants appear marginal. However, when considering how little room for improvement still exists in thermal paste development with regard to temperature, these improvements in thermal conductivity must be considered significant.
In the following graphics, thermal conductivity is given as the temperature difference (delta Kelvin) between the heat source (30 x 30 mm contact surface, 240 watts heat flow) and the cooler (contact pressure: 300 N force (48 PSI)). The lower the value, the better the thermal conductivity. Specifying the temperature delta while taking contact pressure into account is a more accurate comparison method for thermal pastes than stating thermal conductivity in watts per meter and Kelvin (W/(m × K)).
The following video shows in detail how we test our thermal paste and which factors influence the thermal conductivity of a thermal paste:
Here is an overview of the thermal conductivity of all Thermal Grizzly thermal pastes:
Duronaut Pro
Duronaut Pro is a high-end thermal paste whose development focused not only on optimized thermal conductivity compared to Duronaut, but also on particularly high long-term stability. The name "Duronaut" is derived from the English term "durability." This exceptionally high long-term stability is achieved through a specially developed silicone oil as well as the combination of aluminium micropowder and zinc oxide nanopowder in different forms.
The optimized particle shape and size minimize the so-called pump-out effect and ensure excellent adhesion of the paste to the surface. This results in an extremely low thermal contact resistance. The optimized particle shapes and sizes also make it possible to apply Duronaut Pro in a very thin layer, which additionally ensures excellent adhesion of the paste to the surface. This results in an extremely low thermal contact resistance. The minimal layer thickness during application, combined with the high conductivity of the aluminium micropowder and zinc oxide nanopowder mixture, enables very efficient heat transfer between the heat source, such as a CPU, and the cooler.
Features:
Hydronaut Pro
Hydronaut Pro can be used as a thermal paste in industrial systems thanks to its silicone-free carrier structure. In many thermal pastes, silicone-based oils, such as siloxanes, are used as the carrier fluid or as part of the matrix. Under thermal stress, especially during temperature changes, changes can occur in the paste, such as bleeding and the displacement of the paste from the contact zone. Repeated temperature fluctuations as well as micro-movements between the CPU IHS and the cooler base can intensify this effect. The mechanical displacement of the paste from the contact surface is referred to as the pump-out effect.
In normal PC use, this is generally uncritical. In industrial applications, however, escaping silicone-based oil may be undesirable, especially if adjacent materials or sealing materials, such as certain EPDM or NBR seals, are incompatible with silicone oils. This can lead to swelling or changes in the material properties. The product is RoHS-compliant and designed as an easy-to-apply thermal interface medium for demanding users.
Features:
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